JPWO2020080206A5 - - Google Patents

Claims (9)

(A) The following general formula (1):

[In the formula, X ¹ is a tetravalent organic group, Y ¹ is a divalent organic group, and R ¹ and R ² are independently monovalent organic groups. ] A polyimide precursor having a unit structure represented by;
And (B) the following general formula (30):

[In the formula, Z ¹ and Z ² are independent of each other.
Hydrogen atom, halogen atom, hydroxy group, mercapto group, carboxy group, cyano group, formyl group, haloformyl group, sulfo group, nitro group, nitroso group, oxo group, tioxy group,
An alkyl, alkoxy, or alkylsulfanil group having 1 to 10 carbon atoms which may be substituted,
Represents an alkenyl, alkynyl, or alkoxycarbonyl group having 2 to 10 carbon atoms which may be substituted, or an amino, imino, or carbamoyl group which may be substituted.
Z ¹ and Z ² may be bonded to each other to form a ring that may contain a heteroatom, may have a substituent, or may be fused, and the ring may be an aromatic ring. When

Indicates a conjugated double bond in which the HOOC is in the ortho position with respect to COOH, except when the ring is an aromatic ring.

Shows a cis-type double bond for HOOC and COOH. ]
Carboxylic acid compound represented by
Including
Optionally, (P) contains a polymer compound other than the polyimide precursor (A).
The carboxylic acid compound ( B) may be chemically bonded to a polymer compound (P) other than the polyimide precursor (A) and / or the polyimide precursor (A) via Z ¹ or Z ² . ,
Polyamic acid ester resin composition. The resin composition according to claim 1, wherein Z ¹ and Z ² of the general formula (30) are hydrogen atoms or alkyl groups having 1 to 10 carbon atoms which may be substituted. The carboxylic acid compound ( B) has the following general formula (31):

[In the formula, R ³³ to R ³⁶ are independent of each other.
Hydrogen atom, halogen atom, hydroxy group, mercapto group, carboxy group, cyano group, formyl group, haloformyl group,
Sulfon group, nitro group, nitroso group, oxo group, tioxy group,
An alkyl, alkoxy, or alkylsulfanil group having 1 to 6 carbon atoms which may be substituted,
Represents an alkenyl, alkynyl, or alkoxycarbonyl group having 2 to 6 carbon atoms which may be substituted, or an amino, imino, or carbamoyl group which may be substituted.
R ³³ and R ³⁴ , R ³⁴ and R ³⁵ , or R ³⁵ and R ³⁶ may be bonded to each other and contain a heteroatom, may have a substituent, or may be fused. May be formed. ]
The resin composition according to claim 1 , which is a carboxylic acid compound represented by. The resin composition according to any one of claims 1 to 3, wherein the carboxylic acid compound ( B) is contained in an amount of 0.1 part by mass to 10 parts by mass with respect to 100 parts by mass of the polyimide precursor (A). thing. The resin composition according to any one of claims 1 to 4, further comprising 1 part by mass to 50 parts by mass of the (C) crosslinkable compound with respect to 100 parts by mass of the polyimide precursor (A). A resin film, which is a fired product of a coating film of the polyamic acid ester resin composition according to any one of claims 1 to 5. The following steps:
(1) A step of applying the polyamic acid ester resin composition according to any one of claims 1 to 5 onto a substrate to form a polyamic acid ester resin layer on the substrate.
(2) A step of exposing the polyamic acid ester resin layer and
(3) A step of developing the polyamic acid ester resin layer after the exposure to form a relief pattern, and
(4) A method for manufacturing a substrate with a cured relief pattern, which comprises a step of heat-treating the relief pattern to form a cured relief pattern. A substrate with a cured relief pattern manufactured by the method according to claim 7. A semiconductor device including a semiconductor element and a cured film provided on an upper portion or a lower portion of the semiconductor element, wherein the cured film is the cured relief pattern according to claim 8.