JPWO2017104482A1 - Resin composition, film using the same, and carrier tape - Google Patents

Abstract

An object of this invention is to provide the resin composition which can form the carrier tape with favorable heat shaping property and external appearance, without using a polyester resin. The said subject contains 50-95 mass% of polycarbonate resin which has the terminal structure shown to following General formula (1), and the structural unit induced | guided | derived from an aromatic dihydroxy compound, and contains 5-30 mass% of conductive fillers, It can be solved by a resin composition.
[Chemical 1]

Description

  The present invention relates to a resin composition, a film using the same, and a carrier tape.

In recent years, technologies related to electronic components and products equipped with electronic components are rapidly progressing, and miniaturization of each electronic component is progressing. Along with this, the size of the pockets shaped on the carrier tape has also been reduced. Further, since it is necessary to transport the electronic component to the mounting location in the correct orientation, the electronic component must be stored in the correct orientation in the pocket of the carrier tape. Therefore, among the properties required for carrier tapes, micro shapeability and highly accurate mold transfer properties have been required.
From such a point of view, “a sheet-like material formed from a blend of an amorphous polyester resin and a polycarbonate resin” has been proposed in the past (for example, Patent Document 1 (Japanese Patent Application Laid-Open No. 2004-91691)). Etc.). And when such a sheet-like material is used for the manufacture of an article container such as a carrier tape, the molding temperature can be lowered from about 260-280 ° C. to about 200-250 ° C. Users can contribute to reducing energy consumption. In addition, it is considered that the mold transferability when heat-molding at the molding temperature of ordinary polycarbonate is very good.
Patent Document 2 (International Publication No. 2011/114692) discloses that the glass transition temperature (Tg) of the base resin is lowered by alloying a polycarbonate resin, an amorphous polyester resin, and a silicate compound filler. It has been proposed to obtain a carrier tape with good formability. By using such a technique, it is predicted that the heat-shaping property can be greatly improved as compared with a carrier tape using a normal polycarbonate resin.

JP 2004-91691 A International Publication No. 2011/114692

  However, the alloying of the polycarbonate resin and the polyester resin is likely to generate gel, and there is a concern that the appearance of the carrier tape is remarkably deteriorated. In recent years, electronic parts have been reduced in size with the advance of technology, and accordingly, the pocket processing applied to the film for the carrier tape is required to be finer. Therefore, there is a tendency that the lumps (lumps) in the carrier tape are strictly controlled, and it can be said that it is difficult in terms of cost and technology to use an alloy film for the carrier tape. Therefore, an object of this invention is to provide the resin composition which can form the carrier tape with favorable heat-formability and external appearance, without using a polyester resin.

  As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that the glass transition temperature (Tg) is lowered by setting the terminal structure of the polycarbonate resin to a specific structure. By combining this polycarbonate resin and conductive filler in a predetermined ratio to form a resin composition, pocket molding can be performed in a relatively low temperature region as in the case of a polyester alloy film, and the appearance is small with no lumps (lumps). The present inventors have found that it is possible to provide a film for a carrier tape that has a good thickness.

That is, the present invention has the characteristics described below.
[1] A resin containing 50 to 95% by mass of a polycarbonate resin having a terminal structure represented by the following general formula (1) and a structural unit derived from an aromatic dihydroxy compound, and 5 to 30% by mass of a conductive filler Composition.

(Where
R ₁ represents an alkyl group having 8 to 36 carbon atoms or an alkenyl group having 8 to 36 carbon atoms,
R _{2 to} R ₅ each independently represent hydrogen, halogen, an alkyl group having 1 to 20 carbon atoms that may have a substituent, or an aryl group having 6 to 12 carbon atoms that may have a substituent. And each of the substituents is independently a halogen, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 12 carbon atoms. )
[2] The resin composition according to [1], wherein the structural unit derived from the aromatic dihydroxy compound has a structural formula represented by the following formula (2).

[Where,
R _{6 to} R ₉ are each independently hydrogen, halogen, an optionally substituted alkyl group having 1 to 20 carbon atoms, an optionally substituted alkoxy group having 1 to 5 carbon atoms, or a substituent. An aryl group having 6 to 12 carbon atoms which may have a group, an aralkyl group having 7 to 17 carbon atoms which may have a substituent, or an alkenyl having 2 to 15 carbon atoms which may have a substituent Represents the group,
Each of the substituents is independently a halogen, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 12 carbon atoms,
X is —O—, —S—, —SO—, —SO ₂ —, —CO—, or any linking group represented by the following formulas (3) to (6).

[In Formula (3),
R ₁₀ and R ₁₁ are each independently hydrogen, halogen, or an optionally substituted alkyl group having 1 to 20 carbon atoms, an optionally substituted alkoxy group having 1 to 5 carbon atoms, A C6-C12 aryl group which may have a substituent, a C2-C15 alkenyl group which may have a substituent, or a C7-C17 which may have a substituent Represents an aralkyl group, or R ₁₀ and R ₁₁ are bonded to each other to form a carbocyclic or heterocyclic ring having 1 to 20 carbon atoms;
c represents an integer of 0 to 20,
In formula (4),
R ₁₂ and R ₁₃ are each independently hydrogen, halogen, or an optionally substituted alkyl group having 1 to 20 carbon atoms, an optionally substituted alkoxy group having 1 to 5 carbon atoms, A C6-C12 aryl group which may have a substituent, a C2-C15 alkenyl group which may have a substituent, or a C7-C17 which may have a substituent Represents an aralkyl group, or R ₁₂ and R ₁₃ are bonded to each other to form a carbocyclic or heterocyclic ring having 1 to 20 carbon atoms;
In formula (5),
R _{14 to} R ₁₇ are each independently hydrogen, halogen, or an optionally substituted alkyl group having 1 to 20 carbon atoms, an optionally substituted alkoxy group having 1 to 5 carbon atoms, A C6-C12 aryl group which may have a substituent, a C2-C15 alkenyl group which may have a substituent, or a C7-C17 which may have a substituent Represents an aralkyl group, or R ₁₄ and R ₁₅ , and R ₁₆ and R ₁₇ are bonded to each other to form a carbocyclic or heterocyclic ring having 1 to 20 carbon atoms;
The substituents in the formulas (3) to (5) are each independently a halogen, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 12 carbon atoms,
In formula (6),
R _{18 to} R ₂₇ are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. ]]
[3] The resin composition according to [2], wherein X is a linking group represented by the above formula (3).
[4] In any one of [1] to [3], R ₁ represents an alkyl group having 12 to 30 carbon atoms or an alkenyl group having 12 to 30 carbon atoms, and R _{2 to} R ₅ are hydrogen. The resin composition as described.
[5] The resin composition according to any one of [1] to [4], wherein the polycarbonate resin has a glass transition temperature of 100 ° C to 135 ° C.
[6] The Q value indicating the melt fluidity of the polycarbonate resin is 1 × 10 ⁻² cm ³ / s to 35 × 10 ⁻² cm ³ / s, according to any one of [1] to [5]. Resin composition.
[7] The resin composition according to any one of [1] to [6], wherein an elongational viscosity of the polycarbonate resin under a strain rate of 0.01 to 5.0 / sec exhibits strain softening properties.
[8] The resin composition according to any one of [1] to [7], wherein the polycarbonate resin has a viscosity average molecular weight of 18,000 to 35,000.
[9] The resin composition according to any one of [1] to [8], wherein the surface resistivity is 10 ¹ Ω / sq to 10 ⁷ Ω / sq in the film shape.
[10] A film comprising the resin composition according to any one of [1] to [9].
[11] The film according to [10], wherein the radius R of the right-angled portion is 3.0 mm or less when thermoformed into a right-angle shape.
[12] The film according to [10] or [11], wherein the surface resistivity is 10 ¹ Ω / sq to 10 ⁷ Ω / sq.
[13] A carrier tape comprising the film according to any one of [10] to [12].
[14] A method for producing the resin composition as described in [1] above, wherein the polycarbonate resin and the conductive filler are charged into a twin screw extruder, the extrusion rate is 50 to 200 kg / h, and the rotation speed is 300 to A method comprising kneading and extruding at 400 rpm to obtain a resin composition.

  Since the polycarbonate resin used in the resin composition according to the present invention is very easy to stretch when thermoformed, particularly when deep drawn, it is possible to faithfully transfer a complicated and minute mold shape. In addition, since the polycarbonate resin has a long-chain end group, it is easy to soften at a high temperature and has a low glass transition temperature (Tg) as compared with a conventional polycarbonate. Compared to a film containing as a main component, low temperature molding is possible in a range lower by 50 ° C. to 20 ° C. Furthermore, by using the film according to the present invention, it is possible to improve the efficiency in pocket processing from the viewpoint of yield and energy consumption.

  Next, although an example of embodiment of this invention is demonstrated, this invention is not limited to the following embodiment.

(Resin composition)
The resin composition according to the present embodiment (hereinafter referred to as “the present resin composition”) includes a polycarbonate resin having a specific terminal structure and a structural unit derived from an aromatic dihydroxy compound in an amount of 50 to 95% by mass, and a conductive filler. 5-30 mass%.

<Polycarbonate resin>
The polycarbonate resin used in the present resin composition has a terminal structure represented by the following general formula (1) and a structural unit derived from an aromatic dihydroxy compound.

(In the formula, R ₁ represents an alkyl group having 8 to 36 carbon atoms or an alkenyl group having 8 to 36 carbon atoms. R _{2 to} R ₅ each independently have hydrogen, halogen, or a substituent. Represents an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 12 carbon atoms which may have a substituent, and the substituent is halogen, an alkyl group having 1 to 20 carbon atoms, or carbon An aryl group having a number of 6 to 12. The upper limit value of the carbon number of R ₁ is preferably 22, and more preferably 18. The lower limit value of the carbon number of R ₁ is preferably 12. R _{2 to} R ₅ are , Preferably, they are hydrogen, a halogen, the C1-C9 alkyl group which may have a substituent, or the C6-C8 aryl group which may have a substituent.)

Preferred embodiments include, for example, an embodiment in which R ₁ represents an alkyl group having 12 to 30 carbon atoms or an alkenyl group having 12 to 30 carbon atoms, and R _{2 to} R ₅ are hydrogen. Includes an embodiment in which R ₁ represents an alkyl group having 12 to 22 carbon atoms or an alkenyl group having 12 to 22 carbon atoms, and R _{2 to} R ₅ are hydrogen.

The structural unit derived from the aromatic dihydroxy compound used in the resin composition preferably has the structural formula shown in the following formula (2).

[Wherein, R _{6 to} R ₉ each independently have hydrogen, halogen, or an optionally substituted alkyl group or substituent having 1 to 20 carbon atoms, preferably 1 to 9 carbon atoms. It may have 1 to 5 carbon atoms, preferably an alkoxy group having 1 to 3 carbon atoms, an optionally substituted aryl group or substituent having 6 to 12 carbon atoms, preferably 6 to 8 carbon atoms. It may represent an aralkyl group having 7 to 17 carbon atoms, preferably 7 to 12 carbon atoms, or an alkenyl group having 2 to 15 carbon atoms, preferably 2 to 5 carbon atoms which may have a substituent.
And each said substituent is a halogen, a C1-C20 alkyl group, or a C6-C12 aryl group each independently.
X is —O—, —S—, —SO—, —SO ₂ —, —CO—, or any one of the linking groups represented by the following formulas (3) to (6). It is a bonding group represented by (3).

[In Formula (3), R ₁₀ and R ₁₁ are each independently hydrogen, halogen, or an optionally substituted alkyl group or substituent having 1 to 20 carbon atoms, preferably 1 to 9 carbon atoms. A C1-C5 alkoxy group, preferably a C1-C3 alkoxy group, a C6-C12 aryl group that may have a substituent, preferably a C6-C8 aryl group, a substituent An aralkyl group having 2 to 15 carbon atoms, preferably 2 to 5 carbon atoms, or 7 to 17 carbon atoms, preferably 7 to 12 carbon atoms, which may have a substituent. Represent. Alternatively, R ₁₀ and R ₁₁ may be bonded to each other to form a carbocyclic or heterocyclic ring having 1 to 20 carbon atoms, preferably 1 to 12 carbon atoms, and c is an integer of 0 to 20, preferably Represents an integer of 1 to 12. ]
[In Formula (4), R ₁₂ and R ₁₃ are each independently hydrogen, halogen, or an optionally substituted alkyl group or substituent having 1 to 20 carbon atoms, preferably 1 to 9 carbon atoms. A C1-C5 alkoxy group, preferably a C1-C3 alkoxy group, a C6-C12 aryl group that may have a substituent, preferably a C6-C8 aryl group, a substituent An aralkyl group having 2 to 15 carbon atoms, preferably 2 to 5 carbon atoms, or 7 to 17 carbon atoms, preferably 7 to 12 carbon atoms, which may have a substituent. Represent. Alternatively, R ₁₂ and R ₁₃ may be bonded to each other to form a carbocyclic or heterocyclic ring having 1 to 20 carbon atoms, preferably 1 to 12 carbon atoms. ]
[In the formula (5), R _{14 to} R ₁₇ are each independently hydrogen, halogen, or an optionally substituted alkyl group or substituent having 1 to 20 carbon atoms, preferably 1 to 9 carbon atoms. A C1-C5 alkoxy group, preferably a C1-C3 alkoxy group, a C6-C12 aryl group that may have a substituent, preferably a C6-C8 aryl group, a substituent An aralkyl group having 2 to 15 carbon atoms, preferably 2 to 5 carbon atoms, or 7 to 17 carbon atoms, preferably 7 to 12 carbon atoms, which may have a substituent. Represent. Alternatively, R ₁₄ and R ₁₅ , and R ₁₆ and R ₁₇ may be bonded to each other to form a carbocyclic or heterocyclic ring having 1 to 20 carbon atoms. ]
[The substituents of the above formulas (3) to (5) are each independently a halogen, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 12 carbon atoms. ]
[In Formula (6), R < ₁₈ > -R < ₂₇ > is a hydrogen atom or a C1-C3 alkyl group each independently. ]]

  In this Embodiment, the addition amount of polycarbonate resin is 50-95 mass% of this resin composition, It is preferable that it is 60-85 mass%, and it is more preferable that it is 65-80 mass%.

  The polycarbonate resin used in the present synthetic resin composition will be described in detail later. An aromatic dihydroxy compound and a terminal terminator, and if necessary, an antioxidant for antioxidant prevention of the aromatic dihydroxy compound, After the reaction, it is obtained by adding a polymerization catalyst and polymerizing. Each raw material will be described below.

[Terminator]
The terminal terminator used in the present invention is represented by the general formula (7).

(In the formula, R _{1 to} R ₅ are the same as those defined in the general formula (1).)

More preferably, the terminal terminator of the general formula (7) is a compound represented by the general formula (8).

(In the formula, R ₁ is the same as defined in the general formula (1)).

  Among the terminal terminators represented by the general formula (7) or the general formula (8), either or both of parahydroxybenzoic acid hexadecyl ester and parahydroxybenzoic acid 2-hexyldecyl ester should be used as the terminal terminator. Is particularly preferred.

For example, when a terminal stopper that is an alkyl group having 16 carbon atoms is used as R ₁ , the resulting polycarbonate resin has excellent glass transition temperature, melt fluidity, moldability, and drawdown resistance, and is a polycarbonate resin produced. The solvent solubility of monohydric phenol is excellent, and it is particularly preferable as a terminal terminator used in the polycarbonate resin of the present invention.

On the other hand, when the carbon number of R _{1 in} the general formula (7) or the general formula (8) is excessively increased, the organic solvent solubility of the end terminator tends to decrease, and the productivity at the time of producing the polycarbonate resin decreases. Sometimes. As an example, if the carbon number of R ₁ is 36 or less, the productivity is high and the economy is good in producing a polycarbonate resin. If the carbon number of R ₁ is 22 or less, the terminal terminator is particularly excellent in organic solvent solubility, and can be very productive in producing a polycarbonate resin, and the economy is also improved. On the other hand, if the carbon number of R _{1 in} the general formula (7) or the general formula (8) is too small, the glass transition temperature of the polycarbonate resin does not become a sufficiently low value, and the thermoformability may be lowered.

Depending on the properties required for the material, it is possible to use the main skeleton and the terminal terminator together with other structures within the range not departing from the gist of the present invention, or to mix with other polycarbonate resins and further transparent resins. Permissible. It is preferable that 80 mol% or more in the total terminal terminator used is a structure represented by the above formula (7), and 90 mol% or more in the total terminal terminator used is a structure represented by the above formula (7). It is more preferable that the terminal stopper used is particularly preferably a structure represented by the above formula (7).
Other end terminators that may be used in combination include phenol, p-cresol, o-cresol, 2,4-xylenol, p-t-butylphenol, o-allylphenol, p-allylphenol, p-hydroxystyrene, p-hydroxy-α-methylstyrene, p-propylphenol, p-cumylphenol, p-phenylphenol, o-phenylphenol, p-trifluoromethylphenol, p-nonylphenol, p-dodecylphenol, eugenol, amylphenol Alkylphenols such as hexylphenol, heptylphenol, octylphenol, nonylphenol, decylphenol, dodecylphenol, myristylphenol, palmitylphenol, stearylphenol, behenylphenol, paraffin Methyl ester of proxy benzoic acid, ethyl ester, propyl ester, butyl ester, amyl ester, hexyl esters, parahydroxybenzoic acid alkyl esters such as heptyl ester. It is also possible to use two or more of the above monohydric phenols in combination.

  Depending on the synthesis conditions, end groups can be formed that remain phenolic OH groups that do not react with the end-stopper. The fewer phenolic OH groups, the better. Specifically, 80 mol% or more of all terminal groups are preferably sealed with a structure represented by the above formula (1), and 90 mol% or more of all terminal groups are represented by the above formula (1). It is particularly preferred that the structure is sealed.

(Degree of polymerization and amount of end stopper used)
The molecular weight of the polycarbonate resin used in the present invention is controlled by the amount of the end stopper used. The degree of polymerization of the structural unit derived from the aromatic dihydroxy compound shown in the general formula (2) used for the main skeleton and the amount of the terminal terminator used are shown in the formula (A).

Based on this formula, the usage amount of the terminal terminator and the aromatic dihydroxy compound is determined, but the preferred range of the usage amount (mol) of the aromatic dihydroxy compound: the usage amount (mol) of the end terminator is 50: 1 to 1. 15: 1, more preferably in the range of 30: 1 to 20: 1.

  In order to obtain a branched polycarbonate resin, phloroglucin, 4,6-dimethyl-2,4,6-tris (4-hydroxyphenyl) heptene-2, 4,6-dimethyl-2,4,6-tris (4- Hydroxyphenyl) heptane, 2,6-dimethyl-2,4,6-tris (4-hydroxyphenyl) heptene-3, 1,3,5-tris (4-hydroxyphenyl) benzene, 1,1,1-tris A polyhydroxy compound represented by (4-hydroxyphenyl) ethane or the like, or 3,3-bis (4-hydroxyaryl) oxindole (= isatin bisphenol), 5-chlorisatin bisphenol, 5,7-dichloro Louisatetin bisphenol, 5-bromoisatin bisphenol and the like may be used as a part of the above-mentioned end terminator, The preferred amount of the compound to the total amount of the end terminator is 0.01 to 10 mol%, more preferably 0.1 to 3 mol%.

[Aromatic dihydroxy compounds]
The aromatic dihydroxy compound used in the structural unit derived from the aromatic dihydroxy compound used in the present resin composition is not particularly limited as long as it is a compound having two hydroxyphenyl groups. The compound shown by Formula (9) is mentioned.

(In the formula, R _{6 to} R ₉ and X are the same as those defined in the general formula (2).)

  Examples of the compound represented by the general formula (9) include 2,2-bis (4-hydroxyphenyl) propane [= bisphenol A], bis (4-hydroxyphenyl) -p-diisopropylbenzene, 4,4′- Dihydroxydiphenyl, 2,2-bis (4-hydroxy-3,5-dimethylphenyl) propane, 2,2-bis (4-hydroxy-3-methylphenyl) propane, 2,2-bis (4-hydroxy-3) , 5-diethylphenyl) propane, 2,2-bis (4-hydroxy-3,5-diphenylphenyl) propane, 2,2-bis (4-hydroxy-3,5-dibromophenyl) propane, 2,2- Bis (4-hydroxyphenyl) pentane, 2,4′-dihydroxy-diphenylmethane, bis- (4-hydroxyphenyl) methane, bi Su- (4-hydroxy-3-nitrophenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 3,3-bis (4-hydroxyphenyl) pentane, 1,1-bis (4-hydroxyphenyl) ) Cyclohexane [= bisphenol Z], bis (4-hydroxyphenyl) sulfone, 2,4′-dihydroxydiphenylsulfone, bis (4-hydroxyphenyl) sulfide, 4,4′-dihydroxydiphenyl ether, 4,4′-dihydroxy- 3,3′-dimethyldiphenyl ether, 4,4′-dihydroxy-2,5-diethoxydiphenyl ether, 1-phenyl-1,1-bis (4-hydroxyphenyl) ethane, 1,1-bis (4-hydroxy- 3-methylphenyl) cyclohexane, 1-phenyl-1,1-bis (4 Hydroxy-3-methylphenyl) ethane, bis (4-hydroxyphenyl) diphenylmethane, 9,9-bis (4-hydroxyphenyl) fluorene, 9,9-bis (4-hydroxy-3-methylphenyl) fluorene, 2, 2-bis (4-hydroxyphenyl) hexafluoropropane and the like can be mentioned, and bis (4-hydroxyphenyl) alkanes are preferable, and 2,2-bis (4-hydroxyphenyl) is particularly preferable. Propane [bisphenol A]. These aromatic dihydroxy compounds can be used alone or in admixture of two or more. Further, as a part of the aromatic dihydroxy compound, a compound in which one or more tetraalkylphosphonium sulfonates are bonded to the above aromatic dihydroxy compound, or a polymer or oligomer having a siloxane structure and containing both terminal phenolic OH groups, etc. You may use together.

  In order to obtain a branched polycarbonate resin as the polycarbonate resin forming the resin composition, phloroglucin, 4,6-dimethyl-2,4,6-tris (4-hydroxyphenyl) heptene-2, 4,6-dimethyl is used. -2,4,6-tris (4-hydroxyphenyl) heptane, 2,6-dimethyl-2,4,6-tris (4-hydroxyphenyl) heptene-3, 1,3,5-tris (4-hydroxy A polyhydroxy compound represented by phenyl) benzene, 1,1,1-tris (4-hydroxyphenyl) ethane, or the like, or 3,3-bis (4-hydroxyaryl) oxindole (= isatin bisphenol), 5 -Chlorisatin bisphenol, 5,7-dichloroisatin bisphenol, 5-bromoisatin bisphenol Etc. may be used as part of the aromatic dihydroxy compound described above, and the preferred amount of the compound used relative to the total amount of the aromatic dihydroxy compound is 0.01 to 10 mol%, more preferably 0.1 to 3 mol%. It is.

[Carbonate binder]
Examples of the carbonate binder of the present invention include phosgene, triphosgene, carbonic acid diester, and carbonyl compounds such as carbon monoxide and carbon dioxide.

  Examples of carbonic acid diesters include substitution of dialkyl carbonate compounds such as dimethyl carbonate, diethyl carbonate, and di-tert-butyl carbonate, diphenyl carbonate or di-p-tolyl carbonate, phenyl-p-tolyl carbonate, and di-p-chlorophenyl carbonate. Examples include diphenyl carbonate. Of these, diphenyl carbonate and substituted diphenyl carbonate are preferable, and diphenyl carbonate is particularly preferable. These carbonic acid diester compounds can be used alone or in admixture of two or more.

<Conductive filler>
The resin composition according to the present invention contains a conductive filler. Examples of such a conductive filler include carbon black and carbon fiber. Examples of carbon black include furnace black, channel black, ketjen black, and acetylene black. The furnace black, for example, Timcal Co. Ensako 250G (oil ^{absorption: 190cm 3 / 100g, pH:} 8~11, volatiles: Up to 0.2 wt%), manufactured by Mitsubishi Chemical Corporation 3400 b (DBP oil absorption: 175cm ³ /100g,pH:6.2, volatile matter: 1.0 wt%) and 3050B (DBP oil ^absorption: 175cm 3 ^{/100g,pH:7.0,} volatile matter: 0.5 wt%), Tokai carbon # 4500 Ltd. (DBP oil ^absorption: 168cm 3 ^{/100g,pH:6.0,} volatile matter: 0.6 wt%) and # 5500 (DBP oil ^absorption: 155cm 3 ^{/100g,pH:6.0,} volatiles: 1.4 wt%) and F200 (DBP oil absorption of Asahi carbon Co., ^Ltd.: 180cm 3 ^{/100g,pH:6.5,} volatile content: 0.7 wt%) and X-015 (DBP oil ^absorption: 147cm 3 ^{/100g,pH:6.5,} volatile content: 1.5 wt%), Orion Corp. HIBRACK40B2 (DBP oil ^absorption: 153cm 3/100 g), and the like. The Ketjen black, for example, Ketjen Black International Ltd. of Ketjen Black EC (DBP oil ^absorption: 360cm 3 ^{/100g,pH:9.0,} volatile matter: 0.5 wt%), and the like. The acetylene black, for example, Denka Black manufactured by DENKA Co., Ltd. (DBP oil ^{absorption: 160cm 3 / 100g, pH:} 9~10, volatile matter: 0.16 wt%), and the like. Incidentally, among these carbon blacks, and a DBP oil absorption 130 cm ^3/100 g or more, and, in the carbon black (the commercially available pH of 8 or more, Denka Black manufactured by DENKA Co., ketjen black International Ketjen Black EC and Timcal Ensaco 250G are particularly preferred). This is because such a carbon black has a sufficiently low moisture absorption because of its nature, and therefore does not require any special drying treatment. Among these, carbon black having a volatile content of 0.3% by mass or less (in the above-mentioned commercially available products, Denka Black manufactured by Denki Kagaku Kogyo Co., Ltd. and Ensaco 250G manufactured by Timcal Co., Ltd. is more preferable). In the present application, the DBP oil absorption is measured in accordance with JIS K6221, JIS K6217 or ASTM D2414, the paraffin oil absorption is measured in accordance with ASTM D2414, and the pH value is determined by conducting carbon black and distillation. The mixture with water is obtained by measuring with a glass electrode pH meter, and the volatile content is obtained by measuring the weight loss when the conductive carbon black is heated at 950 ° C. for 7 minutes. Carbon black is preferably added to the polycarbonate resin after sufficiently drying.

  In this Embodiment, the addition amount of a conductive filler is 5-30 mass% of this resin composition, It is preferable that it is 10-25 mass%, and it is more preferable that it is 12-22 mass%.

<Optional additives>
Various additives may be blended in the resin composition of the present invention without departing from the spirit of the present invention. Examples of the additive include at least one additive selected from the group consisting of a heat stabilizer, an antioxidant, a flame retardant, a flame retardant aid, an ultraviolet absorber, a release agent, and a colorant. Further, as long as desired physical properties are not significantly impaired, a fluorescent whitening agent, an antifogging agent, a fluidity improving agent, a plasticizer, a dispersing agent, an antibacterial agent and the like may be added.

  Examples of the heat stabilizer include phenol-based, phosphorus-based, and sulfur-based heat stabilizers. Specifically, phosphorus oxoacids such as phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, polyphosphoric acid; acidic pyrophosphate metal salts such as acidic sodium pyrophosphate, acidic potassium pyrophosphate, acidic calcium pyrophosphate; potassium phosphate , Sodium phosphate, cesium phosphate, zinc phosphate, etc., Group 1 or Group 10 metal phosphates; organic phosphate compounds, organic phosphite compounds, organic phosphonite compounds, and the like. Alternatively, a phosphite compound (a), phosphorous acid (b) and tetrakis esterified with phenol and / or phenol having at least one alkyl group having 1 to 25 carbon atoms in at least one ester in the molecule Mention may be made of at least one selected from the group of (2,4-di-tert-butylphenyl) -4,4′-biphenylene-di-phosphonite (c). Specific examples of the phosphite compound (a) include trioctyl phosphite, trioctadecyl phosphite, tridecyl phosphite, trilauryl phosphite, tristearyl phosphite, triphenyl phosphite, tris (monononylphenyl) phos Phyto, Tris (monononyl / dinonyl phenyl) phosphite, Trisnonyl phenyl phosphite, Tris (octylphenyl) phosphite, Tris (2,4-di-tert-butylphenyl) phosphite, Trinonyl phosphite, Didecyl Monophenyl phosphite, dioctyl monophenyl phosphite, diisopropyl monophenyl phosphite, monobutyl diphenyl phosphite, monodecyl diphenyl phosphite, bis (2,4-di-tert-butyl) Ruphenyl) pentaerythritol phosphite, bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol phosphite, monooctyl diphenyl phosphite, distearyl pentaerythritol diphosphite, tricyclohexyl phosphite, diphenylpenta Erythritol diphosphite, bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, 2,2-methylenebis (4,6-di-tert-butylphenyl) octyl phosphite, bis (Nonylphenyl) pentaerythritol diphosphite, bis (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, bis (2,6-di-tert-butyl-4-ethylphenyl) Mention may be made of pentaerythritol diphosphite and the like. These may be used alone or in combination of two or more.

  Specific examples of the organic phosphite compound include, for example, “ADEKA STAB 1178”, “ADEKA STAB 2112”, “ADEKA STAB HP-10” manufactured by ADEKA Co., Ltd., “JP- 351 ”,“ JP-360 ”,“ JP-3CP ”,“ Irgaphos 168 ”manufactured by Ciba Specialty Chemicals, and the like.

  Examples of the organic phosphate compound include trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, triphenyl phosphate, tricresyl phosphate, tris (nonylphenyl) phosphate, 2-ethylphenyl diphenyl phosphate, and the like.

  When added, the heat stabilizer is added in an amount of, for example, 0.001% by mass or more, preferably 0.01% by mass or more, more preferably 0.03% by mass or more. It is not more than mass%, preferably not more than 0.7 mass%, more preferably not more than 0.5 mass%. If the amount of the heat stabilizer is too small, the heat stabilizing effect may be insufficient. If the amount of the heat stabilizer is too large, the effect may reach a peak and may not be economical.

  Examples of the antioxidant include phenolic antioxidants, hindered phenolic antioxidants, bisphenolic antioxidants, polyphenolic antioxidants, and the like. Specifically, 2,6-di-tert-butyl-4-methylphenol, tris (3,5-di-tert-butyl-4-hydroxybenzyl) isocyanurate, n-octadecyl-3- (3 ′, 5'-di-tert-butyl-4'-hydroxyphenyl) propionate, tetrakis [methylene-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] methane, 4,4'-butylidenebis- (3-methyl-6-tert-butylphenol), triethylene glycol-bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate], 3,9-bis {2- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy] -1,1-dimethylethyl} 2,4,8,10-tetraoxaspiro [5,5] undecane, pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], thiodiethylenebis [3- ( 3,5-di-tert-butyl-4-hydroxyphenyl) propionate], N, N′-hexane-1,6-diylbis [3- (3,5-di-tert-butyl-4-hydroxyphenylpropionamide) ), 2,4-dimethyl-6- (1-methylpentadecyl) phenol, diethyl [[3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methyl] phosphoate, 3,3 ′, 3 ", 5,5 ', 5" -hexa-tert-butyl-a, a', a "-(mesitylene-2,4,6-triyl) tri-p-alkyl Sol, 4,6-bis (octylthiomethyl) -o-cresol, ethylenebis (oxyethylene) bis [3- (5-tert-butyl-4-hydroxy-m-tolyl) propionate], hexamethylenebis [3 -(3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 1,3,5-tris (3,5-di-tert-butyl-4-hydroxybenzyl) -1,3,5- Triazine-2,4,6 (1H, 3H, 5H) -trione, 2,6-di-tert-butyl-4- (4,6-bis (octylthio) -1,3,5-triazin-2-ylamino ) Phenol etc. Specific examples of phenolic antioxidants include “Irganox 1010” (manufactured by Ciba Specialty Chemicals) Recorded trademark, hereinafter the same), "Irganox 1076", ADEKA made "STAB AO-50", Ltd., and the like can be given "ADK STAB AO-60".

  When added, the proportion of addition of the antioxidant is, for example, 0.001% by mass or more, preferably 0.01% by mass or more, and 1% by mass or less, preferably 0.5% by mass of the resin composition. It is as follows. If the addition ratio of the antioxidant is too small, the effect as an antioxidant may be insufficient, and if the addition ratio of the antioxidant is too large, the effect reaches a peak and may not be economical. is there.

  Examples of the flame retardant include organic sulfonic acid metal salts. Examples of the organic sulfonic acid metal salts include aliphatic sulfonic acid metal salts and aromatic sulfonic acid metal salts. These may be used alone or in combination of two or more. Moreover, as a metal salt, an alkali metal salt and an alkaline-earth metal salt are preferable. Examples of the alkali metal include sodium, lithium, potassium, rubidium, and cesium. Examples of alkaline earth metals include calcium and strontium. The preferred metal of the organic sulfonic acid metal salt used in the present invention is an alkali metal such as sodium, potassium, rubidium and cesium, more preferably sodium and potassium. By adopting such a metal, it is possible to effectively promote formation of a carbonized layer during combustion and maintain high transparency.

  The aliphatic sulfonic acid metal salt is preferably a fluoroalkane-sulfonic acid metal salt, more preferably a perfluoroalkane-sulfonic acid metal salt. In addition, examples of the fluoroalkane-sulfonic acid metal salt include alkali metal salts and alkaline earth metal salts, and among them, alkali metal salts are preferable. As carbon number of a fluoroalkanesulfonic acid metal salt, 1-8 are preferable and 2-4 are more preferable. By setting it as such a range, the effect that high transparency can be maintained is acquired. Specific examples of preferred fluoroalkane-sulfonic acid metal salts include perfluorobutane-sodium sulfonate, potassium perfluorobutane-sulfonate, sodium perfluoroethane-sulfonate, potassium perfluoroethane-sulfonate, and the like. it can.

  Examples of the aromatic sulfonic acid metal salt include alkali metal salts and alkaline earth metal salts, and alkali metal salts are preferable. Specific examples of the aromatic sulfonesulfonic acid alkali metal salt include 3,4-dichlorobenzenesulfonic acid sodium salt, 2,4,5-trichlorobenzenesulfonic acid sodium salt, benzenesulfonic acid sodium salt, diphenylsulfone-3-sulfone. Sodium salt of acid, potassium salt of diphenylsulfone-3-sulfonic acid, sodium salt of 4,4'-dibromodiphenyl-sulfone-3-sulfonic acid, potassium of 4,4'-dibromophenylsulfone-3-sulfonic acid Salt, disodium salt of diphenylsulfone-3,3'-disulfonic acid, dipotassium salt of diphenylsulfone-3,3'-disulfonic acid, sodium salt of dodecylbenzenesulfonic acid, potassium salt of dodecylbenzenesulfonic acid, p-toluenesulfonic acid Potassium salt, p-styrene Sulfonic potassium salt and the like.

  The organic sulfonic acid metal salt that can be used in the resin composition according to the present invention is, in particular, from the viewpoint of improving transparency, diphenylsulfone-3-sulfonic acid potassium salt, p-toluenesulfonic acid potassium salt, p-styrene. Sulfonic acid potassium salt and dodecylbenzenesulfonic acid potassium salt are preferable, and potassium salt of diphenylsulfone-3-sulfonic acid is more preferable. The added mass of the organic sulfonic acid metal salt is preferably 0.005% by mass to 0.1% by mass of the resin composition, more preferably 0.01% by mass to 0.1% by mass, and still more preferably. Is 0.03% by mass to 0.09% by mass. Moreover, in this invention, you may mix | blend flame retardants other than organic sulfonic acid metal salt.

  For example, a silicone compound can be added as a flame retardant aid. As a silicone compound, what has a phenyl group in a molecule | numerator is preferable. By having a phenyl group, the dispersibility of the silicone compound in the polycarbonate is improved, and the transparency and flame retardancy are excellent. A preferable mass average molecular weight of the silicone compound is 450 to 5000, and preferably 750 to 4000, more preferably 1000 to 3000, and particularly preferably 1500 to 2500. By making the mass average molecular weight 450 or more, the production becomes easy, the adaptation to industrial production becomes easy, and the heat resistance of the silicone compound is hardly lowered. Conversely, by setting the mass average molecular weight of the silicone compound to 5000 or less, the dispersibility in the polycarbonate resin composition is less likely to be lowered, and the flame retardancy and the mechanical properties in the polycarbonate resin composition are more effectively reduced. It tends to be suppressed.

  When added, the flame retardant auxiliary is added in an amount of, for example, 0.1% by mass or more, preferably 0.2% by mass or more, and 7.5% by mass or less, preferably 5% by mass of the resin composition. It is as follows. If the addition rate of the flame retardant aid is too small, the flame retardancy may be insufficient, and if the addition rate of the flame retardant aid is too high, appearance defects such as delamination will occur and transparency will be reduced. The flame retardancy will reach its peak and may not be economical.

  UV absorbers include inorganic UV absorbers such as cerium oxide and zinc oxide, as well as benzotriazole compounds, benzophenone compounds, salicylate compounds, cyanoacrylate compounds, triazine compounds, oxanilide compounds, malonic ester compounds, hindered amine compounds, and phenyl salicylates. Organic ultraviolet absorbers such as organic compounds. Of these, benzotriazole-based and benzophenone-based organic ultraviolet absorbers are preferred. In particular, specific examples of benzotriazole compounds include 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2- [2′-hydroxy-3 ′, 5′-bis (α, α-dimethylbenzyl). Phenyl] -benzotriazole, 2- (2′-hydroxy-3 ′, 5′-di-tert-butyl-phenyl) -benzotriazole, 2- (2′-hydroxy-3′-tert-butyl-5′-) Methylphenyl) -5-chlorobenzotriazole, 2- (2′-hydroxy-3 ′, 5′-di-tert-butyl-phenyl) -5-chlorobenzotriazole), 2- (2′-hydroxy-3 ′ , 5′-di-tert-amyl) -benzotriazole, 2- (2′-hydroxy-5′-tert-octylphenyl) benzotriazole, 2,2′-methylenebis [4- ( , 1,3,3-tetramethylbutyl) -6- (2N-benzotriazol-2-yl) phenol], 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5 -[(Hexyl) oxy] -phenol, 2- [4,6-bis (2,4-dimethylphenyl) -1,3,5-triazin-2-yl] -5- (octyloxy) phenol, 2,2 '-(1,4-phenylene) bis [4H-3,1-benzoxazin-4-one], [(4-methoxyphenyl) -methylene] -propanedioic acid-dimethyl ester, 2- (2H-benzotriazole -2-yl) -p-cresol, 2- (2H-benzotriazol-2-yl) -4,6-bis (1-methyl-1-phenylmethyl) phenol, 2- [5-chloro (2H)- Nzotriazol-2-yl] -4-methyl-6- (tert-butyl) phenol, 2,4-di-tert-butyl-6- (5-chlorobenzotriazol-2-yl) phenol, 2- ( 2H-benzotriazol-2-yl) -4- (1,1,3,3-tetrabutyl) phenol, 2,2'-methylenebis [6- (2H-benzotriazol-2-yl) -4- (1, 1,3,3-tetrabutyl) phenol], [methyl-3- [3-tert-butyl-5- (2H-benzotriazol-2-yl) -4-hydroxyphenyl] propionate-polyethylene glycol] condensate, etc. Can be mentioned. Two or more of these may be used in combination. Of the above, preferably 2- (2′-hydroxy-5′-tert-octylphenyl) benzotriazole, 2,2′-methylene-bis [4- (1,1,3,3-tetramethylbutyl) ) -6- (2N-benzotriazol-2-yl) phenol]. Specific examples of the benzophenone ultraviolet absorber include 2,4-dihydroxy-benzophenone, 2-hydroxy-4-methoxy-benzophenone, 2-hydroxy-4-n-octoxy-benzophenone, 2-hydroxy-4-dodecyloxy- Benzophenone, 2-hydroxy-4-octadecyloxy-benzophenone, 2,2'-dihydroxy-4-methoxy-benzophenone, 2,2'-dihydroxy-4,4'-dimethoxy-benzophenone, 2,2 ', 4 And 4'-tetrahydroxy-benzophenone. Specific examples of phenyl salicylate UV absorbers include phenyl salicylate and 4-tert-butyl-phenyl salicylate. Furthermore, as specific examples of the triazine ultraviolet absorber, 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5-[(hexyl) oxy] -phenol, 2- [4 , 6-bis (2,4-dimethylphenyl) -1,3,5-triazin-2-yl] -5- (octyloxy) phenol and the like. Specific examples of hindered amine ultraviolet absorbers include bis (2,2,6,6-tetramethylpiperidin-4-yl) sebacate.

  The proportion of the ultraviolet absorber added is, for example, 0.01% by mass or more, preferably 0.1% by mass or more, and 3% by mass or less, preferably 1% by mass or less of the resin composition. . If the addition ratio of the UV absorber is too small, the effect of improving the weather resistance may be insufficient. If the addition ratio of the UV absorber is too high, mold deposits and the like occur and mold contamination (cooling roll contamination). ).

Examples of the release agent include carboxylic acid ester, polysiloxane compound, paraffin wax (polyolefin type) and the like. Specific examples include at least one compound selected from the group consisting of aliphatic carboxylic acids, esters of aliphatic carboxylic acids and alcohols, aliphatic hydrocarbon compounds having a number average molecular weight of 200 to 15000, and polysiloxane silicone oils. be able to. Examples of the aliphatic carboxylic acid include saturated or unsaturated aliphatic monovalent, divalent or trivalent carboxylic acid. Here, the aliphatic carboxylic acid includes an alicyclic carboxylic acid. Among these, preferable aliphatic carboxylic acids are monovalent or divalent carboxylic acids having 6 to 36 carbon atoms, and aliphatic saturated monovalent carboxylic acids having 6 to 36 carbon atoms are more preferable. Specific examples of the aliphatic carboxylic acid include palmitic acid, stearic acid, valeric acid, caproic acid, capric acid, lauric acid, arachidic acid, behenic acid, lignoceric acid, serotic acid, melissic acid, tetrariacontanoic acid, montanic acid, Examples include glutaric acid, adipic acid, azelaic acid, and the like. Specific examples of esters of aliphatic carboxylic acids and alcohols include beeswax (a mixture based on myricyl palmitate), stearyl stearate, behenyl behenate, stearyl behenate, glycerin monopalmitate, glycerin monostearate Glycerol distearate, glycerol tristearate, pentaerythritol monopalmitate, pentaerythritol monostearate, pentaerythritol distearate, pentaerythritol tristearate, pentaerythritol tetrastearate and the like. Examples of the aliphatic hydrocarbon having a number average molecular weight of 200 to 15000 include liquid paraffin, paraffin wax, microwax, polyethylene wax, Fischer-Tropsch wax, and α-olefin oligomer having 3 to 12 carbon atoms. Here, the alicyclic hydrocarbon is also included in the aliphatic hydrocarbon. Moreover, these hydrocarbon compounds may be partially oxidized. Among these, paraffin wax, polyethylene wax, or a partial oxide of polyethylene wax is preferable, and paraffin wax and polyethylene wax are more preferable. The number average molecular weight is preferably 200 to 5,000. These aliphatic hydrocarbons may be a single substance or a mixture of components and various molecular weights as long as the main component is within the above range. Examples of the polysiloxane silicone oil include dimethyl silicone oil, phenylmethyl silicone oil, diphenyl silicone oil, and fluorinated alkyl silicone. Two or more of these may be used in combination.
When added, the addition ratio of the release agent is preferably 0.001% by mass or more, more preferably 0.01% by mass or more, and 2% by mass or less, more preferably 1% by mass of the resin composition. It is as follows. If the addition ratio of the release agent is too small, the effect of releasability may not be sufficient, and if the addition ratio of the release agent is too large, degradation of hydrolysis resistance, mold contamination during injection molding, etc. It can happen.

  Examples of the dye / pigment as a colorant include inorganic pigments, organic pigments, and organic dyes. Examples of inorganic pigments include, for example, sulfide pigments such as carbon black, cadmium red, and cadmium yellow; silicate pigments such as ultramarine blue; titanium oxide, zinc white, petal, chromium oxide, iron black, titanium yellow, and zinc-iron. Oxide pigments such as chrome brown, titanium cobalt green, cobalt green, cobalt blue, copper-chromium black, copper-iron black; chromic pigments such as yellow lead and molybdate orange; ferrocyans such as bitumen And pigments. Examples of organic pigments and organic dyes as colorants include phthalocyanine dyes such as copper phthalocyanine blue and copper phthalocyanine green; azo dyes such as nickel azo yellow; thioindigo, perinone, perylene, and quinacridone And condensed polycyclic dyes such as dioxazine, isoindolinone, and quinophthalone; quinoline, anthraquinone, heterocyclic, and methyl dyes. Of these, titanium oxide, carbon black, cyanine, quinoline, anthraquinone, phthalocyanine dyes and the like are preferable from the viewpoint of thermal stability. In addition, 1 type may contain the dye / pigment, and 2 or more types may contain it by arbitrary combinations and a ratio. In addition, dyes and pigments may be used as masterbatches with polystyrene resins, polycarbonate resins, and acrylic resins for the purpose of improving handling during extrusion and improving dispersibility in the resin composition. Good. When added, the proportion of the colorant added is, for example, 1% by mass or less, preferably 0.5% by mass or less, more preferably 0.1% by mass or less of the resin composition. If the addition ratio of the colorant is too large, the impact resistance may not be sufficient.

[Production method of polycarbonate resin]
Examples of the method for producing the polycarbonate resin used in the present invention include various synthesis methods including an interfacial polymerization method, a pyridine method, and a transesterification method.

  In the reaction by the interfacial polymerization method, in the presence of an organic solvent inert to the reaction, an alkaline aqueous solution, the pH is usually kept at 10 or more, and an aromatic dihydroxy compound and a terminal terminator, and if necessary, an aromatic dihydroxy compound A polycarbonate resin can be obtained by reacting with phosgene using an antioxidant for the prevention of oxidation, and then adding a polymerization catalyst such as a tertiary amine or a quaternary ammonium salt and conducting interfacial polymerization. . The addition of the molecular weight regulator is not particularly limited as long as it is from the time of phosgenation to the start of the polymerization reaction. The reaction temperature is 0 to 35 ° C., and the reaction time is several minutes to several hours.

  Examples of the organic solvent inert to the reaction include chlorinated hydrocarbons such as dichloromethane, 1,2-dichloroethane, chloroform, monochlorobenzene and dichlorobenzene, and aromatic hydrocarbons such as benzene, toluene and xylene. be able to. As the terminal terminator, in addition to the compounds listed above, a compound having a monovalent phenolic hydroxyl group can be used in combination as long as the effects of the present invention are not impaired. As a polymerization catalyst, tertiary amines such as trimethylamine, triethylamine, tributylamine, tripropylamine, trihexylamine, pyridine; quaternary ammonium salts such as trimethylbenzylammonium chloride, tetramethylammonium chloride, triethylbenzylammonium chloride, etc. Can be mentioned.

  The reaction by the transesterification method is a transesterification reaction between a carbonic acid diester and an aromatic dihydroxy compound. Usually, the molecular weight and terminal hydroxyl group amount of the desired polycarbonate resin are determined by adjusting the mixing ratio of the carbonic acid diester and the aromatic dihydroxy compound or adjusting the degree of vacuum during the reaction. The amount of terminal hydroxyl groups has a great influence on the thermal stability, hydrolysis stability, color tone, etc. of the polycarbonate resin, and is preferably 1000 ppm or less, more preferably 700 ppm or less in order to have practical physical properties. is there. It is common to use an equimolar amount or more of a carbonic acid diester with respect to 1 mol of the aromatic dihydroxy compound, and it is preferably used in an amount of 1.01-1.30 mol.

  Examples of carbonic acid diesters include substitution of dialkyl carbonate compounds such as dimethyl carbonate, diethyl carbonate, and di-tert-butyl carbonate, diphenyl carbonate or di-p-tolyl carbonate, phenyl-p-tolyl carbonate, and di-p-chlorophenyl carbonate. Examples include diphenyl carbonate. Of these, diphenyl carbonate and substituted diphenyl carbonate are preferable, and diphenyl carbonate is particularly preferable. These carbonic acid diester compounds can be used alone or in admixture of two or more.

When synthesizing a polycarbonate resin by the transesterification method, a transesterification catalyst is usually used. The transesterification catalyst is not particularly limited, but alkali metal compounds and / or alkaline earth metal compounds are mainly used, and supplementary basic boron compounds, basic phosphorus compounds, basic ammonium compounds, or amine-based catalysts It is also possible to use a basic compound such as a compound in combination. In the transesterification reaction using such raw materials, a mixture of dihydric phenol, monohydric phenol (terminal terminator), and carbonic acid diester is supplied to the reactor under melting and reacted at a temperature of 100 to 320 ° C. Finally, there may be mentioned a method in which a melt polycondensation reaction is performed while removing by-products such as aromatic hydroxy compounds under a reduced pressure of 2.7 × 10 ² Pa ( ² mmHg) or less. The melt polycondensation can be carried out batchwise or continuously, but the polycarbonate resin used in the present invention is preferably carried out continuously from the viewpoint of stability and the like. In the transesterification method, it is preferable to use a compound that neutralizes the catalyst, for example, a sulfur-containing acidic compound, or a derivative formed therefrom, as a catalyst deactivator in the polycarbonate resin. The amount is usually 0.5 to 10 equivalents, preferably 1 to 5 equivalents with respect to the alkali metal, and is usually 1 to 100 ppm, preferably 1 to 20 ppm with respect to the polycarbonate resin.

  The flakes of polycarbonate resin can be obtained, for example, by dropping a methylene chloride solution containing a polycarbonate resin obtained by an interfacial polymerization method into warm water kept at 45 ° C. and evaporating and removing the solvent, or The methylene chloride solution containing the polycarbonate resin obtained by the interfacial polymerization method is put into methanol, and the precipitated polymer can be obtained by filtration and drying, or the polycarbonate resin obtained by the interfacial polymerization method The methylene chloride solution containing can be obtained by stirring and grinding with stirring at a kneader while maintaining at 40 ° C., and then removing the solvent with hot water at 95 ° C. or higher.

  If necessary, after isolating the polycarbonate resin based on a well-known method, for example, a well-known strand-type cold cut method (a polycarbonate resin composition once melted is formed into a strand shape, cooled, and then shaped into a predetermined shape. Method of cutting into pellets), Hot cut method of hot cut method in air (Method of cutting polycarbonate resin composition once melted into pellets without touching water in air), Hot cut method in water Polycarbonate resin pellets can be obtained by the hot cut method (a method in which a polycarbonate resin composition once melted is cut in water and simultaneously cooled and pelletized). In addition, it is preferable to dry the obtained polycarbonate resin pellet based on methods, such as drying using a hot air drying furnace, a vacuum drying furnace, and a dehumidification drying furnace as needed.

〔Evaluation method〕
(I) Molecular weight The molecular weight of the polycarbonate resin used for this invention is evaluated by the viscosity average molecular weight (Mv) measured based on the following measurement conditions.

<Viscosity average molecular weight (Mv) measurement conditions>
Measuring instrument: Ubbelohde capillary viscometer Solvent: dichloromethane resin solution concentration: 0.5 g / deciliter Measuring temperature: 25 ° C
Measured under the above conditions, the intrinsic viscosity [η] deciliter / gram is obtained with a Huggins constant of 0.45, and is calculated by the following formula (B).

  The viscosity average molecular weight of the polycarbonate resin contained in the resin composition according to the present invention is preferably 18,000 to 35,000, more preferably 20,500 to 30,000, and particularly preferably 22,000 to 28,000.

Glass transition temperature, melt flowability, and drawdown resistance are physical properties that are affected by molecular weight, and when the molecular weight is in the above range, all of these characteristics show favorable values for the production of sheets, films, and thermoformed bodies.
When the viscosity average molecular weight is larger than 35,000, the melt fluidity may be lowered. Moreover, the glass transition temperature of polycarbonate resin does not become a low value, and thermoformability may fall. When the viscosity average molecular weight is less than 18,000, the drawdown resistance may be lowered.

(II) Elongation Viscosity The elongation viscosity of the polycarbonate resin that forms the synthetic resin film of the present invention is measured using a rheometer under the following conditions.
<Extension viscosity measurement conditions>
Apparatus: Ales manufactured by Rheometrics
Jig: Extensible Viscosity Fixture manufactured by TA Instruments
Measurement temperature: Glass transition temperature of polycarbonate resin + 30 ° C. to + 50 ° C.
Strain rate: 0.01, 1.0, 5.0 / sec
Production of test piece: A sheet having a size of 18 mm × 10 mm and a thickness of 0.7 mm is produced by press molding.

The polycarbonate resin forming the resin composition according to the present invention preferably has a strain softening property in terms of elongation viscosity under a strain rate of 0.01 to 5.0 / sec from a thermoforming viewpoint. Strain softening is defined by plotting the time t (second) on the horizontal axis and the elongational viscosity ηE (Pa · second) of the resin on a logarithmic graph on the horizontal axis under constant strain rate conditions. It is defined as a behavior in which the elongational viscosity decreases, that is, a behavior in which a curve connecting a plurality of points plotted in the log-log graph is a downward slope.
In general, in a specific molding method such as blow molding, foam molding, or vacuum molding, a material having strain hardening property in which the extensional viscosity increases rapidly with time is considered preferable from the viewpoint of molding processability. By having the property, deformation with a uniform thickness is possible at the time of molding. However, when the sheet is deep-drawn and thermoformed into a right-angled shape, if the thermoplastic resin layer has strain-hardening properties, the force of trying to stretch uniformly is generated, so the radius R of the right-angled shape portion Is difficult to approach 0 mm. On the other hand, it is preferable to use the above-described thermoplastic resin having strain softening property because no appearance defects such as whitening and cracks occur and the radius R of the right-angled portion shows a value close to 0 mm.

  Although not being bound by theory, the polycarbonate resin used in the present invention has strain softening properties because it has a long-chain end group represented by the above general formula (1). it is conceivable that. This is because, for example, a polycarbonate resin having an alkyl group or an alkenyl group having 8 or more carbon atoms as a long-chain end group softens at a higher temperature than a conventional polycarbonate having a lower carbon end group. It is expected to be easier. For this reason, it is presumed that the above-mentioned effect is recognized without requiring much heat to be applied to the polycarbonate resin at the time of molding.

(III) Glass transition temperature The glass transition temperature of the polycarbonate resin used in the present invention is measured using a differential scanning calorimeter under the following conditions.
<Measurement conditions for glass transition temperature>
Measuring instrument: Differential scanning calorimeter (DSC)
Heating rate: 10 ° C / min
Gas flow environment: Nitrogen 20ml / min
Sample pretreatment: 300 ° C heat melting

The polycarbonate resin used in the present invention preferably has a glass transition temperature in the range of 100 ° C. to 135 ° C. from the viewpoint of production and molding of a thermoformed article. From the balance between the production of the thermoformed body, the molding and the productivity of the polycarbonate resin, the polycarbonate resin of the present invention preferably has a glass transition temperature in the range of 110 ° C to 130 ° C, more preferably in the range of 115 ° C to 130 ° C. It is particularly preferred that
When the glass transition temperature (Tg) is less than 100 ° C., the production of the polycarbonate resin may cause the polycarbonate resin powder to agglomerate in the granulation and drying steps, resulting in a decrease in productivity. Also, if the granulation and drying conditions are such that the polycarbonate resin powder does not agglomerate even if the glass transition point is less than 100 ° C., the residual solvent content in the polycarbonate resin powder may be extremely high, which may cause problems during extrusion molding. It may become.
For the above reasons, the higher the glass transition point, the wider the process margin in the production of polycarbonate resin, and the high-quality polycarbonate resin with low residual solvent content can be produced efficiently and stably. The glass transition point is more preferably 105 ° C. or higher, and particularly preferably 110 ° C. or higher.
When Tg is higher than 135 ° C., it is necessary to melt the resin at a high temperature when manufacturing the thermoformed body, and it is necessary to soften or melt the resin at a high temperature when forming the thermoformed body into a specific shape. , Energy consumption may increase and resin hue may decrease. Therefore, the glass transition temperature is preferably 135 ° C. or lower.

(IV) Capacity flow rate (Q value)
The melt fluidity of the polycarbonate resin used in the present invention is evaluated by a volume flow rate (Q value) measured under the following conditions using a Koka flow tester. A high Q value indicates a high melt fluidity, and a low Q value indicates a low melt fluidity.
<Q value measurement conditions>
Measuring device: Flow characteristic evaluation device Flow tester Load: 160 kgf / cm ²
Orifice: 1mm diameter x 10mm length
Measurement temperature: 280 ° C

When the Q value of the polycarbonate resin measured under the above measurement conditions is less than 1 × 10 ⁻² cc / s, even if the glass transition temperature is low, the melt fluidity is too low. Must be manufactured and molded, which may cause degradation of the polycarbonate resin and deterioration of hue.

Conversely, when the Q value of the polycarbonate resin measured under the above measurement conditions is 35 × 10 ⁻² cc / s or more, the melt fluidity is too high and the drawdown resistance is low, which is remarkable when molding a thermoformed article. Drawdown may occur and cause molding defects. For the above reasons, the Q value of the polycarbonate resin of the present invention is preferably in the range of 1 × 10 ⁻² cc / s to 35 × 10 ⁻² cc / s, and preferably 2 × 10 ⁻² cc / s to 30 ×. A range of 10 ⁻² cc / s is particularly preferable.

(V) Thermal weight loss The thermal decomposition characteristics of the polycarbonate resin used in the present invention are evaluated at the thermal weight loss temperature. Using a thermal mass measuring device (TGA), the heat loss temperature is measured at a heating rate of 20 ° C./min and in an air flow of 50 ml / min.

  In order to evaluate the thermal decomposability during the production and molding of a thermoformed article containing the polycarbonate resin used in the present invention, it is preferable to use 0.2% heat loss temperature as an index. The 0.2% heat loss temperature of the polycarbonate resin used in the present invention is preferably 260 ° C. or higher, more preferably 280 ° C. or higher, and particularly preferably 300 ° C. or higher. By setting it as such a range, good thermoformed bodies, such as an external appearance, a hue, and mechanical strength, can be obtained, without a polycarbonate resin thermally decomposing at the time of manufacture and shaping | molding of a thermoformed body.

(VI) Conductivity (surface resistivity)
The surface resistivity of the film containing the resin composition according to the present invention is measured at five points in the width direction of the film. Further, the dispersibility of carbon in the film can be evaluated based on the surface resistivity at that time. Surface resistivity at the film shape of the resin composition according to the invention is preferably from ^{10 1 Ω / sq~10 7 Ω /} sq, and more preferably ^{10 1 Ω / sq~10 5 Ω /} sq.
The surface resistivity is calculated according to JIS K 7194 using the following formula.
Surface resistivity: ρs [Ω / sq] = R [Ω] × RCF
Note that RCF in the equation is a resistivity correction coefficient and varies depending on the shape of the sample and the position to be measured, and is calculated using the following Poisson equation.

(VII) Thermal formability (Deep drawability, right-angle formability)
Evaluation of heat-shaping property is performed by cutting a film containing the resin composition into a predetermined size, preheating the obtained sample to a temperature equal to or higher than Tg of the polycarbonate resin in the composition, and using high-pressure air at the temperature. It can be evaluated by performing pressure air forming using a right-angle mold with a predetermined deep drawing height.

[Method for producing resin composition]
The resin composition according to the present invention can be obtained by kneading the polycarbonate resin and a conductive filler. Kneading can be carried out by any method, but when a polycarbonate resin and a conductive filler are put into a twin-screw extruder and kneaded and extruded at an extrusion rate of 50 to 200 kg / h and a rotational speed of 300 to 400 rpm, carbon dispersion It is preferable because the conductivity is improved and the conductive performance is improved accordingly.

[Method for producing film]
The film according to the present invention includes the resin composition according to the present invention. In the present specification, the “film” includes a member that can also be called a “sheet”. The method for producing a film according to the present invention is not particularly limited, but is preferably produced by extrusion from the viewpoint of productivity. For example, the manufacturing method which heat-melts a resin composition with an extruder, extrudes each from the slit-shaped discharge port of T-die, and makes it adhere and solidify to a cooling roll can be mentioned.

  Moreover, it is preferable that the temperature which heat-melts with an extruder shall be 80-150 degreeC higher than the glass transition temperature (Tg) of each resin. Generally, the temperature condition of an extruder for extruding a resin composition containing a polycarbonate resin is usually 230 to 290 ° C, preferably 240 to 280 ° C.

  The die temperature is usually set to 230 to 290 ° C, particularly 250 to 280 ° C, and the forming roll temperature is preferably set to 100 to 190 ° C, particularly 110 to 190 ° C.

  The material constituting the polycarbonate resin in the present invention is preferably filtered and purified by filter treatment. By producing or laminating through a filter, a synthetic resin laminate having few appearance defects such as foreign matters and defects can be obtained. There is no restriction | limiting in particular in the filtration method, Melt filtration, solution filtration, or those combinations can be used. In particular, it is most preferable to perform the filtration at the stage of laminating the film.

  There is no restriction | limiting in particular in the filter to be used, A well-known thing can be used, According to the use temperature of each material, a viscosity, filtration precision, etc., it selects suitably. The filter medium is not particularly limited, but is made of polypropylene, cotton, polyester, viscose rayon or glass fiber nonwoven fabric or roving yarn roll, phenol resin impregnated cellulose, metal fiber nonwoven fabric sintered body, metal powder sintered body, metal fiber weaving Any body or combination thereof can be used. In view of heat resistance, durability, and pressure resistance, a type in which a metal fiber nonwoven fabric is sintered is preferable.

<Film thickness>
The thickness of the film containing the resin composition according to the present invention can be appropriately set within a range in which there is no problem in moldability. However, in general, the thickness of the entire film is preferably 0.1 mm to 0.5 mm.

<Characteristics and use of film>
The polycarbonate resin, which is the main component of the synthetic resin film, can be satisfactorily thermoformed because the elongational viscosity under a strain rate of 0.01 to 5.0 / sec shows strain softening properties. Therefore, by thermoforming using a film containing the resin composition according to the present invention, a thermoformed article having excellent mold transfer accuracy, particularly a thermoformed article having excellent mold transfer accuracy obtained by deep drawing. be able to. From this, the carrier tape containing the film according to the present invention is excellent in heat formability and appearance.
In the present specification, the case where the deep drawing height when forming is 3 mm or more, particularly 5 mm or more is called deep drawing, and the radius of the right-shaped part when forming into a right-angle shape is R. In the case of a film containing the resin composition according to the present invention, the deep drawing height is 5 mm or more, and in a more preferred embodiment, it is possible to prevent cracks when formed into a deep drawing of 7 mm or more and a right angle shape. The radius R of the right-angled shape portion can be at least 3.0 mm or less, and in a more preferred embodiment 1.0 mm or less.

  Next, although the manufacture example about the polycarbonate resin used for this invention is demonstrated, this invention is not limited to these manufacture examples.

(Synthesis of terminal terminator)
<Synthesis Example 1>
Based on the description on pages 143 to 150 of the Organic Chemistry Handbook (3rd edition: Synthetic Organic Chemistry Association: Issued by Technical Hall), 4-hydroxybenzoic acid manufactured by Tokyo Chemical Industry Co., Ltd. and Tokyo Chemical Industry Co., Ltd. 1-Hexadecanol was used for esterification by dehydration reaction to obtain parahydroxybenzoic acid hexadecyl ester (CEPB).

[Synthesis of polycarbonate resin]
<Production Example 1>
7.1 kg (31.14 mol) of bisphenol A (hereinafter referred to as BPA) manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd. and 30 g of hydrosulfite were dissolved in 57.2 kg of a 9 w / w% sodium hydroxide aqueous solution. To this, 40 kg of dichloromethane was added, and while stirring, 4.33 kg of phosgene was blown in over 30 minutes while maintaining the solution temperature in the range of 15 ° C to 25 ° C.

  After completion of the phosgene blowing, a solution of 6 kg of 9 w / w% aqueous sodium hydroxide solution, 11 kg of dichloromethane, and 551 g (1.52 mol) of parahydroxybenzoic acid hexadecyl ester (CEPB) as a terminal terminator dissolved in 10 kg of methylene chloride And vigorously stirred to emulsify. Thereafter, 10 ml of triethylamine as a polymerization catalyst was added to the solution, and polymerization was performed for about 40 minutes.

  The polymerization solution was separated into an aqueous phase and an organic phase, the organic phase was neutralized with phosphoric acid, and washing with pure water was repeated until the pH of the washing solution became neutral. The polycarbonate resin powder was obtained by evaporating the organic solvent from the purified polycarbonate resin solution.

  The obtained polycarbonate resin powder was melt kneaded at a cylinder temperature of 260 ° C. using a twin screw extruder with a screw diameter of 35 mm, extruded into a strand shape, and pelletized with a pelletizer.

Using the obtained polycarbonate resin pellets, viscosity average molecular weight, elongational viscosity, glass transition temperature, and Q value measurement were carried out. As a result, the viscosity average molecular weight was 23600, the elongational viscosity showed strain softening properties, and the glass transition temperature was The temperature was 123 ° C. and the Q value was 16.7 × 10 ⁻² cc / s.

  Next, examples and comparative examples of the present invention will be described, but the present invention is not limited to these examples. Various physical property evaluation results are shown in Table 1.

[Preparation of resin composition and film]
In preparing each composition of the examples and comparative examples, the following materials were prepared.
<Component A>
PC-1: Bisphenol A type aromatic polycarbonate, “Iupilon (registered trademark) S-3000N” manufactured by Mitsubishi Engineering Plastics Co., Ltd. Terminal structure: Paratertiary butylphenol (PTBP), Viscosity average molecular weight: 22,500, Glass transition temperature 147 ° C
PC-2: terminal modified special polycarbonate resin of Production Example 1 above, viscosity average molecular weight: 23,600, elongational viscosity: strain softening property, glass transition temperature: 123 ° C.
PC-3: Bisphenol A type aromatic polycarbonate, “Iupilon (registered trademark) E-2000N (terminal structure: paratertiary butylphenol (PTBP))” manufactured by Mitsubishi Engineering Plastics Co., Ltd., and polycyclohexanedimethylene terephthalate resin (polyethylene) A low-crystalline copolymer polyester having a structure in which 65 mol% of ethylene glycol units in terephthalate (PET) are substituted with 1.4-cyclohexanedimethanol (CHDM) (Tg: 86 ° C.) in a mass ratio of 70:30. A polycarbonate-based resin composition obtained by mixing at a ratio of, and melting and kneading while heating to form a polymer alloy. Glass transition temperature: 121 ° C

<Component B>
Conductive carbon black CB-1: Orion Co. HIBLACK (TM) 40B2 (DBP oil ^absorption: 153cm 3 / 100g)
CB-2: manufactured by Mitsubishi Chemical Corporation 3400 b (DBP oil ^absorption: 175cm 3 ^{/100g,pH:6.2,} volatile matter: 1.0 wt%)

<Component C>
Heat stabilizer-1: ADEKA CORPORATION ADK STAB ADK2112
Thermal stabilizer-2: ADEKA Corporation ADK STAB AO-60

[Example 1]
(1) Preparation of pellet 79.9% by mass of PC-2 as component A, 20% by mass of CB-1 as component B, and 0.05% by mass of thermal stabilizer-1 and thermal stabilizer-2 as component C, respectively %, The mixture was put into a twin screw extruder having a cylinder diameter of 58 mm, and kneaded and extruded at 150 kg / h and 380 rpm to produce pellets.

(2) Production of film for carrier tape The pellet obtained as described above is put into a single-screw extruder having a cylinder diameter of 50 mm, and the pellet melt is extruded while being kneaded, and the melt is taken out while being cooled. The film was taken up by a machine to produce a 200 μm thick film.

[Example 2]
(1) Preparation of pellets Using the same twin screw extruder as in Example 1, kneading and extrusion were performed at 100 kg / h and 380 rpm to prepare pellets.

(2) Production of film for carrier tape A film was produced in the same manner as in Example 1.

[Example 3]
(1) Preparation of pellets Using the same twin screw extruder as in Example 1, kneading and extrusion were performed at 120 kg / h and 380 rpm to prepare pellets.

(2) Production of film for carrier tape A film was produced in the same manner as in Example 1.

[Example 4]
(1) Preparation of pellets Pellets were prepared by the same composition and method as in Example 1 except that PC-2 was 77.9 mass% as component A and CB-1 was 22 mass% as component B.

(2) Production of film for carrier tape A film was produced in the same manner as in Example 1.

[Comparative Example 1]
(1) Preparation of pellets Pellets were prepared by the same composition and method as in Example 1 except that component A was PC-1.

(2) Production of film for carrier tape A film was produced in the same manner as in Example 1.

[Comparative Example 2]
(1) Preparation of pellets Pellets were prepared by the same composition and method as in Comparative Example 1 except that Component B was changed to CB-2.

(2) Production of film for carrier tape A film was produced in the same manner as in Example 1.

[Comparative Example 3]
(1) Preparation of pellets Pellets were prepared by the same composition and method as in Example 1 except that component A was changed to PC-3.

(2) Production of film for carrier tape A film was produced in the same manner as in Example 1.

The surface resistivity, deep drawability and right-angle formability of the films obtained from the above Examples and Comparative Examples were evaluated and are shown in Table 1. When evaluating deep drawability, these films were cut into 210 mm (length) × 297 mm (width) × 0.2 mm (thickness), and the obtained sample sheet was at a temperature equal to or higher than Tg of the polycarbonate resin in the composition. And pre-pressurized by using a right-angled mold with 5 MPa high-pressure air at the temperature (see Table 1). The deep drawing was 5 mm, and a right-angle mold was used.
In each sample, the minimum heating temperature necessary for the radius R of the right-angled shape portion to be within 1.3 mm at a deep drawing height of 5 mm or more was confirmed. The surface state (with cracks, whitening, foaming, unevenness, gel, and unevenness) of the obtained molded body was observed, and when none of the cracks, whitening, foaming and unevenness was observed, it was evaluated as “no abnormal appearance”. Clarified which of the above is true when there is an abnormality. In addition, a molded product that was able to be molded without any abnormal appearance and was excellent in thermal formability was comprehensively evaluated as acceptable (“good”). In addition, the measurement of the radius R of the right-angle-shaped part measured the radius R using the contact type contour shape measuring machine CONTOURRECORD2700 / 503 (made by Tokyo Seimitsu Co., Ltd.).

The following was found from the results of the above Examples and Comparative Examples. First, from the surface resistance measurement results of the compositions of Example 1 and Comparative Example 1, the use of the novel polycarbonate used in the product of the present invention for Component A improves the dispersibility of carbon, and accordingly increases the conductive performance. Excellent. In the results of the thermal formability evaluation of the compositions of Examples 1 to 4, the right-angle radius is within 3.0 mm at the molding temperature, and the heat formability is excellent. It was confirmed that the temperature range of the films of Examples 1 to 4 for obtaining the same right-angle radius as the films of Comparative Examples 1 and 2 was lower by about 30 ° C. than Comparative Examples 1 and 2. Thereby, if it was the resin composition by this invention, it has confirmed that the heat shaping in a low temperature range was possible. From the results of Examples 1 to 3, it was confirmed that the conductive performance was improved by increasing the resin kneading degree during pellet production. From the results of Examples 1 to 4, it was confirmed that the conductive performance was improved by increasing the amount of carbon added. It was confirmed that the products of the present invention (Examples) were not inferior to the current products (Comparative Examples 1 and 2) even when thermoforming in a low temperature range was performed on the appearance after heat shaping. From the evaluation results of Examples 1 to 3 and Comparative Example 3, the respective heat-forming properties are at the same level. However, in the appearance evaluation results, gel was generated in Comparative Example 3, and the overall evaluation was poor. From the above, the product of the present invention usually has improved conductive performance as the carbon dispersibility is improved as compared with the conductive film mainly composed of polycarbonate, and the conventional product is composed mainly of polycarbonate even at low temperatures. It has been confirmed that the film has the same level of heat formability as the film produced, and the heat formability in the high temperature range is superior to that of the conventional product.

Claims (14)

A resin composition comprising 50 to 95% by mass of a polycarbonate resin having a terminal structure represented by the following general formula (1) and a structural unit derived from an aromatic dihydroxy compound, and 5 to 30% by mass of a conductive filler.

(Where
R ₁ represents an alkyl group having 8 to 36 carbon atoms or an alkenyl group having 8 to 36 carbon atoms,
R _{2 to} R ₅ each independently represent hydrogen, halogen, an alkyl group having 1 to 20 carbon atoms that may have a substituent, or an aryl group having 6 to 12 carbon atoms that may have a substituent. And each of the substituents is independently a halogen, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 12 carbon atoms. ) The resin composition according to claim 1, wherein the structural unit derived from the aromatic dihydroxy compound has a structural formula represented by the following formula (2).

[Where,
R _{6 to} R ₉ are each independently hydrogen, halogen, an optionally substituted alkyl group having 1 to 20 carbon atoms, an optionally substituted alkoxy group having 1 to 5 carbon atoms, or a substituent. An aryl group having 6 to 12 carbon atoms which may have a group, an aralkyl group having 7 to 17 carbon atoms which may have a substituent, or an alkenyl having 2 to 15 carbon atoms which may have a substituent Represents the group,
Each of the substituents is independently a halogen, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 12 carbon atoms,
X is —O—, —S—, —SO—, —SO ₂ —, —CO—, or any linking group represented by the following formulas (3) to (6).

[In Formula (3),
R ₁₀ and R ₁₁ are each independently hydrogen, halogen, or an optionally substituted alkyl group having 1 to 20 carbon atoms, an optionally substituted alkoxy group having 1 to 5 carbon atoms, A C6-C12 aryl group which may have a substituent, a C2-C15 alkenyl group which may have a substituent, or a C7-C17 which may have a substituent Represents an aralkyl group, or R ₁₀ and R ₁₁ are bonded to each other to form a carbocyclic or heterocyclic ring having 1 to 20 carbon atoms;
c represents an integer of 0 to 20,
In formula (4),
R ₁₂ and R ₁₃ are each independently hydrogen, halogen, or an optionally substituted alkyl group having 1 to 20 carbon atoms, an optionally substituted alkoxy group having 1 to 5 carbon atoms, A C6-C12 aryl group which may have a substituent, a C2-C15 alkenyl group which may have a substituent, or a C7-C17 which may have a substituent Represents an aralkyl group, or R ₁₂ and R ₁₃ are bonded to each other to form a carbocyclic or heterocyclic ring having 1 to 20 carbon atoms;
In formula (5),
R _{14 to} R ₁₇ are each independently hydrogen, halogen, or an optionally substituted alkyl group having 1 to 20 carbon atoms, an optionally substituted alkoxy group having 1 to 5 carbon atoms, A C6-C12 aryl group which may have a substituent, a C2-C15 alkenyl group which may have a substituent, or a C7-C17 which may have a substituent Represents an aralkyl group, or R ₁₄ and R ₁₅ , and R ₁₆ and R ₁₇ are bonded to each other to form a carbocyclic or heterocyclic ring having 1 to 20 carbon atoms;
The substituents in the formulas (3) to (5) are each independently a halogen, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 12 carbon atoms,
In formula (6),
R _{18 to} R ₂₇ are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. ]]   The resin composition according to claim 2, wherein X is a bonding group represented by the formula (3). Wherein _{R 1} is an alkyl group having 12 to 30 carbon atoms, or an alkenyl group having a carbon number of 12 to 30, wherein _R 2 to R ₅ are hydrogen, the resin composition according to any one of claims 1 to 3 .   The resin composition in any one of Claims 1-4 whose glass transition temperature of the said polycarbonate resin is 100 to 135 degreeC. The Q value that indicates the melt flow of the polycarbonate resin is ^{1 × 10 -2 cm 3 / s~35} × 10 -2 cm 3 / s, the resin composition according to any one of claims 1 to 5.   The resin composition according to any one of claims 1 to 6, wherein an elongational viscosity of the polycarbonate resin under a strain rate of 0.01 to 5.0 / sec exhibits strain softening properties.   The resin composition according to any one of claims 1 to 7, wherein the polycarbonate resin has a viscosity average molecular weight of 18,000 to 35,000. The resin composition according to any one of claims 1 to 8, wherein the surface resistivity is 10 ¹ Ω / sq to 10 ⁷ Ω / sq in a film shape.   A film comprising the resin composition according to claim 1.   The film according to claim 10, wherein the radius R of the right-angled portion is 3.0 mm or less when thermoformed into a right-angle shape. The film according to claim 10 or 11, wherein the surface resistivity is 10 ¹ Ω / sq to 10 ⁷ Ω / sq.   A carrier tape comprising the film according to claim 10. A method for producing the resin composition according to claim 1, comprising:
A method characterized in that the polycarbonate resin and the conductive filler are charged into a twin screw extruder, kneaded and extruded at an extrusion rate of 50 to 200 kg / h and a rotation speed of 300 to 400 rpm to obtain a resin composition.