JPWO2019204382A5 - - Google Patents
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- JPWO2019204382A5 JPWO2019204382A5 JP2020558011A JP2020558011A JPWO2019204382A5 JP WO2019204382 A5 JPWO2019204382 A5 JP WO2019204382A5 JP 2020558011 A JP2020558011 A JP 2020558011A JP 2020558011 A JP2020558011 A JP 2020558011A JP WO2019204382 A5 JPWO2019204382 A5 JP WO2019204382A5
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- JP
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- nucleation layer
- boron
- molybdenum
- substrate
- layer
- Prior art date
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- 230000006911 nucleation Effects 0.000 claims description 32
- 238000010899 nucleation Methods 0.000 claims description 32
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 27
- 229910052750 molybdenum Inorganic materials 0.000 claims description 27
- 239000011733 molybdenum Substances 0.000 claims description 27
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 25
- 229910052796 boron Inorganic materials 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 15
- 238000000921 elemental analysis Methods 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims 5
- 125000001309 chloro group Chemical group Cl* 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229910015221 MoCl5 Inorganic materials 0.000 claims 1
- 229910015686 MoOCl4 Inorganic materials 0.000 claims 1
- GICWIDZXWJGTCI-UHFFFAOYSA-I molybdenum pentachloride Chemical compound Cl[Mo](Cl)(Cl)(Cl)Cl GICWIDZXWJGTCI-UHFFFAOYSA-I 0.000 claims 1
- SFPKXFFNQYDGAH-UHFFFAOYSA-N oxomolybdenum;tetrahydrochloride Chemical compound Cl.Cl.Cl.Cl.[Mo]=O SFPKXFFNQYDGAH-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
Description
ホウ素核形成層がモリブデン膜を作成する方法のバージョンで実質的に消費されるという言及は、1つ以上のホウ素核形成層が1つ以上のモリブデン核形成層で置き換えられたサンプルの断面のSEM分析によって視認可能なホウ素がないことを指し得る。実質的に消費されるとは、付加的または代替的に、5重量%未満、または場合により1重量%未満のホウ素がモリブデン膜に、及び任意の下にあるモリブデン核形成層に存在することを指し得る。ホウ素含有量は、基板からの膜の酸溶解によって決定され、元素分析によって測定されることが可能である。実質的に消費されるとは、MoCl5から700℃で類似の基板上に蒸着された類似の厚さ(±10%)のモリブデン層の±20%以内の室温(RT、20℃~23℃)で測定された抵抗率を有するモリブデン膜も指すことができる。
The mention that the boron nucleation layer is substantially consumed in the version of the method for creating molybdenum films is evidenced by the SEM of a cross-section of a sample in which one or more boron nucleation layers are replaced by one or more molybdenum nucleation layers. Analysis may refer to the absence of visible boron. Substantially consumed additionally or alternatively means that less than 5% by weight, or optionally less than 1% by weight, of boron is present in the molybdenum film and in any underlying molybdenum nucleation layer. It can be pointed out. Boron content is determined by acid dissolution of the film from the substrate and can be measured by elemental analysis. Substantially consumed means MoCl within ±20% of a molybdenum layer of similar thickness (±10%) deposited on a similar substrate at 5 to 700°C at room temperature (RT, 20°C to 23°C). ) can also refer to a molybdenum film with a resistivity measured at .
Claims (10)
基板上のホウ素含有核形成層とモリブデン及び塩素原子を含有する分子を含む蒸気組成物とを反応させることであって、基板が450℃から550℃の間の温度であり、当該反応により、モリブデン層が元素分析による5重量%未満のホウ素を含むように、ホウ素含有核形成層が消費され、ホウ素含有核形成層の実質的に全てが、基板の上でモリブデン核形成層と置き換わる、反応させることと、
基板の上のモリブデン核形成層の上にさらなるホウ素含有核形成層を堆積することであって、基板が300℃から550℃の間の温度である、堆積することと、
さらなるホウ素含有核形成層とモリブデンおよび塩素原子を含有する分子を含む蒸気組成物とを反応させることであって、基板が450℃から550℃の間の温度であり、当該反応により、さらなるホウ素含有核形成層の少なくとも一部が消費され、消費された少なくとも一部のさらなるホウ素含有核形成層が、さらなるモリブデン核形成層に置き換わる、反応させることと、
を含み、
さらなるホウ素含有核形成層の堆積された厚さが、基板の上のホウ素含有核形成層の堆積された厚さよりも薄い、方法。 A method for manufacturing a molybdenum layer, the method comprising:
reacting a boron-containing nucleation layer on a substrate with a vapor composition comprising molecules containing molybdenum and chlorine atoms, the substrate being at a temperature between 450°C and 550°C; The boron-containing nucleation layer is consumed such that the layer contains less than 5% by weight boron by elemental analysis, and substantially all of the boron-containing nucleation layer is combined with the molybdenum nucleation layer on the substrate. to replace, to react,
depositing a further boron-containing nucleation layer over the molybdenum nucleation layer on the substrate, the substrate being at a temperature between 300°C and 550°C;
reacting the further boron-containing nucleation layer with a vapor composition comprising molecules containing molybdenum and chlorine atoms , the substrate being at a temperature between 450°C and 550°C; reacting, wherein at least a portion of the nucleation layer is consumed and at least some of the consumed additional boron- containing nucleation layer is replaced by an additional molybdenum nucleation layer;
including;
A method, wherein the deposited thickness of the further boron-containing nucleation layer is less than the deposited thickness of the boron-containing nucleation layer over the substrate.
第1の期間にわたり基板の上にホウ素含有核形成層を蒸着させることと、
基板上のホウ素含有核形成層とモリブデン及び塩素原子を含有する分子を含む蒸気組成物とを反応させることであって、基板が450℃から550℃の間の温度であり、当該反応により、モリブデン層が元素分析による5重量%未満のホウ素を含むように、ホウ素含有核形成層が消費され、ホウ素含有核形成層の実質的に全てが、基板の上でモリブデン核形成層と置き換わる、反応させることと、
第2の期間にわたり基板の上のモリブデン核形成層の上にさらなるホウ素含有核形成層を蒸着させることであって、基板が300℃から550℃の間の温度であり、第2の期間が第1の期間よりも短い、蒸着させることと、
さらなるホウ素含有核形成層とモリブデンおよび塩素原子を含有する分子を含む蒸気組成物とを反応させることであって、基板が450℃から550℃の間の温度であり、当該反応により、さらなるホウ素含有核形成層の少なくとも一部が消費され、消費された少なくとも一部のさらなるホウ素含有核形成層が、さらなるモリブデン核形成層に置き換わる、反応させることと、
を含む、方法。 A method for manufacturing a molybdenum layer, the method comprising:
depositing a boron-containing nucleation layer over the substrate for a first period of time;
reacting a boron-containing nucleation layer on a substrate with a vapor composition comprising molecules containing molybdenum and chlorine atoms, the substrate being at a temperature between 450°C and 550°C; the boron-containing nucleation layer is consumed such that the layer contains less than 5% by weight boron by elemental analysis, and substantially all of the boron-containing nucleation layer is replaced with a molybdenum nucleation layer on the substrate; to react and
depositing a further boron-containing nucleation layer over the molybdenum nucleation layer on the substrate over a second time period, wherein the substrate is at a temperature between 300°C and 550°C; depositing for a period shorter than 1;
reacting the further boron-containing nucleation layer with a vapor composition comprising molecules containing molybdenum and chlorine atoms , the substrate being at a temperature between 450°C and 550°C; reacting, wherein at least a portion of the nucleation layer is consumed and at least some of the consumed additional boron- containing nucleation layer is replaced by an additional molybdenum nucleation layer;
including methods.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/958,568 | 2018-04-20 | ||
US15/958,568 US10453744B2 (en) | 2016-11-23 | 2018-04-20 | Low temperature molybdenum film deposition utilizing boron nucleation layers |
PCT/US2019/027792 WO2019204382A1 (en) | 2018-04-20 | 2019-04-17 | Low temperature molybdenum film depositon utilizing boron nucleation layers |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2021522408A JP2021522408A (en) | 2021-08-30 |
JPWO2019204382A5 true JPWO2019204382A5 (en) | 2023-12-18 |
JP7425744B2 JP7425744B2 (en) | 2024-01-31 |
Family
ID=68240342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020558011A Active JP7425744B2 (en) | 2018-04-20 | 2019-04-17 | Low-temperature molybdenum film deposition using boron nucleation layer |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7425744B2 (en) |
KR (1) | KR20200135547A (en) |
CN (1) | CN112041980A (en) |
WO (1) | WO2019204382A1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6620723B1 (en) * | 2000-06-27 | 2003-09-16 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
US6974768B1 (en) * | 2003-01-15 | 2005-12-13 | Novellus Systems, Inc. | Methods of providing an adhesion layer for adhesion of barrier and/or seed layers to dielectric films |
US10109534B2 (en) * | 2014-03-14 | 2018-10-23 | Applied Materials, Inc. | Multi-threshold voltage (Vt) workfunction metal by selective atomic layer deposition (ALD) |
TWI720106B (en) * | 2016-01-16 | 2021-03-01 | 美商應用材料股份有限公司 | Pecvd tungsten containing hardmask films and methods of making |
WO2018013778A1 (en) * | 2016-07-14 | 2018-01-18 | Entegris, Inc. | Cvd mo deposition by using mooc14 |
-
2019
- 2019-04-17 CN CN201980027078.3A patent/CN112041980A/en active Pending
- 2019-04-17 KR KR1020207033045A patent/KR20200135547A/en not_active IP Right Cessation
- 2019-04-17 JP JP2020558011A patent/JP7425744B2/en active Active
- 2019-04-17 WO PCT/US2019/027792 patent/WO2019204382A1/en active Application Filing
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