JPWO2017090124A1 - Parts mounting machine - Google Patents

Abstract

In the component mounting machine, the cut and clinching unit (100) is disposed below the circuit substrate (12), and the cut and clinching unit (100) can be moved to an arbitrary position by the operation of the moving device. Has been. In the cut and clinching unit (100), the lead of the lead component inserted into the through hole of the circuit substrate (12) is inserted into the first insertion hole (130) and the second insertion hole (136), and the movable part By sliding (122), the lead is cut and bent. In addition, the protrusion (224) of the component holder (210) inserted into the through hole (229) is positioned on the side of the movable part (122), and the movable part (122) is slid, whereby the protrusion (224) is bent. Thus, in the cut and clinching unit (100), both cutting and bending of the lead and bending of the protrusion (224) can be performed.

Description

  The present invention relates to a component mounting machine capable of mounting a component having a protrusion not electrically connected to a substrate on the substrate in a state where the protrusion is inserted into a through hole formed on the substrate.

  The following patent document describes a technique for mounting a lead component on a substrate by inserting the lead of the lead component into a through hole formed in the substrate.

Japanese Patent Laid-Open No. 5-48296

  According to the technique described in the above patent document, it is possible to appropriately attach the lead component to the substrate. However, since the lead component is a component that is electrically connected to the substrate, the lead is electrically connected to the substrate, but some components that are mounted on the substrate do not require power, and as such In such a component, a protrusion that is not electrically connected to the substrate is inserted into the through-hole of the substrate, thereby being mounted on the substrate. Although there is no description in the above-mentioned patent document regarding the mounting method of a component having a protrusion that is not electrically connected to the substrate, it is desired that such a component is also mounted on the substrate appropriately. . This invention is made | formed in view of such a situation, and the subject of this invention is mounting | wearing a board | substrate with the component which has a projection part which is not electrically connected to a board | substrate appropriately.

  In order to solve the above-described problem, a component mounting machine according to the present invention inserts a component having a non-connecting protrusion that is not electrically connected to a substrate into a through-hole formed in the substrate. A component mounting machine that can be mounted on a substrate in a state where the component mounting machine bends the non-connecting protrusion in a state of being inserted into the through hole, and the bending device is mounted on the substrate. And a moving device that moves in a direction intersecting with the direction in which the through hole extends.

  In the substrate work machine according to the present invention, a bending device for bending a non-connecting protrusion that is not electrically connected to the substrate while being inserted into the through hole of the substrate is disposed below the substrate. The bending device is movable in a direction intersecting with the direction in which the through hole of the substrate extends. As a result, at any position of the substrate, the non-connecting protrusion is bent while being inserted into the through hole of the substrate, so that the component having the non-connecting protrusion is fixed to the substrate and is appropriately mounted on the substrate. It becomes possible.

It is a perspective view which shows a component mounting machine. It is a perspective view which shows a component mounting apparatus. It is a perspective view which shows a cut and clinching apparatus. It is a perspective view which shows a cut and clinching unit. It is sectional drawing which shows a slide body. It is an enlarged view which shows a slide body. It is a block diagram which shows a control apparatus. It is the schematic which shows the cut and clinch unit at the time of cutting | disconnection and bending | flexion of the lead of lead components. It is the schematic which shows the cut and clinch unit at the time of cutting | disconnection and bending | flexion of the lead of lead components. It is the schematic which shows the cut and clinch unit at the time of cutting | disconnection and bending | flexion of the lead of lead components. It is a perspective view of the surface of the circuit base material with which various components were mounted. It is an enlarged view of the leg part of a component holder. It is an expansion perspective view of the back surface of the circuit base material in the state where the component holder and the lead component are mounted. It is the schematic which shows the cut and clinch unit at the time of bending of the projection part of a component holder. It is the schematic which shows FIG. 14 from the viewpoint from upper direction. It is the schematic which shows the cut and clinch unit at the time of bending of the projection part of a component holder. It is the schematic which shows FIG. 16 from the viewpoint from upper direction. It is an expansion perspective view of the back surface of the circuit base material in the state where the component holder and the lead component are mounted. It is the schematic which shows the cut and clinch unit at the time of bending of the projection part of a component holder. It is the schematic which shows FIG. 19 from the viewpoint from upper direction. It is the schematic which shows the cut and clinch unit at the time of bending of the projection part of a component holder. It is the schematic which shows FIG. 21 from the viewpoint from upper direction. It is a top view of the surface of the circuit base material with which various components were mounted. It is a top view of the surface of the circuit base material with which various components were mounted. It is a perspective view of an integral part.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

<Configuration of component mounter>
FIG. 1 shows a component mounter 10. The component mounter 10 is a device for performing a component mounting operation on the circuit substrate 12. The component mounting machine 10 includes an apparatus main body 20, a substrate conveying and holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a component supplying device 30, a loose component supplying device 32, and a cut and clinching device (see FIG. 3). 34 and a control device 36 (see FIG. 7). The circuit substrate 12 includes a circuit board, a three-dimensional structure substrate, and the like, and the circuit board includes a printed wiring board and a printed circuit board.

  The apparatus main body 20 includes a frame portion 40 and a beam portion 42 that is overlaid on the frame portion 40. The substrate conveyance holding device 22 is disposed in the center of the frame portion 40 in the front-rear direction, and includes a conveyance device 50 and a clamp device 52. The conveyance device 50 is a device that conveys the circuit substrate 12, and the clamp device 52 is a device that holds the circuit substrate 12. Thereby, the base material transport and holding device 22 transports the circuit base material 12 and holds the circuit base material 12 fixedly at a predetermined position. In the following description, the conveyance direction of the circuit substrate 12 is referred to as an X direction, a horizontal direction perpendicular to the direction is referred to as a Y direction, and a vertical direction is referred to as a Z direction. That is, the width direction of the component mounting machine 10 is the X direction, and the front-rear direction is the Y direction.

  The component mounting device 24 is disposed in the beam portion 42 and includes two work heads 60 and 62 and a work head moving device 64. As shown in FIG. 2, a suction nozzle 66 is provided at the lower end surface of each work head 60, 62, and the parts are sucked and held by the suction nozzle 66. The work head moving device 64 includes an X direction moving device 68, a Y direction moving device 70, and a Z direction moving device 72. Then, the two working heads 60 and 62 are integrally moved to arbitrary positions on the frame portion 40 by the X-direction moving device 68 and the Y-direction moving device 70. The work heads 60 and 62 are detachably attached to the sliders 74 and 76, and the Z-direction moving device 72 individually moves the sliders 74 and 76 in the vertical direction. That is, the work heads 60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.

  Further, as shown in FIG. 2, the mark camera 26 is attached to the slider 74 so as to face downward, and is moved together with the work head 60 in the X direction, the Y direction, and the Z direction. As a result, the mark camera 26 images an arbitrary position on the frame unit 40. As shown in FIG. 1, the parts camera 28 is disposed between the base material conveyance holding device 22 and the component supply device 30 on the frame portion 40 so as to face upward. Thereby, the parts camera 28 images the components held by the suction nozzles 66 of the work heads 60 and 62.

  The component supply device 30 is disposed at one end of the frame portion 40 in the front-rear direction. The component supply device 30 includes a tray-type component supply device 78 and a feeder-type component supply device (see FIG. 7) 80. The tray-type component supply device 78 is a device that supplies components placed on the tray. The feeder-type component supply device 80 is a device that supplies components by a tape feeder or a stick feeder (not shown).

  The bulk component supply device 32 is disposed at the other end of the frame portion 40 in the front-rear direction. The separated component supply device 32 is a device for aligning a plurality of components scattered in a separated state and supplying the components in an aligned state. That is, it is an apparatus that aligns a plurality of components in an arbitrary posture into a predetermined posture and supplies the components in a predetermined posture.

  Note that examples of the components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, solar cell components, and power module components. Electronic circuit components include components having leads and components not having leads.

  The cut and clinching device 34 is disposed below the conveying device 50, and includes a cut and clinching unit 100 and a unit moving device 102 as shown in FIG. The cut and clinching unit 100 cuts and bends the leads (see FIG. 8) 108 of the lead component (see FIG. 8) 106 inserted into the through holes (see FIG. 8) 104 formed in the circuit base 12. Device. Specifically, the cut and clinching unit 100 includes a unit main body 110, a pair of slide bodies 112, and a pitch changing mechanism 114, as shown in FIG. A slide rail 116 is disposed at the upper end of the unit main body 110 so as to extend in the X direction. The pair of slide bodies 112 are slidably supported by the slide rail 116. As a result, the pair of slide bodies 112 approach and separate in the X direction. The pitch changing mechanism 114 includes an electromagnetic motor 118, and the distance between the pair of slide bodies 112 is controlled to be controllable by the operation of the electromagnetic motor 118.

  Further, as shown in FIG. 5, each of the pair of slide bodies 112 includes a fixed portion 120, a movable portion 122, and a slide device 124. The fixed portion 120 is slidably held on the slide rail 116. . Two slide rails 126 are fixed to the back side of the fixed portion 120 so as to extend in the X direction, and the movable portion 122 is slidably held by the two slide rails 126. Thereby, the movable part 122 slides in the X direction with respect to the fixed part 120. The slide device 124 includes an electromagnetic motor (see FIG. 7) 128, and the movable portion 122 slides in a controllable manner by the operation of the electromagnetic motor 128.

  Moreover, the upper end part of the fixing | fixed part 120 is made into the tapered shape, and the 1st insertion hole 130 is formed so that the upper end part may be penetrated to an up-down direction. The first insertion hole 130 opens at the upper end to the upper end surface of the fixed portion 120, and the opening edge to the upper end surface is a fixed blade (see FIG. 8) 131. Further, the first insertion hole 130 is open at the lower end to the side surface of the fixing portion 120, and a disposal box 132 is disposed below the opening to the side surface.

  As shown in FIG. 6, the upper end portion of the movable portion 122 is also tapered, and a bent portion 133 that is bent in an L shape is formed at the upper end portion. The bent portion 133 extends above the upper end surface of the fixed portion 120, and the bent portion 133 and the upper end of the fixed portion 120 face each other with a slight clearance. In addition, the first insertion hole 130 that opens to the upper end surface of the fixing portion 120 is covered by the bent portion 133, but the second insertion hole 136 is disposed in the bent portion 133 so as to face the first insertion hole 130. Is formed.

  The second insertion hole 136 is a through-hole penetrating the bent portion 133 in the vertical direction, and the inner peripheral surface of the second insertion hole 136 is a tapered surface whose inner diameter decreases toward the lower side. Furthermore, the opening edge to the lower end surface of the bent part 133 of the second insertion hole 136 is a movable blade (see FIG. 8). A guide groove 140 is formed on the upper end surface of the bent portion 133 so as to extend in the X direction, that is, in the sliding direction of the movable portion 122. The guide groove 140 is formed so as to straddle the opening of the second insertion hole 136, and the guide groove 140 and the second insertion hole 136 are connected. The guide groove 140 is open on both side surfaces of the bent portion 133.

  As shown in FIG. 3, the unit moving device 102 includes an X direction moving device 150, a Y direction moving device 152, a Z direction moving device 154, and a rotation device 156. The X direction moving device 150 includes a slide rail 160 and an X slider 162. The slide rail 160 is disposed so as to extend in the X direction, and the X slider 162 is slidably held by the slide rail 160. The X slider 162 moves in the X direction by driving an electromagnetic motor (see FIG. 7) 164. The Y-direction moving device 152 includes a slide rail 166 and a Y slider 168. The slide rail 166 is disposed on the X slider 162 so as to extend in the Y direction, and the Y slider 168 is slidably held on the slide rail 166. The Y slider 168 moves in the Y direction by driving an electromagnetic motor (see FIG. 7) 170. The Z direction moving device 154 includes a slide rail 172 and a Z slider 174. The slide rail 172 is disposed on the Y slider 168 so as to extend in the Z direction, and the Z slider 174 is slidably held on the slide rail 172. The Z slider 174 moves in the Z direction by driving an electromagnetic motor (see FIG. 7) 176.

  The rotation device 156 has a generally disk-shaped rotary table 178. The rotary table 178 is supported by the Z slider 174 so as to be rotatable about its axis, and is rotated by driving of an electromagnetic motor (see FIG. 7) 180. A cut and clinching unit 100 is disposed on the rotary table 178. With such a structure, the cut and clinch unit 100 is moved to an arbitrary position by the X-direction moving device 150, the Y-direction moving device 152, and the Z-direction moving device 154, and is rotated at an arbitrary angle by the rotation device 156. To do. Thereby, the cut and clinching unit 100 can be positioned at an arbitrary position below the circuit substrate 12 held by the clamp device 52.

  As shown in FIG. 7, the control device 36 includes a controller 190, a plurality of drive circuits 192, and an image processing device 196. The plurality of drive circuits 192 include the transport device 50, the clamp device 52, the work heads 60 and 62, the work head moving device 64, the tray-type component supply device 78, the feeder-type component supply device 80, the bulk component supply device 32, and the electromagnetic motor. 118, 128, 164, 170, 176, 180. The controller 190 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 192. As a result, the operations of the substrate conveyance holding device 22, the component mounting device 24, and the like are controlled by the controller 190. The controller 190 is also connected to the image processing device 196. The image processing device 196 processes image data obtained by the mark camera 26 and the part camera 28, and the controller 190 acquires various types of information from the image data.

<Operation of component mounter>
In the component mounter 10, the component mounting operation is performed on the circuit substrate 12 held by the substrate conveyance holding device 22 with the above-described configuration. In the component mounter 10, various components can be mounted on the circuit substrate 12. The case where the lead component is mounted on the circuit substrate 12 will be described below.

  Incidentally, the “lead component” in the present specification has a protruding electrode inserted into a through hole formed in the circuit substrate 12, a so-called lead, and the lead inserted into the through hole is clinched. In this state, the circuit board 12 is mounted. Then, the clinched lead is soldered to the circuit base 12 to be electrically connected to the circuit base 12. That is, the “lead component” in this specification is a component that is electrically connected to the circuit substrate 12. The lead is not limited by the length, shape, etc. of the lead as long as it is electrically connected to the circuit substrate 12. That is, for example, various lead shapes such as a wire shape, a flat shape, and a prismatic shape can be adopted.

  At the time of component mounting, first, the circuit substrate 12 is transported to the working position, and is fixedly held by the clamp device 52 at that position. Next, the mark camera 26 moves above the circuit substrate 12 and images the circuit substrate 12. And the information regarding the holding position etc. of the circuit base material 12 is calculated based on the imaging data. Further, the component supply device 30 or the bulk component supply device 32 supplies the lead component 106 at a predetermined supply position. Then, one of the work heads 60 and 62 moves above the component supply position, and the component main body (see FIG. 8) 200 of the lead component 106 is sucked and held by the suction nozzle 66.

  Subsequently, the work heads 60 and 62 holding the lead component 106 move above the parts camera 28, and the lead component 106 held by the suction nozzle 66 is imaged by the parts camera 28. Then, based on the imaging data, information regarding the holding position of the component is calculated. Next, when the imaging of the lead component 106 by the parts camera 28 is completed, the work heads 60 and 62 holding the lead component 106 move above the circuit substrate 12, and errors in the holding position of the circuit substrate 12 and components The error of the holding position is corrected. Then, the lead 108 of the lead component 106 held by the suction nozzle 66 is inserted into the through hole 104 formed in the circuit substrate 12. At this time, the cut and clinching unit 100 is moved below the circuit substrate 12.

  Specifically, in the cut and clinching unit 100, the distance between the second insertion holes 136 of the movable portion 122 of the pair of slide bodies 112 is between the two through holes 104 formed in the circuit base 12. The distance between the pair of slide bodies 112 is adjusted by the pitch changing mechanism 114 so as to be the same as the distance. Then, by the operation of the X-direction moving device 150 and the Y-direction moving device 152, the coordinates in the XY direction of the second insertion hole 136 of the slide body 112 and the coordinates in the XY direction of the through hole 104 of the circuit substrate 12 are obtained. The cut and clinch unit 100 is moved so as to match. That is, the cut and clinching unit 100 is moved along the XY direction that intersects the direction in which the through hole 104 extends, so that the second insertion hole 136 of the slide body 112 and the through hole of the circuit substrate 12 are obtained. 104 is overlapped in the vertical direction. The direction in which the through hole 104 extends is a direction that intersects with the circuit base material 12, and when the through hole 104 is formed so as to go straight to the circuit base material 12, it goes straight to the circuit base material 12. Direction, that is, the Z direction. For this reason, the cut and clinch unit 100 moves in the direction along the circuit substrate 12 by moving in the XY direction.

  Further, the cut and clinching unit 100 is configured so that the upper surface of the movable portion 122 is in contact with the lower surface of the circuit base material 12 or slightly below the lower surface of the circuit base material 12 by the operation of the Z-direction moving device 154. Be raised. In this way, by controlling the operations of the X-direction moving device 150, the Y-direction moving device 152, and the Z-direction moving device 154, the second insertion hole 136 of the slide body 112, the through hole 104 of the circuit substrate 12, and the like. The cut and clinch unit 100 is disposed below the circuit substrate 12 in a state where the two overlap each other.

  Then, when the lead 108 of the lead component 106 held by the suction nozzle 66 is inserted into the through hole 104 of the circuit substrate 12, the leading end of the lead 108 is cut and clinched as shown in FIG. It is inserted into the first insertion hole 130 of the fixed part 120 through the second insertion hole 136 of the movable part 122 of 100. Subsequently, when the lead 108 is inserted into the first insertion hole 130 through the second insertion hole 136, the movable portion 122 of the pair of slide bodies 112 slides in the separating direction. As a result, the lead 108 is cut by the fixed blade 131 of the first insertion hole 130 and the movable blade 138 of the second insertion hole 136, as shown in FIG. Then, the tip portion separated by cutting the lead 108 falls in the first insertion hole 130 and is discarded in the disposal box 132.

  In addition, the pair of movable parts 122 are slid in the direction of further separation even after the leads 108 are cut. For this reason, the new tip portion of the lead 108 by cutting is bent along the tapered surface of the inner periphery of the second insertion hole 136 as the movable portion 122 slides, and further, the movable portion 122 slides. The tip of the lead 108 bends along the guide groove 140. As a result, the pair of leads 108 is bent in a direction away from each other, and the lead component 106 is attached to the circuit substrate 12 in a state in which the lead 108 is prevented from being removed from the through hole 104.

  In the component mounter 10, the lead component 106 can be mounted on the circuit substrate 12 with the pair of leads 108 bent in a direction approaching each other. Specifically, after the lead 108 is inserted into the first insertion hole 130 through the second insertion hole 136, the movable portion 122 of the pair of slide bodies 112 is slid in the approaching direction. As a result, the lead 108 is cut by the fixed blade 131 of the first insertion hole 130 and the movable blade 138 of the second insertion hole 136 as shown in FIG. Then, the pair of movable parts 122 are slid in the direction in which they are further approached, so that the pair of leads 108 are bent in the direction in which they are closer to each other. As described above, in the component mounter 10, the lead component 106 is connected to the circuit in a state where the pair of leads 108 are bent in a direction approaching each other or in a state where the pair of leads 108 are bent in a direction away from each other. Mounted on the substrate 12.

  Then, the bent lead 108 is soldered to the circuit substrate 12, whereby the lead component 106 is electrically connected to the circuit substrate 12. That is, the lead 108 functions as a portion that prevents the lead component 106 from falling off the circuit base 12 and is electrically connected to the circuit base 12. In addition, since the bending of the lead prevents the lead component from falling off from the circuit base material 12, when the lead component has a plurality of leads, all of the plurality of leads may be bent. Only one part of the leads may be bent.

  Further, not only the lead component 106, that is, a component that is electrically connected to the circuit substrate 12, but also a component that is not electrically connected to the circuit substrate 12 is mounted on the circuit substrate 12. Specifically, for example, as shown in FIG. 11, a plurality of types of lead components 106 a to 106 h are mounted on the circuit base 12. Package parts such as DIP (Dual Inline Package), SIP (Single Inline Package), ZIP (Zigzag Inline Package), PGA (Pin Grid Array), and large connector parts also have leads, and the leads are circuits. Since it is mounted on the circuit substrate 12 by being inserted into the through hole 104 of the substrate 12, it is a lead component.

  In addition to the lead components 106 a to 106 h, a component holder 210 and a heat sink 212 are also mounted on the circuit substrate 12. The component holder 210 is a component for holding the lead component 106 g so that the component main body 200 of the lead component 106 g is self-supported while being separated from the surface of the circuit substrate 12. The heat sink 212 has a fin, and is a component for radiating the heat of the circuit substrate 12 by the fin. That is, the component holder 210 and the heat sink 212 are components that are not electrically connected to the circuit substrate 12. However, in order to fix the component holder 210 and the heat sink 212 to the circuit base material 12, flat projections are formed on the bottom surfaces of the component holder 210 and the heat sink 212. And the component holder 210 and the heat sink 212 are fixed to the circuit base material 12 by inserting the protrusion into the through hole of the circuit base material 12 and bending the protrusion.

  Specifically, for example, a pair of leg portions 220 is provided on the side surface of the component holder 210. As shown in FIG. 12, the leg portion 220 includes a main body portion 222 and a protruding portion 224. The main body 222 has a flat plate shape and is fixed to the side surface of the component holder 210. The protrusion 224 has a generally L-shaped flat plate shape, and protrudes downward from the lower edge of the main body 222. In addition, the protrusion 224 includes a base end portion 226 that protrudes downward from the lower edge of the main body portion 222, and a bent portion 228 that extends laterally from the lower end portion of the base end portion 226.

  A through hole 229 corresponding to the shape of the protrusion 224 of the leg 220 is formed in the circuit base 12, and the protrusion 224 is inserted into the through hole 229. In addition, the length dimension of the base end part 226 of the projection part 224 is longer than the thickness dimension of the circuit base material 12. For this reason, when the protrusion 224 of the leg 220 is inserted to the base of the through hole 229, the bent part 228 of the protrusion 224 extends to the lower surface side of the circuit substrate 12 as shown in FIG. 13. In addition, between the pair of protrusions 224 inserted into the pair of through holes 229, the lead 108 g of the lead component 106 g held by the component holder 210 is connected to the circuit substrate 12 through the through hole 104. It extends to the lower surface side.

  Next, when the protrusion 224 is inserted into the through hole 229, the protrusion 224 is bent by the cut and clinch unit 100. Specifically, when the protrusion 224 is inserted into the through hole 229, the cut and clinching unit 100 is moved below the circuit substrate 12. Specifically, in the cut-and-clinch unit 100, the distance between the side surface 230 and the opposite side surface 232 of the movable portion 122 of the pair of slide bodies 112 is the two through holes 229 formed in the circuit substrate 12. The distance between the pair of slide bodies 112 is adjusted by the pitch changing mechanism 114 so as to be slightly shorter than the distance between the pitches. Then, by the operation of the X-direction moving device 150 and the Y-direction moving device 152, the pair of movable portions 122 is in a state where the straight line connecting the pair of movable portions 122 and the straight line connecting the two through holes 229 coincide. The cut and clinching unit 100 is moved so as to be located inside the two through holes 229 and not to overlap the through holes 229 in the vertical direction. Further, the cut and clinching unit 100 is raised by the operation of the Z-direction moving device 154 so that the lower surface of the movable portion 122 is positioned at a predetermined height. The predetermined height is set such that when the protrusion 224 is inserted into the through hole 229, the lower end of the protrusion 224 and the lower surface of the movable part 122 are the same height.

  As described above, when the projections 224 are inserted into the through holes 229 by controlling the operations of the X-direction moving device 150, the Y-direction moving device 152, and the Z-direction moving device 154, FIG. 14 and FIG. As shown, the bent portion 228 of the protruding portion 224 that extends to the lower surface side of the circuit base 12 faces the side surface 232 of the movable portion 122 of the slide body 112. 14 is a view showing the positional relationship between the component holder 210 and the slide body 112 from a side view, and FIG. 15 is a perspective view of the positional relationship between the component holder 210 and the slide body 112 from above. It is the figure shown by. Further, the bent portion 228 of the protruding portion 224 faces the side surface 232 of the movable portion 122 at the distal end portion opposite to the end portion continuous with the base end portion 226 of the bent portion 228.

  Then, as shown in FIGS. 16 and 17, the movable portion 122 of the pair of slide bodies 112 slides away from each other, so that the side surface 232 of the movable portion 122 comes into contact with the distal end portion of the bent portion 228. The bent portion 228 bends outward. At this time, since the side surface 232 of the movable portion 122 abuts on the distal end portion of the bent portion 228, the bent portion 228 is twisted outwardly around the base end portion 226 and bent. As a result, as shown in FIG. 18, the bent portions 228 of the pair of protrusions 224 are bent away from each other, and the protrusions 224 are prevented from being removed from the through holes 229. Is mounted on the circuit substrate 12. As described above, in the cut and clinching unit 100, the first insertion hole 130 and the second insertion hole 136 for bending the lead 108 are not used, but a portion different from the insertion hole, that is, the side surface of the movable portion 122 is provided. In use, the bent portion 228 is bent.

  In the component mounter 10, the component holder 210 can be mounted on the circuit substrate 12 in a state where the pair of bent portions 228 are bent in a direction approaching each other. Specifically, when the cut and clinching unit 100 is moved below the circuit substrate 12, the distance between the mutually facing side surfaces 230 of the movable portion 122 of the pair of slide bodies 112 is formed in the circuit substrate 12. The distance between the pair of slide bodies 112 is adjusted by the pitch changing mechanism 114 so as to be slightly longer than the distance between the two through holes 229. Then, by the operation of the X-direction moving device 150 and the Y-direction moving device 152, the pair of movable portions 122 is in a state where the straight line connecting the pair of movable portions 122 and the straight line connecting the two through holes 229 coincide. The cut and clinching unit 100 is moved so as to be located outside the two through holes 229 and not to overlap the through holes 229 in the vertical direction. Further, the cut and clinching unit 100 is raised by the operation of the Z-direction moving device 154 so that the lower surface of the movable portion 122 is positioned at a predetermined height. The predetermined height is set such that when the protrusion 224 is inserted into the through hole 229, the lower end of the protrusion 224 and the lower surface of the movable part 122 are the same height.

  As described above, when the projections 224 are inserted into the through holes 229 by controlling the operations of the X-direction moving device 150, the Y-direction moving device 152, and the Z-direction moving device 154, FIG. 19 and FIG. As shown, the bent portion 228 of the protruding portion 224 that extends to the lower surface side of the circuit base 12 faces the side surface 230 of the movable portion 122 of the slide body 112. Then, as shown in FIGS. 21 and 22, the movable portion 122 of the pair of slide bodies 112 slides in the approaching direction, so that the side surface 230 of the movable portion 122 abuts on the distal end portion of the bent portion 228. The bent portion 228 bends inward. As a result, the bent portions 228 of the pair of protrusions 224 are bent in a direction approaching each other, and the component holder 210 is mounted on the circuit base 12 in a state in which the protrusions 224 are prevented from coming off from the through holes 229. Is done.

  Since the component holder 210 is a component that is not electrically connected to the circuit substrate 12, the bent portion 228 inserted into the through hole 229 and bent is not soldered. That is, the bent portion 228 functions as a portion for preventing the component holder 210 from falling off the circuit base 12, but does not function as a portion electrically connected to the circuit base 12 like the lead 108. .

  A protrusion (not shown) having substantially the same shape as the protrusion 224 of the component holder 210 is also provided on the lower surface side of the heat sink 212. Then, like the protrusion 224 of the component holder 210, the protrusion is also inserted into the through hole 229 and bent, whereby the heat sink 212 is fixed to the circuit substrate 12.

  Further, as a component that is not electrically connected to the circuit substrate 12, a component holder 250 shown in FIG. The component holder 250 is a component for holding a plurality of lead components 106 mounted on the circuit substrate 12 in a self-supporting state. Further, as a component that is not electrically connected to the circuit substrate 12, there is a component cover 252 shown in FIG. The component cover 252 is a component for preventing the electrical influence on the lead 108 and the entry of foreign matter into the lead 108 by covering the lead component 106 mounted on the circuit substrate 12. Plural protrusions (not shown) having substantially the same shape as the protrusions 224 of the component holder 210 are also provided on the lower surface side of the component holder 250 and the component cover 252, and the plurality of protrusions serve as the component holder 210. Similarly to the protruding portion 224, the component holder 250 and the component cover 252 are fixed to the circuit substrate 12 by being inserted into the plurality of through holes 229 and bent.

  Note that all of the plurality of protrusions inserted into the through hole 229 may be bent, or only a part of the plurality of protrusions may be bent. Specifically, for example, when four protrusions are disposed at the four corners at the lower end of the component cover 252, the four protrusions may be bent, and the diagonal of the four bent portions You may bend | fold the two protrusion parts located in, or two adjacent protrusion parts. In other words, the cut-and-clinch unit 100 may bend all of the plurality of protrusions when the component that is not electrically connected to the circuit substrate 12 has a plurality of protrusions. Only a part of may be bent.

  Furthermore, a part (hereinafter referred to as “integrated part”) in which a part that is electrically connected and a part that is not electrically connected is integrated is also mounted on the circuit substrate 12. Specifically, the integral component 260 is composed of a lead component 262 and a component holder 264, as shown in FIG. The lead component 262 includes a component main body 266 and a lead 268 extending downward from the side surface of the component main body 266. On the other hand, the component holder 264 includes a holder portion 270, a pair of L-shaped projections 272, and a pair of rectangular projections 274. The holder portion 270 is configured integrally with the component main body portion 266 of the lead component 262 and holds the lead component 262. The protrusion 272 has substantially the same shape as the protrusion 224 of the component holder 210, and is disposed so as to extend downward to the lower end surface of the holder part 270. The protrusion 274 is also disposed on the lower end surface of the holder portion 270 so as to extend downward.

  When the integrated part 260 having such a structure is attached to the circuit base 12, the leads 268 are inserted into the through holes 104 of the circuit base 12, and the protrusions 272 and 274 are inserted into the through holes 229 of the circuit base 12. Inserted. Then, like the protrusion 224 of the component holder 210, the protrusion 272 is bent by contacting the side surfaces 230 and 232 of the movable part 122 in the cut and clinch unit 100. Note that the protrusions 274 are merely positioned and are not bent. Further, in the integrated component 260, the lead 268 is not bent because the protrusion 272 is prevented from falling off from the circuit substrate 12. However, both the protrusion 274 and the lead 268 may be further bent to prevent the integrated component 260 from rattling on the circuit base 12. One of the protrusion 274 and the lead 268 may be bent. Furthermore, at least one of the protrusion 274 and the lead 268 may be bent without bending the protrusion 272. When the lead 268 is bent, the lead 268 is inserted into the first insertion hole 130 and the second insertion hole 136 of the movable portion 122 in the cut and clinching unit 100 in the same manner as the lead 108 of the lead component 106. The movable portion 122 is bent by being slid.

  As described above, the integrated component 260 is not electrically connected to the circuit substrate 12 and the lead 268 that functions as a part electrically connected to the circuit substrate 12, and the integrated component 260 is fixed to the circuit substrate 12. A protrusion 272 that functions as a part for performing the operation and a protrusion 274 that is not electrically connected to the circuit base 12 and functions as a part for positioning the integrated component 260 on the circuit base 12. . That is, in the integrated component 260, a part of the portion inserted into the through hole of the circuit base 12 is the lead 268 that is electrically connected to the circuit base 12, and a part is the circuit base 12. The protrusion 272 is used to fix the integrated component 260 to the circuit substrate 12 without being electrically connected to the circuit substrate 12, and a part of the protrusion 260 is not electrically connected to the circuit substrate 12. This is a projection 272 for positioning. That is, in the integrated component 260, the protrusion 272 of the protrusions 272 and 274 that are not electrically connected to the circuit substrate 12 is bent, and the protrusion 274 is not bent. On the other hand, since the component holder 210 and the like do not need to be electrically connected to the circuit base material 12, the component holder 210 does not have a lead that functions as a part electrically connected to the circuit base material 12. 12 and has only a protrusion 224 that functions as a part for fixing the component holder 210 and the like to the circuit substrate 12. That is, in the component holder 210 and the like, all of the portions inserted into the through holes of the circuit base 12 are not electrically connected to the circuit base 12 and the component holder 210 and the like are fixed to the circuit base 12. Therefore, the protrusion 224 is provided.

  As described above, in the component mounter 10, the protrusions 224 and 272 that are not electrically connected are bent by the cut-and-clinch unit 100. As a result, it is possible to prevent a delay in tact time and complication of work, and to reduce costs. Specifically, conventionally, an apparatus for bending the protrusions 224 and 272 that are not electrically connected has been provided outside the component mounter. For this reason, in order to bend the protrusions 224 and 272, it is necessary to take out the circuit base 12 from the component mounter and perform the bending work of the protrusions 224 and 272 in an apparatus outside the apparatus, which delays the tact time. , Work has become complicated. On the other hand, in the component mounter 10, since the protrusions 224 and 272 that are not electrically connected are bent in the component mounter, it is possible to prevent a delay in tact time and a complicated operation. Further, in the component mounting machine 10, the protrusions 224 and 272 that are not electrically connected are bent using the cut and clinch unit 100 for cutting and bending the lead 108 of the lead component 106. Thereby, it is not necessary to provide a dedicated device for bending the protrusions 224 and 272, and the cost can be reduced.

  The component mounting machine 10 is an example of a substrate working machine. The cut and clinching unit 100 is an example of a bending device. The unit moving device 102 is an example of a moving device. The leads 108 and 268 are an example of a protrusion and a connection protrusion. The protrusions 224 and 272 are an example of a protrusion and a non-connection protrusion. The first insertion hole 130 and the second insertion hole 136 are examples of insertion holes.

  In addition, this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, the protrusions 224 and 272 that are not electrically connected to the circuit substrate 12 are bent using the cut and clinch unit 100, but the protrusions 224 and 272 are A dedicated bending device for bending may be provided. In this case, the bending device needs to be movable below the circuit substrate 12 by the unit moving device 102.

  In the above embodiment, the protrusions 224 and 272 are generally L-shaped flat plates, and the protrusions 224 and 272 are bent by being twisted, but the bent portions are generally rectangular flat plates. And the entire lower edge of the bent portion may be bent so that the circuit substrate 12 approaches the lower surface. In addition, the shape of the bent portion is not limited to a flat plate, and various shapes such as a rod shape, a linear shape, a column shape, a convex shape, etc. are adopted as long as it is inserted into the through hole of the circuit substrate 12 and can be bent. It is possible.

  In the above embodiment, the protrusions 224 and 272 are bent by abutting against the side surface of the movable part 122, but the protrusions 224 and 272 are bent by being brought into contact with various parts of the movable part 122. You may let them. For example, the projecting portions 224 and 272 may be bent by sliding the movable portion 122 in a state where the projecting portion is formed on the movable portion 122 and the projecting portion 224 is engaged with the projecting portion. The protrusions 224 and 272 may be bent by sliding the movable part 122 in a state where the recesses are formed in the 122 and the protrusions 224 and 272 are inserted into the recesses. In addition, when the protruding portion has a shape that can be inserted into the first insertion hole 130 and the second insertion hole 136, the movable portion is inserted in the state where the protruding portion is inserted into the first insertion hole 130 and the second insertion hole 136. The protrusions may be bent by sliding 122.

  In the above-described embodiment, the protrusion is bent by the sliding of the movable portion 122. However, the protrusion can be made by moving the movable member such as by swinging or rotating in a state where the movable member is in contact with the protrusion. The part may be bent.

  Further, in the above embodiment, the integrated component 260 in which the lead component 262 and the component holder 264 are integrated is mounted on the circuit substrate 12, but the surface mount component and the component holder that holds the surface mount component are provided. The integrated component can be mounted on the circuit base 12. That is, a component in which a component that is not electrically connected to the circuit substrate 12 and a surface mount component are integrated can be mounted on the circuit substrate 12. In this case, a plurality of bent portions 228 are formed at the bottom of the component that is not electrically connected to the circuit base material 12, and one or all of the plurality of bent portions 228 are bent by the cut and clinching unit 100. Is done. The surface mount components are electrically connected by terminals that are not inserted into the through holes 104 such as bumps and electrode pads. In other words, terminals that are not inserted into the through holes 104 such as bumps and electrode pads also correspond to the “connection protrusions” of the present invention.

  Moreover, in the said Example, although the component holders 210 and 250, the heat sink 212, and the component cover 252 are employ | adopted as components which are not electrically connected to the circuit base material 12, an electronic component other than a lead component is hold | maintained or covered. Various components can be employed as long as they do not require electric power, such as components for partitioning, electronic components and electronic components.

  In the above embodiment, the cut-and-clinch unit 100 is movable in the direction (X direction and Y direction) perpendicular to the direction in which the through hole 229 is formed (Z direction). It may be possible to move in a direction intersecting with the forming direction (Z direction). That is, the cut and clinching unit 100 may be configured to be movable in a direction that is deviated by a predetermined angle from a plane (XY plane) perpendicular to the formation direction (Z direction) of the through hole 229.

DESCRIPTION OF SYMBOLS 10: Component mounting machine (vs. board working machine) 100: Cut and clinch unit (bending device) 102: Unit moving device (moving device) 108: Lead (protrusion part) (connection protrusion part) 130: 1st insertion hole (insertion) 136): Second insertion hole (insertion hole) 224: Projection (projection) (non-connection projection) 268: Lead (projection) (connection projection)
272: Projection (projection) (non-connection projection)

Claims (4)

In a component mounting machine capable of mounting a component having a non-connecting protrusion that is not electrically connected to a substrate on a substrate in a state where the non-connecting protrusion is inserted into a through hole formed on the substrate.
The component mounting machine is
A bending device that bends the non-connecting protrusion in a state of being inserted into the through hole;
A component mounting machine comprising: a moving device that moves the bending device below the substrate in a direction intersecting with a direction in which the through hole extends. The part is
The component mounting machine according to claim 1, further comprising a connection protrusion that is inserted into a through hole different from the through hole and is electrically connected to the substrate. The bending device is
The component mounting machine according to claim 2, further comprising a function of cutting and bending the connection protrusion. The bending device is
The connection projection has an insertion hole into which the connection projection is inserted, the connection projection inserted into the insertion hole can be cut and bent, and the non-connection projection can be inserted without being inserted into the insertion hole. The component mounting machine according to claim 2, wherein the part is bent.

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