JPWO2018047467A1 - Vulcanized adhesive - Google Patents
Vulcanized adhesive Download PDFInfo
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- JPWO2018047467A1 JPWO2018047467A1 JP2017560830A JP2017560830A JPWO2018047467A1 JP WO2018047467 A1 JPWO2018047467 A1 JP WO2018047467A1 JP 2017560830 A JP2017560830 A JP 2017560830A JP 2017560830 A JP2017560830 A JP 2017560830A JP WO2018047467 A1 JPWO2018047467 A1 JP WO2018047467A1
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- 239000000853 adhesive Substances 0.000 title claims abstract description 52
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 51
- 239000005011 phenolic resin Substances 0.000 claims abstract description 37
- 229920003986 novolac Polymers 0.000 claims abstract description 31
- 239000003822 epoxy resin Substances 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 239000003960 organic solvent Substances 0.000 claims abstract description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 7
- 229920001568 phenolic resin Polymers 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims description 4
- 238000004073 vulcanization Methods 0.000 claims description 4
- 229920003987 resole Polymers 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 abstract description 9
- 238000011109 contamination Methods 0.000 abstract description 7
- 238000000465 moulding Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 238000013040 rubber vulcanization Methods 0.000 abstract description 3
- 208000034809 Product contamination Diseases 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 229920000459 Nitrile rubber Polymers 0.000 description 29
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 5
- 239000004312 hexamethylene tetramine Substances 0.000 description 5
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- OGRAOKJKVGDSFR-UHFFFAOYSA-N 2,3,5-trimethylphenol Chemical compound CC1=CC(C)=C(C)C(O)=C1 OGRAOKJKVGDSFR-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 3
- ZNRLMGFXSPUZNR-UHFFFAOYSA-N 2,2,4-trimethyl-1h-quinoline Chemical compound C1=CC=C2C(C)=CC(C)(C)NC2=C1 ZNRLMGFXSPUZNR-UHFFFAOYSA-N 0.000 description 2
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 236TMPh Natural products CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- PHVAHRJIUQBTHJ-UHFFFAOYSA-N 3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1 PHVAHRJIUQBTHJ-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 229920001967 Metal rubber Polymers 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- ZUDYPQRUOYEARG-UHFFFAOYSA-L barium(2+);dihydroxide;octahydrate Chemical compound O.O.O.O.O.O.O.O.[OH-].[OH-].[Ba+2] ZUDYPQRUOYEARG-UHFFFAOYSA-L 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- RFAZFSACZIVZDV-UHFFFAOYSA-N butan-2-one Chemical compound CCC(C)=O.CCC(C)=O RFAZFSACZIVZDV-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- -1 glycidyl ester Chemical class 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 1
- 229910021511 zinc hydroxide Inorganic materials 0.000 description 1
- 229940007718 zinc hydroxide Drugs 0.000 description 1
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 1
- 229910000165 zinc phosphate Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/02—Copolymers with acrylonitrile
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
ハイオルソ型ノボラックフェノール樹脂100重量部当りエポキシ樹脂1〜10重量部および未加硫のNBR10〜30重量部を添加した、その有機溶媒溶液よりなる加硫接着剤。この加硫接着剤は、これを各種基質とNBRとの加硫接着に用いたとき、接着剤塗膜がタックフリーの状態に近くなり、ゴム加硫成形時の金型汚染、製品汚染といった不具合を生ぜずに、90°剥離試験での剥離強度およびゴム残り面積率の良好な加硫接着状態を得ることを可能とする。 A vulcanized adhesive comprising an organic solvent solution, to which 1 to 10 parts by weight of an epoxy resin and 10 to 30 parts by weight of unvulcanized NBR are added per 100 parts by weight of a high-ortho type novolak phenol resin. When this vulcanized adhesive is used for vulcanized adhesion between various substrates and NBR, the adhesive coating film becomes almost tack-free, and there are defects such as mold contamination and product contamination during rubber vulcanization molding. It is possible to obtain a vulcanized adhesion state with good peel strength and 90% rubber remaining area ratio in the 90 ° peel test.
Description
本発明は、加硫接着剤に関する。さらに詳しくは、基質とNBRとの加硫接着に有効に用いられる加硫接着剤に関する。 The present invention relates to a vulcanized adhesive. More specifically, the present invention relates to a vulcanized adhesive that is effectively used for vulcanization adhesion between a substrate and NBR.
従来より種々のNBR用の加硫接着剤が存在するが、これらの内フェノール樹脂とヘキサメチレンテトラミンとからなるものは、調合が容易でかつ廉価であることから、古くから広範囲に用いられてきた。しかしながら、この加硫接着剤は、加熱乾燥時にヘキサメチレンテトラミンのガスを発生させ、乾燥炉内やその周辺を汚染させる。また、他の接着剤を塗布した金具を同じ乾燥炉内で乾燥すると、炉内に残存するヘキサメチレンテトラミンが付着して接着不具合をひき起こすこともある。 Various types of vulcanized adhesives for NBR exist in the past, but those made of phenolic resin and hexamethylenetetramine have been used widely since ancient times because they are easy to prepare and inexpensive. . However, this vulcanized adhesive generates a gas of hexamethylenetetramine at the time of drying by heating, and contaminates the inside of the drying furnace and its surroundings. Moreover, when the metal fitting which apply | coated another adhesive agent is dried in the same drying furnace, the hexamethylenetetramine which remains in a furnace may adhere and cause an adhesion | attachment malfunction.
NBR用加硫接着剤として、レゾール型フェノール樹脂、加硫系成分を含有させない未加硫のNBRおよび塩素化ポリエチレンを含有する組成物も本出願人によって提案されているが(特許文献1)、この加硫接着剤は一般に接着が困難とされるゴム混練物を好適に接着可能とする反面、加熱処理後の接着剤塗膜が軟質で、ゴムの加硫成形の際に金型を汚染したり、はみ出した接着剤が接着成形物である製品自体を汚染するといった問題がみられた。 As the vulcanized adhesive for NBR, a composition containing a resol-type phenolic resin, an unvulcanized NBR not containing a vulcanized component, and chlorinated polyethylene has been proposed by the present applicant (Patent Document 1). While this vulcanized adhesive can suitably bond rubber kneaded materials that are generally difficult to bond, the adhesive coating film after heat treatment is soft and contaminates the mold during rubber vulcanization molding. In some cases, the protruding adhesive contaminates the product itself, which is an adhesive molded product.
本出願人はまた、m-クレゾール-p-クレゾール混合物から得られたノボラック型フェノール樹脂を接着剤成分とし、これに未変性レゾール型フェノール樹脂を硬化剤として添加してなり、ヘキサメチレンテトラミンが硬化剤として使用されておらず、金属への焼付温度範囲が約100〜200℃である、金属とアクリルゴムとの加硫接着に用いられる加硫接着剤を提案している(特許文献2)。この加硫接着剤は、硬化が不十分なことによる接着不良を起こし易いといった問題がみられる場合があるばかりではなく、これを金属とNBRとの加硫接着に用いた場合には、後記比較例1の結果に示されるように、金型や成形物に汚染はみられず、接着強度も適当な値を示してはいるものの、90°剥離試験での初期および80℃、70時間の純水浸漬後のゴム残り面積率が低いという結果がみられた。 The present applicant also added a novolac-type phenol resin obtained from an m-cresol-p-cresol mixture as an adhesive component and added an unmodified resol-type phenol resin as a curing agent to cure hexamethylenetetramine. A vulcanized adhesive that is not used as an agent and has a baking temperature range of about 100 to 200 ° C. for metal and acrylic rubber is proposed (Patent Document 2). This vulcanized adhesive may not only cause problems such as poor adhesion due to insufficient curing, but when used for vulcanized adhesion between metal and NBR, comparisons will be made later. As shown in the results of Example 1, there was no contamination in the mold or the molded product, and although the adhesive strength showed an appropriate value, the initial value in the 90 ° peel test and the pure value at 80 ° C for 70 hours. The result that the rubber remaining area ratio after water immersion was low was seen.
本発明の目的は、フェノール系樹脂を主体とし、基質とNBRとの加硫接着に用いられる加硫接着剤であって、金型や接着物の汚染を防止するばかりではなく、安定した接着性を示すものを提供することにある。 The object of the present invention is a vulcanized adhesive mainly composed of a phenolic resin and used for vulcanization adhesion between a substrate and NBR, which not only prevents contamination of molds and adhesives but also has stable adhesion. It is to provide an indication.
かかる本発明の目的は、ハイオルソ型ノボラックフェノール樹脂100重量部当りエポキシ樹脂1〜10重量部および未加硫のNBR10〜30重量部を添加した、その有機溶媒溶液よりなる加硫接着剤によって達成される。 The object of the present invention is achieved by a vulcanized adhesive comprising an organic solvent solution to which 1 to 10 parts by weight of an epoxy resin and 10 to 30 parts by weight of unvulcanized NBR are added per 100 parts by weight of a high-ortho type novolak phenol resin. The
本発明に係る加硫接着剤は、これを各種基質とNBRとの加硫接着に用いたとき、接着剤塗膜がタックフリーの状態に近くなり、ゴム加硫成形時の金型汚染、製品汚染といった不具合を生ぜずに、90°剥離試験での剥離強度および80℃、70時間の純水浸漬後のゴム残り面積率の良好な加硫接着状態を得ることを可能としている。 When the vulcanized adhesive according to the present invention is used for vulcanization adhesion between various substrates and NBR, the adhesive coating film is close to a tack-free state, mold contamination during rubber vulcanization molding, product Without causing problems such as contamination, it is possible to obtain a vulcanized adhesion state in which the peel strength in the 90 ° peel test and the rubber remaining area ratio after immersion in pure water at 80 ° C. for 70 hours are obtained.
本発明の加硫接着剤ではフェノール樹脂の硬化剤としてエポキシ樹脂を配合し、ヘキサメチレンテトラミン硬化促進剤を配合していないので、それによる焼付炉やその周辺での汚染がみられない。このことは、高い反応性を有するハイオルソ型ノボラックフェノール樹脂を用いたことによる。 In the vulcanized adhesive of the present invention, an epoxy resin is blended as a phenol resin curing agent, and a hexamethylenetetramine curing accelerator is not blended. Therefore, no contamination is observed in the baking furnace or in the vicinity thereof. This is because a high-ortho type novolak phenol resin having high reactivity was used.
また、従来の加硫接着剤は、NBR混練物との良好な接着性を得るために、高い配合比率でNBRを配合する必要があり、これによる金型や製品の汚染もみられたが(後記比較例3)、高い反応性を有するハイオルソ型ノボラックフェノール樹脂の使用によりNBRの配合比率を低下させることができる。 In addition, conventional vulcanized adhesives require NBR to be blended at a high blending ratio in order to obtain good adhesion to the NBR kneaded product, and this has caused mold and product contamination (see below). Comparative Example 3) By using a high-ortho type novolak phenol resin having high reactivity, the blending ratio of NBR can be reduced.
本発明においてハイオルソ型ノボラックフェノール樹脂としては、IRによるオルソ型由来吸収ピークおよびパラ型由来吸収ピークの面積から算出されるオルソ型含有率が65%以上、好ましくは70%以上、さらに好ましくは70〜80%のノボラックフェノール樹脂が用いられる。 In the present invention, the high ortho type novolak phenol resin has an ortho type content calculated from the area of the ortho type derived absorption peak and the para type derived absorption peak by IR of 65% or more, preferably 70% or more, more preferably 70 to 80% novolac phenolic resin is used.
ハイオルソ型ノボラックフェノール樹脂に対して、通常のノボラックフェノール樹脂はランダム型ノボラックフェノール樹脂と呼称されているが、ランダム型ノボラックフェノール樹脂はハイオルソ型ノボラックフェノール樹脂と比較して硬化性に劣り、加工時に高い温度や長い時間を要する場合が多い。一方、ハイオルソ型ノボラックフェノール樹脂は高い反応性を有し、本発明の加硫接着剤の主剤として好適に用いることができる。 Normal novolak phenol resin is called random type novolak phenol resin compared to high ortho type novolak phenol resin, but random type novolak phenol resin is inferior in curability compared with high ortho type novolak phenol resin and is high during processing. It often takes temperature and long time. On the other hand, the high-ortho type novolak phenol resin has high reactivity and can be suitably used as the main agent of the vulcanized adhesive of the present invention.
ハイオルソ型ノボラックフェノール樹脂は、m-クレゾール、p-クレゾール、3,5-キシレノールおよび2,3,5-トリメチルフェノールの1種または2種以上、例えばm-クレゾール、p-クレゾールおよび3,5-キシレノールの3者またはm-クレゾール、p-クレゾールおよび2,3,5-トリメチルフェノールの3者を用い、これらをアルデヒド類と反応させることにより得られる。 High ortho type novolak phenol resin is one or more of m-cresol, p-cresol, 3,5-xylenol and 2,3,5-trimethylphenol, such as m-cresol, p-cresol and 3,5- It can be obtained by reacting these with aldehydes using three of xylenol or three of m-cresol, p-cresol and 2,3,5-trimethylphenol.
アルデヒド類としては、例えばホルムアルデヒド、アセトアルデヒド、プロピルアルデヒド、ブチルアルデヒド、ベンズアルデヒド、サリチルアルデヒド等が用いられ、好ましくはホルムアルデヒド、アセトアルデヒド、サリチルアルデヒドが用いられる。ホルムアルデヒドとしては、ホルマリン水溶液、パラホルムアルデヒド、アルコール類とのヘミホルマール、トリオキサン等のホルムアルデヒド発生物質のいずれをも使用することができる。 As the aldehydes, for example, formaldehyde, acetaldehyde, propyl aldehyde, butyraldehyde, benzaldehyde, salicylaldehyde and the like are used, and preferably formaldehyde, acetaldehyde and salicylaldehyde are used. As the formaldehyde, any of formaldehyde-generating substances such as aqueous formalin solution, paraformaldehyde, hemi-formal with alcohols, and trioxane can be used.
フェノール類とアルデヒド類との反応は、約110〜220℃、好ましくは約120〜150℃の反応温度で、酸触媒を用いて行われる。このような高温の反応温度で反応させることにより、フェノール性水酸基近傍での反応が優先的に起こり、オルソ型含有率が高くなる。酸触媒としては、一般にシュウ酸、酢酸等の弱酸が用いられるが、2価金属塩、2価金属の酸化物または水酸化物、例えば酸化亜鉛、水酸化亜鉛等も用いられ、これらの2価金属化合物は上記弱酸の如き酸性化合物と組合せて用いることもできる。また、3官能性フェノール系モノマーを用い、触媒を用いずに、高圧条件下で反応させる反応も提案されている(特許文献3)。 The reaction between phenols and aldehydes is carried out using an acid catalyst at a reaction temperature of about 110 to 220 ° C, preferably about 120 to 150 ° C. By reacting at such a high reaction temperature, the reaction in the vicinity of the phenolic hydroxyl group occurs preferentially, and the ortho-type content is increased. As the acid catalyst, weak acids such as oxalic acid and acetic acid are generally used, but divalent metal salts, divalent metal oxides or hydroxides such as zinc oxide and zinc hydroxide are also used. The metal compound can also be used in combination with an acidic compound such as the above weak acid. In addition, a reaction in which trifunctional phenolic monomers are used and reacted under high pressure conditions without using a catalyst has been proposed (Patent Document 3).
かかるハイオルソ型ノボラックフェノール樹脂としては、実際には市販品、例えば昭和電工製品ショウノールBRM-7174H等がそのまま用いられる。また、ハイオルソ型ノボラックフェノール樹脂と共に、それの100重量部当り約25重量部以下のランダム型ノボラックフェノール樹脂やレゾール型フェノール樹脂を併用することもできる。 As such a high-ortho type novolak phenol resin, a commercially available product, for example, Showa Denko product Shounol BRM-7174H or the like is used as it is. Further, together with the high ortho type novolac phenol resin, a random type novolac phenol resin or a resol type phenol resin of about 25 parts by weight or less per 100 parts by weight thereof can be used in combination.
エポキシ樹脂としては、1分子中に2個以上のエポキシ基を有するものであれば任意のものを使用することができ、例えばビスフェノールA型、低または高臭素化ビスフェノールA型、ビスフェノールF型、フェノールノボラック型、臭素化フェノールノボラック型、クレゾールノボラック型等のグリシジルエーテル型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、脂環式エポキシ樹脂、複素環式エポキシ樹脂等の少くとも一種が用いられる。 As the epoxy resin, any one having two or more epoxy groups in one molecule can be used. For example, bisphenol A type, low or high brominated bisphenol A type, bisphenol F type, phenol Use at least one type of glycidyl ether type epoxy resin such as novolak type, brominated phenol novolak type, cresol novolak type, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, etc. It is done.
これらのエポキシ樹脂は、ハイオルソ型ノボラックフェノール樹脂100重量部当り約1〜10重量部、好ましくは約2〜6重量部の割合で用いられる。これ以下の使用割合では所望の硬化反応が生ぜず、一方これ以上の割合で用いられると、後記比較例2の結果に示される如く、剥離強度が低く、初期のゴム残り面積率が0となる。 These epoxy resins are used in an amount of about 1 to 10 parts by weight, preferably about 2 to 6 parts by weight, per 100 parts by weight of the high-ortho type novolak phenol resin. If the ratio is less than this, the desired curing reaction does not occur. On the other hand, if the ratio is greater than this, the peel strength is low and the initial rubber remaining area ratio is 0, as shown in the results of Comparative Example 2 below. .
未加硫のNBRとしては、アクリロニトリル(AN)含量が約20〜50%、好ましくは約25〜45%、より好ましくは約30〜42%のものが用いられる。一般には、接着されるべきNBRと同等またはよりAN含量の多いものが用いられる。この未加硫NBRは、加硫剤等の加硫系成分を含有していない。 As the unvulcanized NBR, those having an acrylonitrile (AN) content of about 20 to 50%, preferably about 25 to 45%, more preferably about 30 to 42% are used. In general, those having the same or higher AN content as the NBR to be bonded are used. This unvulcanized NBR does not contain a vulcanizing component such as a vulcanizing agent.
未加硫NBRは、ハイオルソ型ノボラックフェノール樹脂100重量部当り約10〜30重量部、好ましくは約20〜25重量部の割合で用いられる。これよりも少ない使用割合では初期接着性が低下し、反応性が低いNBR混練物に対しては接着が困難となり、一方これ以上の割合で用いられると、後記比較例3の結果に示される如く、剥離試験の結果は満足させるものの、金型や成型物に汚染がみられ、本発明所期の目的を達成することができない。 Unvulcanized NBR is used in a ratio of about 10 to 30 parts by weight, preferably about 20 to 25 parts by weight, per 100 parts by weight of the high-ortho type novolak phenol resin. If the amount used is less than this, the initial adhesiveness is lowered, and it becomes difficult to adhere to the NBR kneaded material having low reactivity. Although the results of the peel test are satisfactory, the mold and molded product are contaminated, and the intended purpose of the present invention cannot be achieved.
以上の各成分を必須成分とする本発明の加硫接着剤は、有機溶媒溶液として調製される。有機溶媒としては、アセトン、メチルエチルケトン(2-ブタノン)、メチルイソブチルケトン等のケトン類、トルエン、キシレン等の芳香族炭化水素類が、単独であるいは混合して用いられる。ケトン類と芳香族炭化水素類とが混合して用いられる場合には、ケトン類100重量部に対し芳香族炭化水素類が約30〜70重量部の割合で用いられることが好ましい。 The vulcanized adhesive of the present invention having the above components as essential components is prepared as an organic solvent solution. As the organic solvent, ketones such as acetone, methyl ethyl ketone (2-butanone) and methyl isobutyl ketone, and aromatic hydrocarbons such as toluene and xylene are used alone or in combination. When ketones and aromatic hydrocarbons are used as a mixture, the aromatic hydrocarbons are preferably used in a proportion of about 30 to 70 parts by weight with respect to 100 parts by weight of the ketones.
加硫接着剤は、有機溶媒中固形分濃度が約3〜10重量%となるように攪拌、溶解して、均一な溶液として調製される。 The vulcanized adhesive is prepared as a uniform solution by stirring and dissolving so that the solid content concentration in the organic solvent is about 3 to 10% by weight.
本発明に係る加硫接着剤を用いて接着成形物を作製する際は、まず接着剤を金属、樹脂等の基質上に塗布し、室温下で乾燥させた後、約100〜160℃で加熱硬化させる。次いで、未加硫のNBR混練物を接合させ、約170〜210℃で約3〜8分間加圧加硫することにより、基質とNBRとの接着がなされる。金属または樹脂基質とNBRが良好に接着された接着成形物としては、オイルシール、ハブシール等の自動車用部品が例示される。 When producing an adhesive molded product using the vulcanized adhesive according to the present invention, first apply the adhesive on a substrate of metal, resin, etc., dry at room temperature, and then heat at about 100 to 160 ° C. Harden. Next, the unvulcanized NBR kneaded material is bonded and pressure vulcanized at about 170 to 210 ° C. for about 3 to 8 minutes, thereby bonding the substrate and the NBR. Examples of the adhesive molded product in which the metal or resin substrate and NBR are satisfactorily bonded include automotive parts such as an oil seal and a hub seal.
次に、実施例について本発明を説明する。 Next, the present invention will be described with reference to examples.
実施例1
ハイオルソ型ノボラックフェノール樹脂 100重量部
(アイカSDKフェノール製品ショウノールBRM-7174H;
オルソ型含有率 70〜80%)
ビスフェノールA型エポキシ樹脂(三菱ケミカル製品JSR1004) 3 〃
NBR(JSR製品N237;AN含量34%) 21 〃
2-ブタノン 2980 〃
以上の各成分から調製された加硫接着剤を、リン酸亜鉛処理した軟鋼板上に塗布し、室温下に5分間放置した後、140℃で10分間乾燥処理した。Example 1
High ortho type novolac phenol resin 100 parts by weight
(Aika SDK phenol product Shounol BRM-7174H;
(Ortho-type content: 70-80%)
Bisphenol A epoxy resin (Mitsubishi Chemical product JSR1004) 3
NBR (JSR product N237; AN content 34%) 21 〃
2-butanone 2980 〃
The vulcanized adhesive prepared from each of the above components was applied onto a mild steel sheet treated with zinc phosphate, allowed to stand at room temperature for 5 minutes, and then dried at 140 ° C. for 10 minutes.
この加硫接着剤塗布軟鋼板上に、下記配合の未加硫NBR混練物を接合させ、180℃で4分間の加圧加硫を行い、接着成形物試験片を得た。用いられた金型および接着成形物の汚染の有無を目視で判定すると共に、得られた接着成形物について、ISO 813に対応するJIS K6256-2に準拠して90°剥離試験を実施し、剥離強度および初期ゴム残り面積率を測定した。また、接着成形物を純水に浸漬し、80℃で70時間加温後のゴム残り面積率を測定し、耐水接着性を評価した。
未加硫NBR混練物:
NBR(日本ゼオン製品ニポールDN1042;AN含量34%) 100重量部
FEFカーボンブラック 40 〃
シリカ粉末 20 〃
酸化亜鉛 5 〃
ステアリン酸 1 〃
ジオクチルフタレート 5 〃
老化防止剤(2,2,4-トリメチル-1,2-ジヒドロキノリン) 1 〃
トリアリルイソシアヌレート(濃度70重量%) 0.8 〃 On this vulcanized adhesive coated mild steel sheet, an unvulcanized NBR kneaded material having the following composition was joined and pressure vulcanized at 180 ° C. for 4 minutes to obtain an adhesive molded product test piece. The used mold and adhesive molded product are visually checked for contamination, and the resulting adhesive molded product is subjected to a 90 ° peel test in accordance with JIS K6256-2 corresponding to ISO 813, and peeled off. The strength and the initial rubber remaining area ratio were measured. Further, the adhesive molded product was immersed in pure water, and the area ratio of the rubber remaining after heating at 80 ° C. for 70 hours was measured to evaluate water-resistant adhesion.
Unvulcanized NBR kneaded material:
NBR (Nippon ZEON product Nipol DN1042; AN content 34%) 100 parts by weight
FEF carbon black 40 〃
Silica powder 20 〃
Zinc oxide 5 〃
Stearic acid 1 〃
Dioctyl phthalate 5 〃
Anti-aging agent (2,2,4-trimethyl-1,2-dihydroquinoline) 1 〃
Triallyl isocyanurate (concentration 70% by weight) 0.8 〃
実施例2
実施例1において、下記各成分から調製された加硫接着剤が用いられた。
ハイオルソ型ノボラックフェノール樹脂(BRM-7174H) 100重量部
ビスフェノールA型エポキシ樹脂(JSR1004) 3 〃
ランダム型ノボラックフェノール樹脂 52 〃
(ロード・インク製品ケムロックTS1677-13;
固形分濃度40重量%)
NBR(JSR製品N232S) 25 〃
2-ブタノン 3540 〃 Example 2
In Example 1, a vulcanized adhesive prepared from the following components was used.
High ortho type novolac phenolic resin (BRM-7174H) 100 parts by weight Bisphenol A type epoxy resin (JSR1004) 3 部
Random type novolac phenolic resin 52 〃
(Load and ink product Chemlock TS1677-13;
(Solid concentration 40% by weight)
NBR (JSR product N232S) 25 〃
2-butanone 3540 〃
比較例1
実施例1において、下記各成分から調製された加硫接着剤が用いられた。
ランダム型ノボラックフェノール樹脂 7重量部
(ケムロックTS1677-13)
レゾール型フェノール樹脂 3 〃
2-ブタノン 90 〃 Comparative Example 1
In Example 1, a vulcanized adhesive prepared from the following components was used.
Random type novolac phenol resin 7 parts by weight
(Chemlock TS1677-13)
Resole type phenolic resin 3 〃
2-butanone 90 〃
レゾール型フェノール樹脂は、特許文献2記載の参考例3に従い、m-クレゾール-p-クレゾール混合物とホルムアルデヒド水溶液とを水酸化バリウム・8水和物の存在下で、70℃で2時間反応させることにより得られたものを使用した。 Resol-type phenol resin is prepared by reacting a m-cresol-p-cresol mixture and an aqueous formaldehyde solution in the presence of barium hydroxide octahydrate at 70 ° C. for 2 hours according to Reference Example 3 described in Patent Document 2. What was obtained by this was used.
比較例2
実施例1において、ビスフェノールA型エポキシ樹脂量を15重量部に、また2-ブタノン量を3260重量部にそれぞれ変更した加硫接着剤が用いられた。Comparative Example 2
In Example 1, a vulcanized adhesive in which the amount of bisphenol A type epoxy resin was changed to 15 parts by weight and the amount of 2-butanone was changed to 3260 parts by weight was used.
比較例3
実施例2において、NBR量を37重量部に、また2-ブタノン量を3820重量部にそれぞれ変更した加硫接着剤が用いられた。Comparative Example 3
In Example 2, a vulcanized adhesive in which the NBR amount was changed to 37 parts by weight and the 2-butanone amount was changed to 3820 parts by weight was used.
以上の各実施例および比較例で得られた評価結果および測定結果は、次の表に示される。
表
評価・測定項目 実−1 実−2 比−1 比−2 比−3
汚染
金型 なし なし なし なし あり
接着成形物 なし なし なし なし あり
剥離強度 (N/mm) 5.6 5.8 4.6 1.5 5.5
ゴム残り面積率(%)
初期 100 100 50 0 100
純水浸漬後 60 80 20 0 70The evaluation results and measurement results obtained in the above examples and comparative examples are shown in the following table.
table
Evaluation / Measurement Items Real-1 Real-2 Ratio-1 Ratio-2 Ratio-3
pollution
Mold No No No No Yes
Adhesive molding No No No No Yes Peel strength (N / mm) 5.6 5.8 4.6 1.5 5.5
Rubber remaining area ratio (%)
Initial 100 100 50 0 100
After immersion in pure water 60 80 20 0 70
これらのエポキシ樹脂は、ハイオルソ型ノボラックフェノール樹脂100重量部当り約1〜10重量部、好ましくは約2〜6重量部の割合で用いられる。これより少ない使用割合では所望の硬化反応が生ぜず、一方これより多い割合で用いられると、後記比較例2の結果に示される如く、剥離強度が低く、初期のゴム残り面積率が0となる。 These epoxy resins are used in an amount of about 1 to 10 parts by weight, preferably about 2 to 6 parts by weight, per 100 parts by weight of the high-ortho type novolak phenol resin. If less than this, the desired curing reaction does not occur. On the other hand, if more than this is used, the peel strength is low and the initial rubber remaining area ratio is 0, as shown in the results of Comparative Example 2 below. .
かかる本発明の目的は、IRによる測定結果から算出されるオルソ型含有率が65%以上のハイオルソ型ノボラックフェノール樹脂100重量部当りエポキシ樹脂1〜10重量部および未加硫のNBR10〜30重量部を添加した、その有機溶媒溶液よりなる加硫接着剤によって達成される。 The object of the present invention is to provide 1 to 10 parts by weight of epoxy resin and 10 to 30 parts by weight of unvulcanized NBR per 100 parts by weight of high-ortho type novolak phenol resin having an ortho-type content calculated from IR measurement results of 65% or more. Is achieved by a vulcanized adhesive consisting of an organic solvent solution to which is added.
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US20050014086A1 (en) * | 2001-06-20 | 2005-01-20 | Eswaran Sambasivan Venkat | "High ortho" novolak copolymers and composition thereof |
JP4085658B2 (en) * | 2002-03-08 | 2008-05-14 | Nok株式会社 | Vulcanized adhesive composition |
CN102069141B (en) * | 2009-11-24 | 2012-10-03 | 济南圣泉集团股份有限公司 | Binder for casting core mould |
CN102399522B (en) * | 2011-10-09 | 2013-08-14 | 中国科学院化学研究所 | Organic/inorganic composite adhesive |
CN103254862B (en) * | 2013-05-17 | 2014-09-03 | 黑龙江省科学院石油化学研究院 | Sandwich adhesive for high-strength aramid fibre paper honeycomb and preparation method thereby |
JP6386872B2 (en) * | 2014-10-22 | 2018-09-05 | アイカSdkフェノール株式会社 | Binder base material for inner wall base material |
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CN108463532A (en) | 2018-08-28 |
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