JPWO2019013174A1 - Cyclic olefin resin composition - Google Patents

Abstract

An object of the present invention is to provide a resin composition capable of producing a molded article having good heat resistance, light resistance, and moist heat resistance.
The present invention is a resin composition containing a cyclic olefin resin, which is a compound (A) having a predetermined group, a compound (B) having a predetermined group, an ultraviolet light absorber, and a condensed phosphate ester, The cyclic olefin-based resin contains a block copolymer containing styrene in the main chain, and the cyclic olefin-based resin has a load deflection measured at 1.8 MPa for a test piece which has not been annealed according to a method in accordance with ISO 75-1, 2. The temperature is 125 ° C. or higher, and the content of the compound (A) and the compound (B) is: part by mass of the compound (A) with respect to 100 parts by mass of the cyclic olefin resin ≦ 100 parts by mass of the cyclic olefin resin The resin composition which satisfy | fills the mass part of said compound (B) with respect to is provided.

Description

  The present invention relates to cyclic olefin resin compositions.

  The cyclic olefin resin is a resin having a cyclic olefin skeleton in the main chain, and is a resin having many features such as high transparency, high thermal deformation temperature, low birefringence, hydrolysis resistance, and the like. For this reason, cyclic olefin resin is used in various fields where these characteristics are required.

  In particular, cyclic olefin resins are used as raw materials for lenses, light guide plates, optical devices such as diffraction gratings and the like because they can exhibit high heat resistance, high transparency, and low birefringence. For example, Patent Document 1 discloses that a cyclic olefin resin containing a specific repeating unit at a predetermined ratio can be used as a raw material for an optical lens or the like.

Unexamined-Japanese-Patent No. 2013-18962

  However, there has been a demand for development of a cyclic olefin-based resin-containing composition from which molded articles having higher balance, good heat resistance, light resistance, and moisture heat resistance and less generation of yellowing and cracks, etc. can be obtained.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a resin composition capable of producing a molded article having good heat resistance, light resistance, and moisture and heat resistance. is there.

  The present inventors have intensively studied to solve the above problems. As a result, according to the composition which contains a specific component with cyclic olefin resin which has predetermined load deflection temperature, it discovers that the above-mentioned subject can be solved and came to complete the present invention. More specifically, the present invention provides the following.

(1) cyclic olefin resin,
A compound (A) having a 3,5-di-tert-butyl-4-hydroxyphenyl group,
A compound (B) having a 2,2,6,6-tetramethyl-4-piperidyl group or a 1,2,2,6,6-pentamethyl-4-piperidyl group;
UV absorber,
Condensed phosphate ester,
A resin composition comprising a block copolymer containing styrene in the main chain,
The cyclic olefin-based resin has a deflection temperature under load of at least 125 ° C. at 1.8 MPa measured on a test piece which has not been subjected to annealing treatment by a method in accordance with ISO 75-1, 2.
The content of the compound (A) and the compound (B) is: part by mass of the compound (A) based on 100 parts by mass of the cyclic olefin resin ≦ mass of the compound (B) based on 100 parts by mass of the cyclic olefin resin A resin composition that fills parts.

  (2) The content of the ultraviolet absorber and the compound (B) is, based on 100 parts by mass of the cyclic olefin resin, based on 100 parts by mass of the ultraviolet absorber based on 100 parts by mass of the cyclic olefin resin The resin composition as described in (1) which satisfy | fills a mass part.

  (3) The resin composition according to (1) or (2), wherein the cyclic olefin resin comprises an addition copolymer of norbornene and ethylene.

  (4) The resin according to any one of (1) to (3), wherein the compound (A) contains pentaerythritol tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] Composition.

(5) The compound (B) is a fatty acid (C12-21 and C18 unsaturated) 2,2,6,6-tetramethyl-4-piperidyl ester, bis (2,2,6,6-tetramethyl-4 -Piperidyl) sebacate, poly [{6-morpholino-1,3,5-triazine-2,4-diyl} {(1,2,2,6,6-pentamethyl-4-piperidyl) imino} hexamethylene {( 1,2,2,6,6-pentamethyl-4-piperidyl) imino}], and poly [{6- (1,1,3,3-tetramethylbutyl) amino-1,3,5-triazine- 2,4-diyl} {(2,2,6,6-tetramethyl-4-piperidyl) imino} hexamethylene {(2,2,6,6-tetramethyl-4-piperidyl) imino}], and From the compound of formula (1) The resin composition in any one of (1) to (4) containing 1 or more selected from the group which consists of.

  (6) The UV absorber is selected from the group consisting of 2- (2H-benzotriazol-2-yl) -4-6-bis (1-methyl-1-phenylmethyl) phenol and 2,2'-methylenebis [6- (2H). -Benzotriazol-2-yl) -4- (1,1,3,3-tetramethylbutyl) phenol], 2- [4,6-bis (2,4-dimethylphenyl) -1,3,5- Triazin-2-yl] -5- (octyloxy) phenol, bis {2- [4- (4,6-diphenyl-1,3,5-triazin-2-yl) -3-hydroxyphenoxy] ethyl} dodecane The resin composition according to any one of (1) to (5), comprising one or more selected from the group consisting of geoate and tetra-ethyl-2,2- (1,4-phenylene-dimethylidene) -bismalonate object.

  (7) The resin composition according to any one of (1) to (6), wherein the condensed phosphoric acid ester contains 1,3 phenylene bis (di-2,6 xylenyl phosphate).

  (8) The block copolymer has a styrene content of 45% by mass to 70% by mass, and includes a hydride of a block copolymer of styrene and butadiene and / or isoprene. The resin composition in any one of (7).

  ADVANTAGE OF THE INVENTION According to this invention, the resin composition which can manufacture a molded article in which all of heat resistance, light resistance, and heat-and-moisture resistance are favorable is provided.

  Hereinafter, embodiments of the present invention will be described. The present invention is not limited to the following embodiments.

<Resin composition>
The resin composition of the present invention is a cyclic olefin resin having a deflection temperature under load of at least 125 ° C. at 1.8 MPa, which is measured on a test piece which has not been subjected to annealing treatment, in accordance with ISO 75-1, 2. Compound (A) having a 5-di-tert-butyl-4-hydroxyphenyl group and a 2,2,6,6-tetramethyl-4-piperidyl group or 1,2,2,6,6-pentamethyl- It is a resin composition containing the compound (B) which has 4-piperidyl group, a ultraviolet absorber, condensation phosphoric acid ester, and the block copolymer which contains styrene in a principal chain. Hereinafter, the structure of the resin composition of this invention is demonstrated.

(Cyclic olefin resin)
The cyclic olefin-based resin in the present invention is a method according to ISO 75-1, 2 and the deflection temperature under load at 1.8 MPa measured on a test piece which has not been annealed (hereinafter referred to as “load deflection temperature of cyclic olefin-based resin It is not particularly limited as long as it is a polymer or copolymer containing a structural unit derived from a cyclic olefin in its main chain) at 125 ° C. or higher. When the deflection temperature under load of the cyclic olefin resin contained in the resin composition is 125 ° C. or more, sufficient heat resistance and moist heat resistance can be imparted to a molded article obtained from the resin composition. The lower limit value of the deflection temperature under load of the cyclic olefin resin is preferably 125 ° C. or more from the viewpoint of easily suppressing yellowing of a molded article obtained from the resin composition. The upper limit of the deflection temperature under load of the cyclic olefin resin is preferably 170 ° C. or less, more preferably 165 ° C. or less. In addition, when using 2 or more types of cyclic olefin resin together in this invention, load deflection temperature means the load deflection temperature of the resin mixture which mixed all the cyclic olefin resin.

  The cyclic olefin resin having the above deflection temperature under load, for example, adjusts the ratio of monomers (for example, norbornene, ethylene etc.) constituting the cyclic olefin resin, or blends cyclic olefin resins having different glass transition points It can be produced by carrying out.

  As a polymer or copolymer containing a structural unit derived from cyclic olefin in the main chain, for example, an addition polymer of cyclic olefin or a hydrogenated product thereof, an addition copolymer of cyclic olefin and α-olefin or hydrogen thereof An additive etc. can be mentioned. The cyclic olefin resins can be used alone or in combination of two or more.

  Moreover, as said cyclic olefin resin, what the unsaturated compound which has a polar group further grafts and / or copolymerizes in the said polymer or said copolymer which contains the structural unit derived from cyclic olefin in a principal chain is also mentioned. Be

  As a polar group, a carboxyl group, an acid anhydride group, an epoxy group, an amide group, an ester group, a hydroxyl group etc. can be mentioned, for example, As a unsaturated compound which has a polar group, (meth) acrylic acid, maleic acid Acid, maleic anhydride, itaconic anhydride, glycidyl (meth) acrylate, alkyl (meth) acrylate (C1-C10) ester, alkyl maleate (C1-C10) ester, (meth) acrylamide, (meth) ) Acrylic acid 2-hydroxyethyl and the like can be mentioned.

  Moreover, commercially available resin can also be used as said copolymer used as cyclic olefin resin in this invention. Examples of commercially available cyclic olefin-based resins include TOPAS (registered trademark) (manufactured by TOPAS Advanced Polymers), APEL (registered trademark) (manufactured by Mitsui Chemicals, Inc.), Zeonex (registered trademark) (manufactured by Nippon Zeon), Zeonor (registered trademark) (manufactured by Nippon Zeon Co., Ltd.), Arton (registered trademark) (manufactured by JSR Corporation), and the like can be mentioned.

（式中、Ｒ^１〜Ｒ^１２は、それぞれ同一でも異なっていてもよく、水素原子、ハロゲン原子、及び、炭化水素基からなる群より選ばれるものであり、
Ｒ^９とＲ^１０、Ｒ^１１とＲ^１２は、一体化して２価の炭化水素基を形成してもよく、
Ｒ^９又はＲ^１０と、Ｒ^１１又はＲ^１２とは、互いに環を形成していてもよい。
また、ｎは、０又は正の整数を示し、
ｎが２以上の場合には、Ｒ^５〜Ｒ^８は、それぞれの繰り返し単位のなかで、それぞれ同一でも異なっていてもよい。）Particularly preferable examples of the addition copolymer of cyclic olefin and α-olefin include [1] structural unit derived from α-olefin having 2 to 20 carbon atoms, and [2] represented by the following general formula (I) And a copolymer containing a structural unit derived from cyclic olefin.

(Wherein, R ^{1 to} R ¹² may be the same or different, and are selected from the group consisting of a hydrogen atom, a halogen atom, and a hydrocarbon group,
R ⁹ and R ¹⁰ and R ¹¹ and R ¹² may be united to form a divalent hydrocarbon group,
R ⁹ or R ¹⁰ and R ¹¹ or R ¹² may form a ring with each other.
And n is 0 or a positive integer,
When n is 2 or more, R ^{5 to} R ⁸ may be identical to or different from one another among the respective repeating units. )

[[1] α-olefin of 2 to 20 carbon atoms]
The C2-C20 alpha-olefin is not particularly limited. For example, the thing similar to Unexamined-Japanese-Patent No. 2007-302722 can be mentioned. In addition, these α-olefins may be used alone or in combination of two or more. Of these, ethylene alone is most preferred.

[[2] cyclic olefin represented by formula (I)]
The cyclic olefin represented by formula (I) will be described. R ^{1 to} R ¹² in the general formula (I) may be the same or different, and are selected from the group consisting of a hydrogen atom, a halogen atom, and a hydrocarbon group. As a specific example of cyclic olefin shown by General formula (I), the thing similar to Unexamined-Japanese-Patent No. 2007-302722 can be mentioned.

  These cyclic olefins may be used alone or in combination of two or more. Among these, bicyclo [2.2.1] hept-2-ene (common name: norbornene) is preferably used alone.

  The polymerization method of the [1] α-olefin having 2 to 20 carbon atoms and the cyclic olefin represented by the general formula (I) and the hydrogenation method of the obtained polymer are not particularly limited. Can be carried out according to known methods.

  Further, the polymerization catalyst to be used is also not particularly limited, and a cyclic olefin resin can be obtained by a known method using a conventionally known catalyst such as Ziegler-Natta type, metathesis type or metallocene type catalyst.

  Moreover, the hydrogenation method of the obtained cyclic olefin resin is also not particularly limited, and conventionally known methods can be applied.

  In addition, the range which does not impair the objective of the present invention other than the [1] α-olefin component having 2 to 20 carbon atoms and the [2] cyclic olefin component represented by the general formula (I) Optionally, other copolymerizable unsaturated monomer components may be contained. The unsaturated monomer which may be optionally copolymerized is not particularly limited. For example, a hydrocarbon monomer containing two or more carbon-carbon double bonds in one molecule, etc. Can be mentioned. As a specific example of the hydrocarbon type monomer which contains 2 or more carbon-carbon double bond in 1 molecule, the thing similar to Unexamined-Japanese-Patent No. 2007-302722 can be mentioned.

  Among the above, as the cyclic olefin-based resin in the present invention, an addition copolymer of norbornene and ethylene is particularly preferable from the viewpoint that the effects of the present invention are easily exhibited.

  The lower limit value of the glass transition point of the cyclic olefin resin is not particularly limited, but is preferably 130 ° C. or more, more preferably 145 ° C. or more. It is easy to provide heat resistance to the molded article obtained from a resin composition as it is a range to which the glass transition point of cyclic olefin resin takes such a thing. The upper limit value of the glass transition point of the cyclic olefin resin is not particularly limited, but is preferably 190 ° C. or less, more preferably 185 ° C. or less. It is easy to suppress yellowing of the molded article obtained from a resin composition as it is a range which the glass transition point of cyclic olefin resin takes.

  As the glass transition point (Tg) of the cyclic olefin resin, a value measured under the condition of a temperature increase rate of 20 ° C./min by a DSC method (a method described in ISO 11357-1, -2, -3) is adopted.

  The lower limit value of the content of the cyclic olefin resin is not particularly limited, but it is preferably 65.0% by mass or more, more preferably 95.0% by mass or more in the resin composition. Although the upper limit of content of cyclic olefin resin is not specifically limited, Preferably it is 98.0 mass% or less in a resin composition.

(Compound (A) and Compound (B))
Compound (A) having a 3,5-di-tert-butyl-4-hydroxyphenyl group (hereinafter, also referred to as “compound (A)”), and 2,2,6,6-tetramethyl-4- The compound (B) having a piperidyl group or a 1,2,2,6,6-pentamethyl-4-piperidyl group (hereinafter, also referred to as a “compound (B)”) is a cyclic olefin resin together with a UV absorber described later Heat resistance, light resistance, and moisture and heat resistance can be imparted with good balance to molded articles obtained from the resin composition by blending into the containing composition.

Furthermore, as a result of examination of the present inventor, the contents of compound (A) and compound (B) are satisfied so as to satisfy the following relational expression 1, that is, the contents of compound (A) and the contents of compound (B) By blending so that the content of compound (B) is equal to or greater than the content of compound (A), particularly well-balanced heat resistance, light resistance, and moist heat resistance from the resin composition It has been found that it can be applied to the resulting molded articles.
Mass part of compound (A) to 100 mass parts of cyclic olefin resin ≦ mass part of compound (B) to 100 mass parts of cyclic olefin resin Relational formula 1

  The content of the compound (A) and the compound (B) is not particularly limited as long as the relationship 1 above is satisfied, but the content of the compound (B) is preferably 1 times the content of the compound (A) Or more, more preferably 2 times or more, and further preferably 3 times or more. In addition, the content of the compound (B) may be preferably 5 times or less, more preferably 3 times or less, the content of the compound (A).

  The compound (A) may be a hindered phenol (a compound containing a t-butyl group in the ortho position on both sides with respect to the phenolic hydroxyl group). As a result of the present inventor's investigation, even if one-side hindered phenol (compound containing t-butyl group at only one of the ortho positions on both sides with respect to the phenolic hydroxyl group) instead of the hindered phenol is used, It has been found that heat resistance and light resistance can not be sufficiently imparted to molded articles obtained from the composition.

  The compound (A) is not particularly limited as long as it is a compound having a 3,5-di-tert-butyl-4-hydroxyphenyl group, and examples thereof include monocyclic compounds (eg, 2,6-di-t- Butyl-p-cresol etc.), polycyclic compounds linked by a hydrocarbon group or a group containing a sulfur atom (eg, 4,4′-methylenebis (2,6-di-t-butylphenol), 1,3, 5-trimethyl-2,4,6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene etc., compounds having an ester group or an amide group (eg, n-octadecyl-3- (4) '-Hydroxy-3', 5'-di-t-butylphenyl) propionate, n-octadecyl-2- (4'-hydroxy-3 ', 5'-di-t-butylphenyl) propionate, 1,6- Xandiol-bis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], pentaerythritol tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] , 2- [1- (2-hydroxy-3,5-di-t-pentylphenyl) ethyl] -4,6-di-t-pentylphenyl acrylate, di-n-octadecyl-3,5-di-t -Butyl-4-hydroxybenzyl phosphonate, N, N'-hexamethylene bis (3,5-di-t-butyl-4-hydroxy-dihydrocinnamido), N, N'-ethylene bis [3- (3 5-di-tert-butyl-4-hydroxyphenyl) propionamide], N, N'-tetramethylenebis [3- (3,5-di-tert-butyl-4-hydroxyl) Phenyl) propionamide], N, N'-hexamethylenebis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionamide], N, N'-bis [3- (3,5 And -di-t-butyl-4-hydroxyphenyl) propionyl] hydrazine, 1,3,5-tris (3,5-di-t-butyl-4-hydroxybenzyl) isocyanurate and the like. The compound (A) can be used alone or in combination of two or more.

  Among the above, pentaerythritol tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] is preferable from the viewpoint that the effects of the present invention are easily exhibited.

  The compound (B) is not particularly limited as long as it is a compound having a 2,2,6,6-tetramethyl-4-piperidyl group or a 1,2,2,6,6-pentamethyl-4-piperidyl group. The compound (B) can be used alone or in combination of two or more.

As a compound having a 2,2,6,6-tetramethyl-4-piperidyl group, 2,2,6,6-tetramethyl-4-piperidine stearin, fatty acid (C12-21 and C18 unsaturated) 2,2 , 6,6-Tetramethyl-4-piperidyl ester, poly [{6-morpholino-1,3,5-triazine-2,4-diyl} {(2,2,6,6-tetramethyl-4-piperidyl] ) Imino} hexamethylene {(2,2,6,6-tetramethyl-4-piperidyl) imino}], bis (2,2 ′, 6,6′-tetramethyl-4-piperidyl) sebacate, dimethyl succinate -1- (2-hydroxyethyl) -4-hydroxy-2,2,6,6-tetramethylpiperidine polycondensate, poly [{6- (1,1,3,3-tetramethylbutyl) amino-1 , 3,5- Liazine-2,4-diyl} {(2,2,6,6-tetramethyl-4-piperidyl) imino} hexamethylene {(2,2,6,6-tetramethyl-4-piperidyl) imino}], Tetrakis (2,2,6,6-tetramethyl-4-piperidyl) -1,2,3,4-butanetetracarboxylate, 2,2,6,6-tetramethyl-4-piperidylbenzoate, 1,1 '-(1,2-ethanediyl) bis (3,3,5,5-tetramethylpiperazinone), (mixed 2,2,6,6-tetramethyl-4-piperidyl / tridecyl) -1,2 , 3,4-butane tetracarboxylate, mixed {2,2,6,6-tetramethyl-4-piperidyl / β, β, β ', β'-tetramethyl-3,9- [2,4,- 8,10-tetraoxaspiro (5,5 Undecane] diethyl} -1,2,3,4-butanetetracarboxylate, poly [6-N-morpholine-1,3,5-triazine-2,4-diyl] [(2,2,6,6- Tetramethyl-4-piperidyl) imino] hexamethylene [(2,2,6,6-tetramethyl-4-piperidyl) imide], N, N'-bis (2,2,6,6-tetramethyl-4) -Piperidyl) a condensation product of hexamethylenediamine and 1,2-dibromoethane, [N- (2,2,6,6-tetramethyl-4-piperidyl) -2-methyl-2- (2,2,6 , 6-Tetramethyl-4-piperidyl) imino] propionamide, and compounds represented by the following formula (1), and the like can be given.

  Examples of the compound having a 1,2,2,6,6-pentamethyl-4-piperidyl group include propanedioic acid [{4-methoxyphenyl} methylene] -bis (1,2,2,6,6-pentamethyl- 4-piperidyl) ester, bis- (1,2,6,6-pentamethyl-4-piperidyl) -2- (3,5-di-t-butyl-4-hydroxybenzyl) -2-n-butyl malonate Bis (1,2,2,6,6-pentamethyl-4-piperidyl) {[3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methyl} butyl malonate, bis- ( N-Methyl-2,2,6,6-tetramethyl-4-piperidyl) sebacate, poly [{6-morpholino-1,3,5-triazine-2,4-diyl} {(1,2,2,6 6,6-penta Chill-4-piperidyl) imino} hexamethylene {(1,2,2,6,6-pentamethyl-4-piperidyl) imino}] (mixed 1,2,2,6,6-pentamethyl-4-piperidyl / Tridecyl) -1,2,3,4-butanetetracarboxylate, mixed {1,2,2,6,6-pentamethyl-4-piperidyl / β, β, β ′, β′-tetramethyl-3, 9- [2,4,8,10-Tetraoxaspiro (5,5) undecane] diethyl} -1,2,3,4-butanetetracarboxylate, N, N'-bis (3-aminopropyl) ethylenediamine 2,4-bis [N-butyl-N- (1,2,2,6,6-pentamethyl-4-piperidyl) amino] -6-chloro-1,3,5-triazine condensate etc. Can.

As the compound (B), fatty acids (C12-21 and C18 unsaturated) 2,2,6,6-tetramethyl-4-piperidyl esters, bis, among the above-mentioned ones, in particular, from the viewpoint that the effects of the present invention are easily exhibited. (2,2,6,6-tetramethyl-4-piperidyl) sebacate, poly [{6-morpholino-1,3,5-triazine-2,4-diyl} {(1,2,2,6,6) -Pentamethyl-4-piperidyl) imino} hexamethylene {(1,2,2,6,6-pentamethyl-4-piperidyl) imino}], and poly [{6- (1,1,3,3-tetra] Methylbutyl) amino-1,3,5-triazine-2,4-diyl} {(2,2,6,6-tetramethyl-4-piperidyl) imino} hexamethylene {(2,2,6,6- Tetramethyl-4-piperidyl Imino}], and is preferably 1 or more one of the compounds represented by the following formula (1).

  The content of the compounds (A) and (B) is not particularly limited as long as the relationship 1 above is satisfied. In particular, the lower limit value of the content of the compound (A) is preferably 0.01 parts by mass or more, and more preferably 0.10 parts by mass with respect to 100 parts by mass of the cyclic olefin resin, from the viewpoint of easily achieving the effects of the present invention. Part or more. Although the upper limit of content of a compound (A) is not specifically limited, It is 2.00 mass parts or less with respect to 100 mass parts of cyclic olefin resin. The lower limit value of the content of the compound (B) is preferably 0.01 parts by mass or more, and more preferably 0.10 parts by mass or more, with respect to 100 parts by mass of the cyclic olefin resin. Although the upper limit of content of a compound (B) is not specifically limited, Preferably it is 2.00 mass parts or less with respect to 100 mass parts of cyclic olefin resin.

  The lower limit of the content of the compound (A) is preferably 0.01% by mass or more, more preferably 0.10% by mass or more in the resin composition. The upper limit of the content of the compound (A) is not particularly limited, but it is preferably 2.00% by mass or less in the resin composition. The lower limit of the content of the compound (B) is preferably 0.01% by mass or more, and more preferably 0.10% by mass or more in the resin composition. The upper limit of the content of the compound (B) is not particularly limited, but it is preferably 2.00% by mass or less in the resin composition.

(UV absorber)
The ultraviolet absorber imparts heat resistance, light resistance, and moist heat resistance to the molded article obtained from the resin composition in a well-balanced manner by combining the compound (A) and (B) with the cyclic olefin resin-containing composition. it can.

  The type of UV absorber is not particularly limited, but benzotriazole type UV absorbers (2- (2H-benzotriazol-2-yl) -4-6-bis (1-methyl-1-phenylmethyl) phenol, 2 , 2′-methylenebis [6- (2H-benzotriazol-2-yl) -4- (1,1,3,3-tetramethylbutyl) phenol], etc., triazine UV absorbers (2- [4, 6-Bis (2,4-dimethylphenyl) -1,3,5-triazin-2-yl] -5- (octyloxy) phenol, bis {2- [4- (4,6-diphenyl-1,3 5, 5-Triazin-2-yl) -3-hydroxyphenoxy] ethyl} dodecanedioate, etc., and other UV absorbers (tetra-ethyl-2,2- (1,4-phenylene-dimethylidene)- Sumaroneto, etc.) and the like.

  The ultraviolet absorber may be used alone or in combination of two or more.

  The content of the ultraviolet absorber is not particularly limited. The lower limit of the content of the ultraviolet absorber is preferably 0.01 parts by mass or more, more preferably 100 parts by mass of the cyclic olefin resin, from the viewpoint of easily enhancing heat resistance, light resistance, and moist heat resistance in a well-balanced manner. Is 0.10 parts by mass or more. Although the upper limit of content of a ultraviolet absorber is not specifically limited, It is 2.00 mass parts or less with respect to 100 mass parts of cyclic olefin resin. The lower limit of the content of the ultraviolet absorber is preferably 0.01% by mass or more, and more preferably 0.10% by mass or more in the resin composition. The upper limit of the content of the ultraviolet absorber is preferably 2.00% by mass or less in the resin composition.

From the viewpoint of enhancing heat resistance, light resistance, and moisture heat resistance particularly well with a good balance, the content of the ultraviolet absorber and the compound (B) should satisfy the following relational expression 2, that is, the content of the ultraviolet absorber and It is preferable to combine so that content of a compound (B) may be equal, or content of a compound (B) may become larger than content of a ultraviolet absorber.
Mass part of UV absorber to 100 parts by mass of cyclic olefin resin ≦ mass part of compound (B) to 100 parts by mass of cyclic olefin resin Relational formula 2

  The content of the ultraviolet absorber and the compound (B) is preferably such that the content of the compound (B) is 1 or more times, more preferably 2 or more times, still more preferably 3 times the content of the ultraviolet light absorber It may be more than. The content of the compound (B) may be preferably 5 times or less, more preferably 3 times or less, the content of the ultraviolet light absorber.

(Condensed phosphate ester)
The condensed phosphate ester imparts good light resistance to molded articles obtained from the cyclic olefin resin-containing composition without inhibiting the effects of the compound (A), the compound (B), and the ultraviolet light absorber as described above. It is possible to suppress yellowing of the molded article.

  Specifically, 1,3 phenylene bis (diphenyl phosphate), 1,3 phenylene bis (di-4 methyl phenyl phosphate), 1,3 phenylene bis (di-2,6 xylenyl) as the condensed phosphoric acid ester Phosphate), 1,4 phenylene bis (diphenyl phosphate), 1,4 phenylene bis (di-2,6 xylenyl phosphate), 4,4 'biphenylene bis (diphenyl phosphate), 4,4' biphenylene bis (di-) 2, 6 xylenyl phosphates); hydroquinone phosphates corresponding to these phosphates, biphenol phosphates; condensed phosphate esters such as biphenol-A phosphates.

  Among the above, 1,3 phenylene bis (di-2,6 xylenyl phosphate) is preferable from the viewpoint of particularly easily enhancing light resistance.

  The condensed phosphoric acid ester can be used alone or in combination of two or more.

  The content of the condensed phosphoric acid ester is not particularly limited. From the viewpoint of easily imparting light resistance to a molded article obtained from the resin composition, the lower limit value of the content of the condensed phosphate is preferably 0.05 parts by mass or more with respect to 100 parts by mass of the cyclic olefin resin, More preferably, it is 0.10 mass part or more. Although the upper limit of content of condensation phosphoric acid ester is not specifically limited, It is 1.00 mass parts or less with respect to 100 mass parts of cyclic olefin resin. The lower limit of the content of the condensed phosphate is preferably 0.05% by mass or more, and more preferably 0.10% by mass or more in the resin composition. The upper limit value of the content of the condensed phosphoric acid ester is preferably 1.00% by mass or less in the resin composition.

(Block copolymer containing styrene in main chain)
The block copolymer containing styrene in the main chain (hereinafter, also referred to as “the block copolymer in the present invention”) does not inhibit the action of the above compound (A), compound (B) and ultraviolet absorber In addition, good moisture and heat resistance can be imparted to a molded article obtained from the cyclic olefin-based resin-containing composition, and cracking in a molded article under moist and heat resistant environment can be suppressed.

  The block copolymer in the present invention is not particularly limited as long as it contains styrene in the main chain, and those having an aromatic vinyl polymer block (hard segment) and a rubber block (soft segment), or the like A water additive etc. can be used. The hard segment and the soft segment may each be formed of one type of monomer, or may be formed of a plurality of monomers. The block copolymer in the present invention can be used singly or in combination of two or more.

  The aromatic vinyl compound (monomer) forming the hard segment contains at least substituted or unsubstituted styrene. By containing substituted or unsubstituted styrene as the aromatic vinyl compound, it is possible to suppress the formation of cracks in the molded product when the molded product obtained from the resin composition is subjected to wet heat treatment. In addition, since the substituted or unsubstituted styrene is contained as the aromatic vinyl compound, the refractive index of the block copolymer in the present invention can be easily brought close to the refractive index of the cyclic olefin resin, and can be obtained from the resin composition. It is easy to increase the transparency of molded articles.

  In addition, when the content of the repeating unit derived from the aromatic vinyl compound in the block copolymer in the present invention is large, the molded product obtained from the resin composition is cracked in the inside of the resin molded product when subjected to wet heat treatment Is easy to enter. On the other hand, if the content is too small, the difference between the refractive index of the block copolymer in the present invention and the refractive index of the cyclic olefin resin as a matrix becomes too large, so from the dispersion of the block copolymer in the present invention The refraction and scattering of light may increase, and the transparency of the molded body may be impaired. Therefore, the content of the repeating unit derived from the aromatic vinyl compound is adjusted in consideration of the above problem and the degree of the crack. The above content (the content of the repeating unit derived from the aromatic vinyl polymer block in the block copolymer of the present invention) in order to make it difficult for the crack to occur when the resin molded product is wet heat treated The upper limit thereof is preferably 70% by mass or less, more preferably 65% by mass or less, and the lower limit thereof is preferably 45% by mass or more, more preferably 51% by mass or more.

  The styrene content in the block copolymer of the present invention (substituted or unsubstituted in the block copolymer of the present invention, from the viewpoint of particularly easily suppressing the yellowing and the occurrence of cracks of molded articles obtained from the resin composition The upper limit of the content of the repeating unit derived from styrene is preferably 70% by mass or less, more preferably 65% by mass or less, and the lower limit is preferably 45% by mass or more, more preferably 51% by mass or more is there.

  As substituted styrene, α-alkyl substituted styrene such as α-methylstyrene, α-ethylstyrene, α-methyl-p-methylstyrene and the like; o-methylstyrene, m-methylstyrene, p-methylstyrene, 2,4- Nuclear alkyl substituted styrenes such as dimethylstyrene, ethylstyrene, 2,4,6-trimethylstyrene, o-t-butylstyrene, p-t-butylstyrene, p-cyclohexylstyrene and the like; o-chlorostyrene, m-chlorostyrene, Nuclear halogenated styrene such as p-chlorostyrene, p-bromostyrene, 2-methyl-4-chlorostyrene and the like can be mentioned.

  As a compound (monomer) which forms a soft segment, what comprises a normal block copolymer can be used. Specifically, α-olefins (α-C 2-12 olefins such as ethylene, propylene, 1-butene, 1-hexene, 1-octene and the like), diene monomers (butadiene, isoprene and the like) and the like can be mentioned. .

  When the content of the repeating unit derived from the compound forming the soft segment in the block copolymer in the present invention is increased, the molded product obtained from the resin composition is less likely to be cracked when subjected to wet heat treatment. On the other hand, if the content is too large, the difference between the refractive index of the block copolymer in the present invention and the refractive index of the cyclic olefin resin as a matrix becomes too large, so from the dispersion of the block copolymer in the present invention There is a problem in that the light refraction and scattering of the light are increased, and the transparency of the molded body is impaired. Therefore, the content of the repeating unit derived from the above compound is adjusted in consideration of the above problem and the degree of the crack. The upper limit of the content (the content of the repeating unit derived from the compound forming the soft segment in the block copolymer in the present invention) is preferably 55% by mass or less, more preferably 49% by mass or less The lower limit thereof is preferably 30% by mass or more, more preferably 35% by mass or more.

  Specific examples of the block copolymer in the present invention include styrene-butadiene copolymer (SBR), styrene-butadiene-styrene copolymer (SBS), hydrogenated styrene-butadiene copolymer (H-SBR), hydrogen Additive styrene-butadiene-styrene copolymer (SEBS), hydrogenated styrene-isoprene-styrene copolymer (SEPS), styrene-isobutylene-styrene copolymer (SIBS), hydrogenated styrene-isoprene butadiene-styrene co-weight And coalesced (SEEPS), styrene-isoprene-styrene copolymer (SIS).

  As the block copolymer in the present invention, the styrene content (substituted or non-substituted in the block copolymer in the present invention, from the viewpoint of particularly easily suppressing the occurrence of yellowing and cracking of molded articles obtained from the resin composition). The content of repeating units derived from substituted styrene is 45% by mass or more and 70% by mass or less, and a hydrogenated block copolymer of styrene and butadiene and / or isoprene (SEBS, SEPS, SEEPS, etc. Those containing) are preferred.

  The content of the block copolymer in the present invention is not particularly limited. The lower limit value of the content of the block copolymer in the present invention is preferably 0.1 mass to 100 mass parts of the cyclic olefin resin from the viewpoint of easily imparting moist heat resistance to a molded article obtained from the resin composition. The content is at least part, more preferably at least 0.5 parts by mass. Although the upper limit of content of the block copolymer in this invention is not specifically limited, It is 1.0 mass part or less with respect to 100 mass parts of cyclic olefin resin. The lower limit of the content of the block copolymer in the present invention is preferably 0.1% by mass or more, more preferably 0.5% by mass or more in the resin composition. The upper limit of the content of the block copolymer in the present invention is preferably 1.0% by mass or less in the resin composition.

(Other ingredients)
The resin composition of the present invention may contain components other than the above. Examples of such other components include thermoplastic resins other than cyclic olefin resins, and additives such as lubricants, stabilizers, reinforcing agents, plasticizers and pigments. The types and amounts of these resins and additives can be appropriately selected according to the effect to be obtained.

<Method for Producing Resin Composition>
The method for producing the resin composition of the present invention is not particularly limited. In general, the resin composition of the present invention can be prepared by using equipment and methods known as a method for preparing a resin composition. For example, necessary components can be mixed and kneaded using a single- or twin-screw extruder or other melt-kneading apparatus to prepare molding pellets. All components may be simultaneously fed from the hopper and melt-kneaded may be good, or some components may be fed from the side feed port and melt-kneaded.

<Production method of molded article>
A molded article can be manufactured by a conventionally known molding method using the resin composition of the present invention. Examples of conventionally known molding methods include molding methods such as injection molding and extrusion molding.

  The molded article obtained from the resin composition of the present invention is not particularly limited, but a camera lens, a pickup lens, a projector lens, a lens of an illumination device (such as an LED or a cold cathode tube), a lamp cover, a conductor A light, a resin window, an optical film, an optical sheet etc. are mentioned.

<Molded Product of the Present Invention>
The molded article obtained from the resin composition of the present invention is good in all of heat resistance, light resistance, and heat and humidity resistance, and generation of yellowing and cracks is suppressed. The heat resistance, light resistance, moisture heat resistance, and evaluation of yellowing and occurrence of cracks can be evaluated by the methods shown in the examples.

  Hereinafter, the present invention will be described by showing Examples and Comparative Examples. The present invention is not limited to the following examples.

<Material of Resin Composition>
The materials and proportions shown in Tables 1 to 4 were melt-kneaded at a cylinder temperature of 260 to 300 ° C using a 30 mm 二 twin-screw extruder to obtain resin compositions of Examples and Comparative Examples. The following was used as a material of the resin composition. In addition, the ratio of each material was shown as a mass part with respect to 100 mass parts of cyclic olefin resin.

(Cyclic olefin resin)
As cyclic olefin resin, any 1 or more types of following 4 types of "COC" were used. All of these cyclic olefin resins are addition copolymers of norbornene and ethylene.
COC-1: heat deflection temperature = 120 ℃, Tg = 134 ℃ , MVR = 48cm 3/10 minutes, TOPAS Advanced Polymers, Inc. COC-2: heat deflection temperature = 120 ℃, Tg = 142 ℃ , MVR = 13cm 3 / 10 minutes, TOPAS Advanced Polymers, Inc. COC-3: heat deflection temperature = 140 ℃, Tg = 158 ℃ , MVR = 4cm 3/10 min, TOPAS Advanced Polymers, Inc. COC-4: heat deflection temperature = 160 ℃, Tg = ^{178 ℃, MVR = 1.5cm 3/} 10 minutes, TOPAS Advanced Polymers, Inc.

  The “load deflection temperature” of the above COC and “load deflection temperature (° C.) of cyclic olefin resin” in Table 4 refer to each cyclic olefin resin (resin mixture in the case of containing multiple cyclic olefin resins). The load deflection temperature at 1.8 MPa measured by the method according to ISO 75-1 and 2 is shown about the test piece which did not give the annealing process produced using it.

  "Tg" of the said COC shows the glass transition point measured on the conditions of 20 degreeC / min of temperature rising rates by the method based on ISO11357-1, -2, and -3 about each cyclic olefin resin.

  "MVR" of the above-mentioned COC shows the melt volume rate measured on the conditions of measurement temperature 260 ° C, and load 2160g by the method based on ISO1133 about each cyclic olefin system resin.

(Compound (A))
The following was used as a compound (A) having a 3,5-di-tert-butyl-4-hydroxyphenyl group.
Pentaerythritol tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] ("Irganox 1010", manufactured by BASF Japan Ltd.)
Also, in place of the compound (A), the following hindered phenols were also used.
Ethylenebis (oxyethylene) bis [3- (5-tert-butyl-4-hydroxy-m-tolyl) propionate] ("Irganox 245", manufactured by BASF Japan Ltd.)
Bis [3,3-bis (3′-t-butyl-4′-hydroxyphenyl) butyric acid] ethylene (“Hostanox O 3”, manufactured by Clariant Japan Ltd.)

(Compound (B))
As the compound (B) having a 2,2,6,6-tetramethyl-4-piperidyl group or a 1,2,2,6,6-pentamethyl-4-piperidyl group, the following was used.
Poly [{6- (1,1,3,3-tetramethylbutyl) amino-1,3,5-triazine-2,4-diyl} {(2,2,6,6-tetramethyl-4-piperidyl] ) Imino} hexamethylene {(2,2,6,6-tetramethyl-4-piperidyl) imino}] (“LA-94G”, manufactured by ADEKA Corporation)
Poly [{6-morpholino-1,3,5-triazine-2,4-diyl} {(1,2,2,6,6-pentamethyl-4-piperidyl) imino} hexamethylene {(1,2,2) , 6,6-Pentamethyl-4-piperidyl) imino}] ("UV-3529", manufactured by CYTEC INDUSTRIES INC)
Bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate (“Tinuvin 770”, manufactured by BASF Japan Ltd.)
A compound represented by the following formula (1) ("Chimassorb 2020", manufactured by BASF Japan Ltd.)

(UV absorber)
The following was used as an ultraviolet absorber.
2- (2H-benzotriazol-2-yl) -4-6-bis (1-methyl-1-phenylmethyl) phenol ("Tinuvin 234", manufactured by BASF Japan Ltd.)
2,2'-Methylenebis [6- (2H-benzotriazol-2-yl) -4- (1,1,3,3-tetramethylbutyl) phenol] ("LA-31", manufactured by ADEKA Corporation)
Bis {2- [4- (4,6-diphenyl-1,3,5-triazin-2-yl) -3-hydroxyphenoxy] ethyl} dodecanedioate ("LA-1000", manufactured by ADEKA Corporation)
2- [4,6-bis (2,4-dimethylphenyl) -1,3,5-triazin-2-yl] -5- (octyloxy) phenol ("CYASORB UV-1164", manufactured by CYTEC INDUSTRIES INC)
Tetra-ethyl-2,2- (1,4-phenylene-dimethylidene) -bismalonate ("Hostavin B-CAP", manufactured by Clariant Japan Ltd.)

(Condensed phosphate ester)
The following was used as condensed phosphoric acid ester.
1,3 phenylene bis (di-2, 6 xylenyl phosphate) ("PX-200", Daihachi Chemical Industry Co., Ltd.)

(Block copolymer)
The following was used as a block copolymer containing styrene in the main chain.
"Septon 8104" (SEBS, styrene content 60% by mass, Kuraray Co., Ltd.)
"Septon 8105" (SEBS, styrene content 65% by mass, Kuraray Co., Ltd.)
"Septon 2104" (SEPS, styrene content 65% by mass, Kuraray Co., Ltd.)
"Hybrar KL 7350" (SEEPS, styrene content 50% by mass, Kuraray Co., Ltd.)
"Tough Tech H1043" (SEBS, styrene content 67% by mass, manufactured by Asahi Kasei Corporation)
"DYNARON 9901P" (SEBS, 54% by mass styrene content, manufactured by JSR Corporation)

(Additive)
The following was used as an additive.
Lubricant: Pentaerythritol tetrastearate (PETS), manufactured by NOF Corporation

  In Tables 1 to 4, "Whether the ultraviolet absorber を 満 た す (B) is satisfied?" Means that the content of the ultraviolet absorber and the content of the compound (B) in the composition of each resin composition It is an item indicating whether the relationship “parts by mass of the ultraviolet light absorber based on 100 parts by mass of the cyclic olefin-based resin ≦ parts by mass of the compound (B) per 100 parts by mass of the cyclic olefin-based resin” is satisfied. In “(A) ≦ (B) is satisfied?”, The content of the compound (A) and the content of the compound (B) in the composition of each resin composition are “100 parts by mass of the cyclic olefin resin It is an item indicating whether or not the relationship “parts by mass of compound (A) ≦ parts by mass of compound (B) per 100 parts by mass of cyclic olefin resin” is satisfied. In all items, "YES" was shown when it satisfy | filled, and "NO" was shown when it did not satisfy.

<Molding of resin composition>
About each obtained resin composition, it is 70 mm x 70 mm x thickness 2 mm with cylinder temperature 260-300 degreeC, mold temperature 110-135 degreeC with injection molding machine (Sumitomo Heavy Industries, Ltd. make, brand name: SE75D) A flat plate was formed.

<Evaluation of yellowness and occurrence of cracks>
Each flat plate after molding was subjected to the following three types of tests (heat aging test, # 320 or # 275 xenon test, wet heat resistance test) to evaluate yellowness (YI value) before and after the test, and the presence or absence of cracks. The yellowness (DIN 6167) was measured using a color difference meter color-sphere manufactured by YKB-Gardnar GmbH. The results are shown in Tables 1 to 4. In the table, "initial YI" indicates the degree of yellowness of each flat plate before the test.

(Heat aging test)
Each flat plate was heat-treated at 115 ° C., 125 ° C., or 130 ° C. for 1000 hours, and the yellowness was measured after the heat treatment (“YI @ 115 ° C. × 1000 h”, “YI @ 125 ° C. × 1000 h”, "YI @ 130 ° C x 1000 h"). Furthermore, the difference (ΔYI) in yellowness before and after heat treatment was calculated. The smaller the ΔYI, the higher the heat resistance of the molded article.

(Xenon test)
Each flat plate was irradiated with light for 500 hours, and the degree of yellowness was measured after light irradiation (section of “YI @ 500 hours irradiation”). For light irradiation, filter # 275 (cut at 275 nm or less) or filter # 320 (cut at 320 nm or less) using a Suga tester Super Xenon Weather Meter, black panel temperature 89 ° C., humidity 50% RH, irradiation density 162 W / m It carried out on the conditions of ² (300-400 nm) and the total energy amount of 291.5 MJ / m < ² >. Furthermore, the difference (ΔYI) in yellowness before and after light irradiation was calculated. The smaller the ΔYI, the higher the light resistance of the molded article.

  Moreover, the haze value after said light irradiation was also measured. Specifically, the haze value was measured by a method according to JIS K7136 using a haze meter (manufactured by Toyo Seiki Seisaku-sho, trade name: Haze Guard II). The smaller the haze value, the higher the light resistance of the molded article.

(Moisture resistance test)
Each plate was exposed to an environment at a temperature of 85 ° C. and a humidity of 85% for 1000 hours, and the presence or absence of cracks after the exposure was observed with an optical microscope. Molded articles in which no cracks were observed show that the heat and humidity resistance is high.

  As shown in Table 1, the molded articles obtained from the resin composition of the present invention were all good in heat resistance, light resistance and moisture and heat resistance, and the occurrence of yellowing and cracks was suppressed. Such a tendency was observed regardless of the type of UV absorber used.

  On the other hand, molded articles obtained from a resin composition which does not satisfy the requirements of the resin composition of the present invention are inferior in heat resistance, light resistance and moisture and heat resistance, and remarkable yellowing and cracks are observed after each test. The

  As shown in Table 2, molded articles obtained from a resin composition which did not satisfy any of the requirements of the resin composition of the present invention were inferior in any of heat resistance, light resistance and moisture and heat resistance. Therefore, it was found that, according to the resin composition satisfying the requirements of the resin composition of the present invention, a molded article having good characteristics with respect to all of heat resistance, light resistance and moisture and heat resistance can be obtained.

  As shown in Table 3, the molded articles obtained from the resin composition of the present invention were all good in heat resistance, light resistance and moisture and heat resistance, and the occurrence of yellowing and cracks was suppressed. In particular, as understood from, for example, comparison between the example and the comparative example 17, even when all the components contained in the resin composition of the present invention are contained, “the compound (A It was found that, as in the present invention, it is not possible to realize well-balanced properties as in the present invention, unless the relationship of “parts by mass of part) ≦ parts by mass of compound (B) to 100 parts by mass of cyclic olefin resin”.

  As shown in Table 4, it was found that, among the requirements for the resin composition of the present invention, if the requirement for the deflection temperature under load of cyclic olefin resin is not satisfied, the resulting molded article is significantly inferior in heat resistance.

Claims (8)

Cyclic olefin resin,
A compound (A) having a 3,5-di-tert-butyl-4-hydroxyphenyl group,
A compound (B) having a 2,2,6,6-tetramethyl-4-piperidyl group or a 1,2,2,6,6-pentamethyl-4-piperidyl group;
UV absorber,
Condensed phosphate ester,
A resin composition comprising a block copolymer containing styrene in the main chain,
The cyclic olefin-based resin has a deflection temperature under load of at least 125 ° C. at 1.8 MPa measured on a test piece which has not been subjected to annealing treatment by a method in accordance with ISO 75-1, 2.
The content of the compound (A) and the compound (B) is: part by mass of the compound (A) based on 100 parts by mass of the cyclic olefin resin ≦ mass of the compound (B) based on 100 parts by mass of the cyclic olefin resin A resin composition that fills parts.   The content of the ultraviolet absorber and the compound (B) is: part by mass of the ultraviolet absorber based on 100 parts by mass of the cyclic olefin resin ≦ part by mass of the compound (B) based on 100 parts by mass of the cyclic olefin resin The resin composition according to claim 1, which satisfies the condition.   The resin composition according to claim 1, wherein the cyclic olefin resin comprises an addition copolymer of norbornene and ethylene.   The resin composition according to any one of claims 1 to 3, wherein the compound (A) contains pentaerythritol tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate]. The compound (B) is a fatty acid (C12-21 and C18 unsaturated) 2,2,6,6-tetramethyl-4-piperidyl ester, bis (2,2,6,6-tetramethyl-4-piperidyl) Sebacate, poly [{6-morpholino-1,3,5-triazine-2,4-diyl} {(1,2,2,6,6-pentamethyl-4-piperidyl) imino} hexamethylene {(1,2 , 2,6,6-pentamethyl-4-piperidyl) imino}], and poly [{6- (1,1,3,3-tetramethylbutyl) amino-1,3,5-triazine-2,4 -Diyl} {(2,2,6,6-tetramethyl-4-piperidyl) imino} hexamethylene {(2,2,6,6-tetramethyl-4-piperidyl) imino}], and the following formula ( Group consisting of compounds represented by 1) Including one or more that are al selected, the resin composition according to any one of claims 1 to 4.

  The UV absorber is 2- (2H-benzotriazol-2-yl) -4-6-bis (1-methyl-1-phenylmethyl) phenol, 2,2'-methylenebis [6- (2H-benzotriazole) -2-yl) -4- (1,1,3,3-tetramethylbutyl) phenol], 2- [4,6-bis (2,4-dimethylphenyl) -1,3,5-triazine-2 -Yl] -5- (octyloxy) phenol, bis {2- [4- (4,6-diphenyl-1,3,5-triazin-2-yl) -3-hydroxyphenoxy] ethyl} dodecanedioate, The resin composition according to any one of claims 1 to 5, comprising one or more selected from the group consisting of and tetra-ethyl-2,2- (1,4-phenylene-dimethylidene) -bismalonate.   The resin composition according to any one of claims 1 to 6, wherein the condensed phosphoric acid ester comprises 1,3 phenylene bis (di-2,6 xylenyl phosphate).   The block copolymer according to any one of claims 1 to 7, wherein the block copolymer has a styrene content of 45% by mass to 70% by mass, and includes a hydride of a block copolymer of styrene and butadiene and / or isoprene. Resin composition according to any one of the preceding claims.