JPWO2015056567A1 - Circuit module, light emitting module, and pressing member - Google Patents

Abstract

In the circuit module, the element mounting substrate 20 includes a mounting portion on which the semiconductor light emitting element is mounted and an electrode portion 20b to which a current to the semiconductor light emitting element is supplied. The FPC board has a conductive portion 22a1 through which a current supplied to the electrode portion 20b passes. The leaf spring 24 has a pressing portion 24a2 that presses the conductive portion 22a1. The conductive portion 22a1 is in contact with the electrode portion 20b by being sandwiched between the electrode portion 20b and the pressing portion 24a2. The plate spring 24 may be a plate-like member having an opening formed so as to expose the mounting portion.

Description

  The present invention relates to a circuit module, a light emitting module, and a pressing member.

  2. Description of the Related Art Conventionally, development of technology that uses a semiconductor light emitting element such as an LED (Light Emitting Diode) as a light source module for a vehicle lamp has been underway (see Patent Document 1). The light source module includes a power supply attachment for supplying power from a power supply circuit to a circuit board on which an LED is mounted. This power supply attachment has an arm-shaped connection terminal portion that is connected to a power-supplied portion formed on the circuit board and whose base is fixed and the tip is not fixed.

JP 2010-192139 A

  However, the above-described power supply attachment is formed with an opening so that light emitted from the LED passes, and an arm-shaped connection terminal is provided from the edge of the opening toward the center of the opening. For this reason, in order for the arm-shaped connection terminal to contact the LED power feeding portion and generate an urging force (pressing force) due to deflection, it is necessary to lengthen the arm-shaped connection terminal, resulting in an increase in the size of the power supply attachment. Yes. Further, when the connection terminal portion reflects a part of the light emitted from the LED, glare occurs.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a technique for realizing conduction between a power supply member and an element mounting substrate in a compact configuration.

  In order to solve the above problems, a circuit module according to an aspect of the present invention includes an element mounting substrate having a mounting portion on which a semiconductor light emitting element is mounted and an electrode portion to which a current is supplied to the semiconductor light emitting element. A power supply member having a conductive portion through which a current supplied to the electrode portion passes, and a pressing member having a pressing portion that presses the conductive portion. The conductive part comes into contact with the electrode part by being sandwiched between the electrode part and the pressing part.

  According to this aspect, the conductive portion of the power feeding member is brought into contact with the electrode portion by being sandwiched between the electrode portion and the pressing portion. Therefore, connection reliability is increased. In addition, since the conductive portion only needs to have a shape that is sandwiched between the electrode portion and the pressing portion, the degree of freedom in shape and layout is increased, and the power supply member can be made compact.

  The pressing member is a plate-like member having an opening formed so as to expose the mounting portion, and the pressing portion may be provided on a surface of the plate-like member facing the element mounting substrate. Thereby, it is suppressed that a press member interrupts the light which a semiconductor light emitting element emits.

  The power feeding member is a flexible printed wiring board, and may include a conductive portion as a wiring and an insulating portion in which the wiring is formed. The conductive portion may be disposed so as to face the electrode portion, and the insulating portion may face the pressing portion. Thereby, it becomes possible to arrange | position the electrically-conductive part of an electric power feeding member in the position lower than the light emission surface of a semiconductor light-emitting device.

  The pressing member is a metal member and may have a shape in which at least a part is flexible. Accordingly, the conductive portion can be biased toward the electrode portion by the bent pressing member.

  With respect to the element mounting substrate or the heat radiating member on which the element mounting substrate is mounted, the first positioning mechanism that determines the position of the power supply member, and the element mounting substrate or the heat radiating member on which the element mounting substrate is mounted And a second positioning mechanism for determining the position of the pressing member. Thereby, the conductive part of the power feeding member can be brought into contact with the electrode part of the element mounting substrate with high accuracy.

  You may further provide the positioning mechanism which determines the position of an electric power feeding member and a press member with respect to the element mounting board | substrate or the heat radiating member with which this element mounting board | substrate is mounted. Thereby, the conductive part of the power feeding member can be brought into contact with the electrode part of the element mounting substrate with high accuracy. Moreover, since the positioning mechanism can determine the positions of the power feeding member and the pressing member at the same time, the configuration can be simplified.

  Another embodiment of the present invention is a light emitting module. The light emitting module includes a circuit module and a semiconductor light emitting element mounted on the mounting portion. The conductive portion of the power supply member is configured to be positioned closer to the element mounting substrate than the light emitting surface of the semiconductor light emitting element. Thereby, it is suppressed that the electroconductive part of an electric power feeding member blocks the light which a semiconductor light emitting element emits.

  Yet another embodiment of the present invention is a pressing member. The pressing member includes an element mounting substrate having a mounting portion on which the semiconductor light emitting element is mounted, an electrode portion to which a current to the semiconductor light emitting element is supplied, and a conductive portion through which the current supplied to the electrode portion passes. The power supply member is fixed. The pressing member has a pressing portion that presses the conductive portion. The pressing part is configured to sandwich the conductive part between the pressing part and the electrode part.

  It should be noted that any combination of the above-described constituent elements and a representation obtained by converting the expression of the present invention between a method, an apparatus, a system, and the like are also effective as an aspect of the present invention.

  According to the present invention, conduction between the power feeding member and the element mounting substrate can be realized with a compact configuration.

FIG. 1A is a perspective view of the light emitting module according to the first embodiment, and FIG. 1B is an exploded perspective view of the light emitting module according to the first embodiment. It is a top view of the light emitting module concerning a 1st embodiment. It is sectional drawing which shows the AA cross section of Fig.1 (a). FIG. 4A is a perspective view of the light emitting module according to the second embodiment, and FIG. 4B is an exploded perspective view of the light emitting module according to the second embodiment. FIG. 5A is a perspective view of a light emitting module according to the third embodiment, and FIG. 5B is an exploded perspective view of the light emitting module according to the third embodiment. FIG. 6A is a perspective view of a light emitting module according to the fourth embodiment, and FIG. 6B is an exploded perspective view of the light emitting module according to the fourth embodiment. FIG. 7A is a perspective view of a light emitting module according to the fifth embodiment, and FIG. 7B is an exploded perspective view of the light emitting module according to the fifth embodiment. FIG. 8A is a perspective view of a light emitting module according to the sixth embodiment, and FIG. 8B is an exploded perspective view of the light emitting module according to the sixth embodiment. FIG. 9A is a perspective view of a light emitting module according to the seventh embodiment, and FIG. 9B is an exploded perspective view of the light emitting module according to the seventh embodiment. It is a schematic diagram which shows schematic structure of the light emitting module which connected the some board | substrate for element mounting. It is a schematic horizontal sectional view of the vehicular lamp according to the tenth embodiment. It is sectional drawing which shows the modification of the press part of the leaf | plate spring shown in FIG. FIG. 13 is a cross-sectional view schematically showing the vicinity of the pressing portion in a modification of the light emitting module 10 according to the first embodiment. FIG. 14A is a perspective view of a light emitting module according to the eighth embodiment, and FIG. 14B is an exploded perspective view of the light emitting module according to the eighth embodiment. FIG. 15A is a perspective view of a light emitting module according to the ninth embodiment, and FIG. 15B is an exploded perspective view of the light emitting module according to the ninth embodiment.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and repeated descriptions are omitted as appropriate.

(First embodiment)
FIG. 1A is a perspective view of the light emitting module according to the first embodiment, and FIG. 1B is an exploded perspective view of the light emitting module according to the first embodiment. FIG. 2 is a top view of the light emitting module according to the first embodiment. FIG. 3 is a cross-sectional view showing an AA cross section of FIG.

  The light emitting module 10 includes a circuit module 12, an LED 14 as a semiconductor light emitting element, a heat sink 16, and two screws 18 that fix the circuit module 12 to the heat sink 16. The circuit module 12 includes an element mounting board 20, an FPC (flexible printed circuit) board 22 as a power supply member, a leaf spring 24 as a pressing member, and a connector 26.

  The heat sink 16 is made of a metal material such as aluminum or copper, and is a member for transmitting and radiating heat of the LED 14 to the outside. Two screw holes 16a to which the screws 18 are fastened are provided. The element mounting substrate 20 includes a mounting portion 20a on which the LED 14 is mounted and an electrode portion 20b to which current (electric power) is supplied to the LED 14. The FPC board 22 includes a thin wiring layer 22a and an insulating member 22b that covers the wiring layer 22a. In addition, one end of the wiring layer 22 a is partially exposed as the conductive portion 22 a 1, and the other end is connected to the connector 26. The current supplied to the electrode portion 20b of the element mounting substrate 20 passes through the conductive portion 22a1.

  The leaf spring 24 according to the present embodiment is made by punching a plate-like metal member into a desired shape and then bending a part thereof. The leaf spring 24 has a rectangular main body portion 24a and a fixing portion 24b provided so as to protrude from two sides of the main body portion 24a. The main body 24a includes an opening 24a1 formed at the center so as to expose the mounting portion 20a of the element mounting substrate 20, and a pressing portion 24a2 provided on a surface facing the element mounting substrate 20. . The fixing portion 24b is formed with a hole 24b1 into which the screw 18 is inserted.

  Next, an outline of a method for manufacturing the light emitting module 10 will be described. As shown in FIG. 2, the element mounting substrate 20 on which the LEDs 14 are mounted is placed on the heat sink 16. Next, the two conductive portions 22a1 of the FPC board 22 are arranged so as to overlap with the corresponding electrode portions 20b of the element mounting board 20, and a plate spring 24 is placed thereon and fixed to the heat sink 16 with screws 18. . As a result, as shown in FIG. 3, the pressing portion 24 a 2 indirectly presses the conductive portion 22 a 1 of the FPC board 22 through the insulating member 22 b, and the element mounting substrate 20 is fixed on the heat sink 16. Is done. Note that the pressing portion 24a2 may be configured to directly press the conductive portion 22a1. In that case, what is necessary is just to insulate the surface which contacts the electroconductive part 22a1 of the press part 24a2. Further, the heat of the leaf spring 24 is radiated to the heat sink 16 through the fixing portion 24b.

  Thus, the conductive portion 22a1 of the FPC board 22 is in contact with the electrode portion 20b by being sandwiched between the electrode portion 20b and the pressing portion 24a2. Therefore, connection reliability is increased. In addition, since the conductive portion 22a1 only needs to have a shape that is sandwiched between the electrode portion 20b and the pressing portion 24a2, the degree of freedom in shape and layout increases, and the FPC board 22 that is a power supply member can be made compact.

  Further, since the leaf spring 24 is formed with an opening 24a1 at the center so as to expose the mounting portion 20a of the element mounting substrate 20, the leaf spring 24 itself is prevented from blocking light emitted from the LED 14. . Further, part of the back surface of the main body 24a of the leaf spring 24 functions as the pressing portion 24a2, so that the shape of the leaf spring 24 is simplified and the size is also compact.

  The FPC board 22 is disposed such that the conductive portion 22a1 faces the electrode portion 20b and the insulating member 22b faces the pressing portion 24a2. The thickness of the conductive portion 22a1 is about 10 to 50 μm, and the thickness of the insulating member 22b is about 10 to 50 μm. Similarly, the electrode portion 20b of the element mounting substrate 20 is also a metal thin film and is very thin. The thickness of the conductive portion 22a1 and the electrode portion 20b may be adjusted as appropriate depending on the amount of current. On the other hand, the light emitting surface of the LED 14 mounted on the mounting portion 20a of the element mounting substrate 20 is positioned about 300 μm above the mounting portion 20a.

  Therefore, the conductive portion 22a1 of the FPC board 22 can be disposed at a position lower than the light emitting surface of the LED 14. Thereby, the light from the LED 14 does not directly hit the FPC board 22. Therefore, light is not reflected by the conductive portion 22a1, and the possibility of generating glare is reduced.

  The insulating member 22b is a film-like member that is somewhat soft, such as polyimide or polyethylene terephthalate. Therefore, the insulating member 22b is deformed when the pressing portion 24a2 presses the conductive portion 22a1 through the insulating member 22b. Therefore, even if there is some variation in the size of the protrusion of the pressing portion 24a2, the contact between the electrode portion 20b and the conductive portion 22a1 can be ensured. Moreover, since the electrode part 20b and the press part 24a2 do not touch directly, generation | occurrence | production of a crack and metal abrasion powder can be prevented. Further, as described above, since the light of the LED 14 does not directly hit the insulating member 22b, deterioration due to light is prevented.

  Moreover, since the leaf | plate spring 24 is comprised with the metal member, compared with the resin member, there are few deterioration by light of the creep and LED14. In the leaf spring 24, pressing portions 24a2 are formed on two narrow frame portions of the four frame portions of the main body 24a surrounding the opening 24a1. Therefore, the conductive part 22a1 can be urged toward the electrode part 20b by bending the protrusion that is the pressing part 24a2 or the two thin sides that support it, and the connection reliability against vibration or the like can be improved.

  FIG. 13 is a cross-sectional view schematically showing the vicinity of the pressing portion in a modification of the light emitting module 10 according to the first embodiment. The FPC board 22 shown in FIG. 13 is entirely covered with an insulating member 22b on the side facing the pressing portion 24a2. On the other hand, the insulating member 22b on the side facing the element mounting substrate 20 of the FPC board 22 has an opening 22b1 formed in a region facing the electrode portion 20b. Therefore, only the region 22a2 facing the electrode portion 20b is exposed in the conductive portion 22a1. That is, since the region other than the region 22a2 of the conductive portion 22a1 is covered with the insulating member 22b, the element mounting substrate 20 and the conductive portion 22a1 are prevented from being short-circuited.

  As described above, in the light emitting module 10, the conductive portion 22 a 1 of the FPC board 22 is configured to be positioned closer to the element mounting board 20 than the light emitting surface of the LED 14. Thereby, it is suppressed that the electroconductive part 22a1 interrupts the light which LED14 emits. Further, since the FPC board 22 can be easily deformed, the position of the connector 26 can be changed. Therefore, by adjusting the position of the connector 26 when the light emitting module 10 is mounted on the lamp, the degree of freedom in layout is increased, and the vehicle lamp can be made compact.

(Second Embodiment)
FIG. 4A is a perspective view of the light emitting module according to the second embodiment, and FIG. 4B is an exploded perspective view of the light emitting module according to the second embodiment. In the light emitting module 30 according to the present embodiment, the leaf spring 32 is fixed to the heat sink 16 with one screw 18. Below, the same code | symbol is attached | subjected about the structure similar to the light emitting module which concerns on each embodiment, and description is abbreviate | omitted suitably.

  The light emitting module 30 according to the second embodiment is different in the shape of the leaf spring 32 from the light emitting module 10 according to the first embodiment. The leaf spring 32 has a main body portion 24a, one fixing portion 24b, and one crank portion 24c protruding from the outer edge portion of the main body portion 24a. The fixed portion 24b and the crank portion 24c are provided on opposite sides of the main body portion 24a. The heat sink 16 has one screw hole 16a and one locking portion 16b. The locking portion 16 b is a bowl-shaped portion protruding from the surface of the heat sink 16.

  Next, an outline of a method for manufacturing the light emitting module 30 will be described. As shown in FIG. 4, the element mounting substrate 20 on which the LEDs 14 are mounted is placed on the heat sink 16. Next, the two conductive portions 22a1 of the FPC board 22 are arranged so as to overlap with the corresponding electrode portions 20b of the element mounting board 20, and the plate springs 24 are placed thereon. At that time, the crank portion 24 c of the leaf spring 32 is locked to the locking portion 16 b of the heat sink 16, and then the fixing portion 24 b is fixed to the heat sink 16 with the screw 18. In this case, since the fixing with the screw 18 is one place, the assembling work can be simplified.

(Third embodiment)
FIG. 5A is a perspective view of a light emitting module according to the third embodiment, and FIG. 5B is an exploded perspective view of the light emitting module according to the third embodiment. In the light emitting module 34 according to the present embodiment, the leaf spring 36 is fixed to the heat sink 16 without using screws. Below, the same code | symbol is attached | subjected about the structure similar to the light emitting module which concerns on each embodiment, and description is abbreviate | omitted suitably.

  The light emitting module 34 according to the third embodiment is different in shape of the leaf spring 36 from the light emitting module according to the above-described embodiment. The plate spring 36 functions as a clip that sandwiches the heat sink 16 from above and below in a state where the element mounting substrate 20 and the FPC substrate 22 are placed at predetermined positions on the heat sink 16. Specifically, the leaf spring 36 includes two arm portions 36a, a connecting portion 36b that connects the base portions of the two arm portions 36a, and a lower surface pressing portion that protrudes substantially parallel to the arm portion 36a from the lower portion of the connecting portion 36b. 36c. The center of the lower surface pressing portion 36c is cut and raised toward the arm portion 36a. On the surface of the heat sink 16, there are provided two holding portions 16c each having an insertion hole so that the tip of each arm portion 36a is held at a predetermined position (height).

  Next, an outline of a method for manufacturing the light emitting module 34 will be described. As shown in FIG. 5, the element mounting substrate 20 on which the LEDs 14 are mounted is placed on the heat sink 16. Next, the two conductive portions 22a1 of the FPC board 22 are arranged so as to overlap the corresponding electrode portions 20b of the element mounting board 20. Then, the plate spring 36 is moved from the direction of arrow B shown in FIG. 5B so as to sandwich the heat sink 16, the element mounting board 20 and the FPC board 22 together. At that time, the tip of the arm portion 36a of the leaf spring 36 is inserted into the insertion hole of the holding portion 16c of the heat sink 16, and the heat sink 16, the element mounting substrate 20 and the FPC substrate 22 are formed by the arm portion 36a and the lower surface pressing portion 36c. Is inserted. Accordingly, the conductive portion 22a1 of the FPC board 22 is in contact with the electrode portion 20b by being sandwiched between the electrode portion 20b and the pressing portion 24a2. In this case, the light emitting module 34 can fix the element mounting substrate 20 and the FPC substrate 22 only by moving the leaf spring 36 without using the screw 18.

(Fourth embodiment)
FIG. 6A is a perspective view of a light emitting module according to the fourth embodiment, and FIG. 6B is an exploded perspective view of the light emitting module according to the fourth embodiment. The light emitting module 38 according to the present embodiment differs from the light emitting module 30 according to the second embodiment in the positions of the fixing portion and the crank portion of the leaf spring 40. Below, the same code | symbol is attached | subjected about the structure similar to the light emitting module which concerns on each embodiment, and description is abbreviate | omitted suitably.

  The light emitting module 38 according to the fourth embodiment differs from the light emitting module 30 according to the second embodiment in the shape of the leaf spring 40 and the positions of the two fixing portions of the leaf spring 40. The leaf spring 40 has a main body portion 40a, one fixing portion 40b, and one crank portion (not shown) protruding from the outer edge portion of the main body portion 40a. The fixed portion 40b and the crank portion are provided on opposite sides of the main body portion 40a. The main body portion 40a has a rectangular opening 40a1, and a fixing portion 40b and a crank portion are formed so as to protrude outward from two short sides surrounding the opening 40a1. The heat sink 16 has one screw hole 16a and one locking portion 16b. The locking portion 16 b is a bowl-shaped portion protruding from the surface of the heat sink 16.

  Since the outline of the manufacturing method of the light emitting module 38 is substantially the same as the manufacturing method of the light emitting module 30, the description is omitted. The operational effects of the light emitting module 38 are substantially the same as those of the light emitting module 30 according to the second embodiment.

(Fifth embodiment)
FIG. 7A is a perspective view of a light emitting module according to the fifth embodiment, and FIG. 7B is an exploded perspective view of the light emitting module according to the fifth embodiment. The light emitting module 42 according to the present embodiment is largely different from the light emitting module 10 according to the first embodiment in that an FPC board 44 having a conductive portion exposed on both sides is used. Below, the same code | symbol is attached | subjected about the structure similar to the light emitting module which concerns on each embodiment, and description is abbreviate | omitted suitably.

  In the FPC board 44, the conductive portion 44a1 that is in contact with the electrode portion 20b of the element mounting board 20 is exposed on the lower surface side shown in FIG. 7B, and the electrode terminal of the connector 46 is connected to the upper surface side. The conductive portion 44a2 is exposed.

(Sixth embodiment)
FIG. 8A is a perspective view of a light emitting module according to the sixth embodiment, and FIG. 8B is an exploded perspective view of the light emitting module according to the sixth embodiment. Compared with the light emitting module 42 according to the fifth embodiment, the light emitting module 48 according to the present embodiment uses an FPC board 50 having a conductive portion exposed on one side (the lower surface side of FIG. 8B). There is a big difference. Below, the same code | symbol is attached | subjected about the structure similar to the light emitting module which concerns on each embodiment, and description is abbreviate | omitted suitably.

  In the FPC board 50, the conductive part 44a1 that contacts the electrode part 20b of the element mounting board 20 is exposed on the lower surface side shown in FIG. 8B, and the electrode terminals of the connector 46 are connected to the lower surface side. The conductive portion 44a2 is exposed.

(Seventh embodiment)
FIG. 9A is a perspective view of a light emitting module according to the seventh embodiment, and FIG. 9B is an exploded perspective view of the light emitting module according to the seventh embodiment. The light emitting module 52 according to the present embodiment is largely different from the light emitting module 38 according to the fourth embodiment in that the connector 54 is connected to the FPC board 22 in a state where the connector 54 is mounted on the glass epoxy board. Different. Below, the same code | symbol is attached | subjected about the structure similar to the light emitting module which concerns on each embodiment, and description is abbreviate | omitted suitably.

  The connector 54 is fixed on a wiring 56 a formed on the glass epoxy substrate 56. The wiring 56 a is formed integrally with the wiring layer 22 a of the FPC board 22. The leaf spring 58 has substantially the same structure as the leaf spring 40 according to the fourth embodiment, but differs in that it has two fixing portions 40b.

(Eighth embodiment)
FIG. 14A is a perspective view of a light emitting module according to the eighth embodiment, and FIG. 14B is an exploded perspective view of the light emitting module according to the eighth embodiment. Compared with the light emitting module 52 according to the seventh embodiment, the light emitting module 70 according to the present embodiment is a boss for positioning the element mounting substrate 20, the leaf spring 72, and the FPC substrate 22 on the heat sink 16. The point that is provided is greatly different.

  The heat sink 16 positions eight board positioning bosses 16d for positioning the element mounting board 20, two FPC positioning bosses 16e for positioning the FPC board 22, and a leaf spring 72 on the same surface. Two leaf spring positioning bosses 16f are formed.

  The rectangular parallelepiped element mounting substrate 20 is positioned by contacting each of the four sides with two substrate positioning bosses 16d.

  The FPC board 22 has a positioning portion 22c made of only the insulating member 22b on the further tip side of the two conductive portions 22a1. The positioning portion 22c has a positioning hole 22c1 through which the FPC positioning boss 16e passes. Then, by mounting the FPC board 22 so that the FPC positioning boss 16e passes through the positioning hole 22c1, the FPC board 22 is positioned at a predetermined position with respect to the element mounting board 20 and the heat sink 16. Here, the FPC positioning boss 16e and the positioning hole 22c1 constitute a first positioning mechanism.

  In the leaf spring 72, positioning holes 72a are formed in the two fixing portions 40b. Then, by mounting the plate spring 72 so that the positioning spring boss 16f passes through the positioning hole 72a, the plate spring 72 is positioned at a predetermined position with respect to the element mounting substrate 20 and the heat sink 16. Here, the leaf spring positioning boss 16f and the positioning hole 72a constitute a second positioning mechanism.

  As described above, the light emitting module 70 according to the present embodiment includes the first positioning mechanism and the second positioning mechanism, so that the conductive portion 22a1 of the FPC board 22 can be placed on the electrode portion 20b of the element mounting board 20. The contact can be made with high accuracy.

(Ninth embodiment)
FIG. 15A is a perspective view of a light emitting module according to the ninth embodiment, and FIG. 15B is an exploded perspective view of the light emitting module according to the ninth embodiment. In the light emitting module 74 according to the present embodiment, compared to the light emitting module 70 according to the eighth embodiment, the boss for positioning the element mounting board 20 is used for positioning the leaf spring 76 and the FPC board 22. The difference is that the boss is also used.

  The heat sink 16 is formed with six substrate positioning bosses 16d1 and two common positioning bosses 16d2 for positioning the element mounting substrate 20 on the same surface.

  The rectangular parallelepiped element mounting substrate 20 is positioned by contacting each of the four sides with two substrate positioning bosses 16d1 or two common positioning holes 16d2.

  The positioning portion 22c of the FPC board 22 has a positioning hole 22c1 through which the common positioning hole 16d2 passes. Then, by mounting the FPC board 22 so that the common positioning hole 16d2 passes through the positioning hole 22c1, the FPC board 22 is positioned at a predetermined position with respect to the element mounting board 20 and the heat sink 16.

  The plate spring 76 has a positioning hole 76b formed in a plate-like rectangular main body 76a. Then, by mounting the plate spring 76 so that the common positioning boss 16d2 passes through the positioning hole 76b, the plate spring 76 is positioned at a predetermined position with respect to the element mounting substrate 20 and the heat sink 16. Here, the common positioning boss 16d2, the positioning hole 22c1, and the positioning hole 72a constitute a positioning mechanism.

  As described above, since the positioning mechanism of the light emitting module 74 according to the present embodiment can simultaneously determine the positions of the FPC board 22 and the leaf spring 76, the configuration can be simplified.

(Tenth embodiment)
FIG. 10 is a schematic diagram showing a schematic configuration of a light emitting module in which a plurality of element mounting substrates are connected. FIG. 11 is a schematic horizontal sectional view of the vehicular lamp according to the tenth embodiment.

  In the light emitting module 60 shown in FIG. 10, a plurality of element mounting substrates are connected by a single FPC substrate 62. Therefore, the connector can be shared by connecting the connector 64 to the FPC board 62. In addition, since it is not necessary to provide a connector corresponding to each element mounting board, the entire light emitting module 60 can be made compact. For example, by adopting such a light emitting module, the vehicle width direction of the vehicular lamp 100 shown in FIG. 11 can be reduced.

  A vehicle lamp 100 shown in FIG. 11 includes a lamp body 112 and a transparent outer cover 113 that covers the front opening of the lamp body 112. The lamp body 112 and the outer cover 113 form a lamp chamber 114. As shown in FIG. 11, the outer cover 113 has a shape that follows the slant nose shape of the vehicle, and is inclined rearward from the vehicle inner side to the outer side. The lamp body 112 is shaped like a staircase from the vehicle inner side to the outer side, following the shape of the slanted outer cover 113 toward the rear of the vehicle. Accordingly, the lamp chamber 114 formed by the lamp body 112 and the outer cover 113 is a space inclined rearward from the vehicle inner side to the outer side.

  In the vehicular lamp 100 shown in FIG. 11, six (six sets) LEDs (118a to 118f) are mounted on one circuit module. In the vehicular lamp 100, a high beam diffusing reflector 116a, a condensing reflector unit 161, and a low beam diffusing reflector 117a are arranged in the lamp chamber 114 in order from the inside of the vehicle. The circuit module 115, the high beam diffusing reflector 116a, the condensing reflector unit 161, and the low beam diffusing reflector 117a are fixed to the lamp body 112 by support members (not shown).

  The condensing reflector unit 161 is used for irradiating the first high beam condensing reflector 116b and the second high beam condensing reflector 116c used for irradiation of the high beam condensing light distribution pattern, and the low beam condensing light distribution pattern. A first low beam condensing reflector 117b and a second low beam condensing reflector 117c are integrally formed. Among these four reflectors, the first high beam condensing reflector 116b is provided at the innermost side of the vehicle, the second high beam condensing reflector 116c is provided outside the first high beam condensing reflector 116b, and the second high beam is provided. A first low beam condensing reflector 117b is provided outside the condensing reflector 116c, and a second low beam condensing reflector 117c is provided outside the first low beam condensing reflector 117b.

  The high beam diffusing reflector 116 a is disposed on the vehicle inner side than the condensing reflector unit 161. In the present embodiment, since the outer cover 113 is inclined rearward from the inside of the vehicle to the outside, the front portion 121 (shown by shading) of the reflecting surface 119a of the high beam diffusing reflector 116a is a condensing reflector. It is located in front of the lamp from the front end of the unit 161.

  FIG. 11 shows light rays L1 and L2 reflected by the front portion 121 of the reflecting surface 119a of the high beam diffusing reflector 116a. In the present embodiment, since the front portion 121 of the reflecting surface 119a of the high beam diffusing reflector 116a is located in front of the lamp relative to the front end portion of the condensing reflector unit 161, the light beams L1 and L2 reflected by the front portion 121 are There is no risk of kicking by the high beam condensing reflector. Therefore, since the diffusion optical path of the light beams L1 and L2 can be secured, the visibility on the side of the vehicle can be improved.

  In the present embodiment, the low beam diffusing reflector 117 a is disposed on the vehicle outer side than the condensing reflector unit 161. However, in the present embodiment, the F value of the reflection surface 120a of the low beam diffusion reflector 117a is set smaller than the F value of the reflection surface 120c of the adjacent second low beam condensing reflector 117c, and the low beam diffusion reflector 117a is set. The front portion 122 (shown by hatching) of the reflective surface 120a is positioned in front of the lamp from the front end of the second low beam condensing reflector 117c.

  FIG. 11 shows light rays L3 and L4 reflected by the front portion 122 of the reflecting surface 120a of the low beam diffusing reflector 117a. In the present embodiment, the front portion 122 of the reflecting surface 120a of the low beam diffusing reflector 117a is positioned in front of the lamp relative to the front end portion of the adjacent second low beam condensing reflector 117c, and thus reflected by the front portion 122. The light rays L3 and L4 are not likely to be kicked by the second low beam condensing reflector 117c. Therefore, since the diffusion optical path of the light beams L3 and L4 can be secured, the visibility on the side of the vehicle can be improved.

  Further, in the present embodiment, as described above, the first high beam condensing reflector 116b, the second high beam condensing reflector 116c, the first low beam condensing reflector 117b, and the second low beam condensing reflector. 117c is integrally formed.

  As described above, the vehicular lamp 100 includes a light emitting module (the circuit module 115 and the LEDs 118a to 118f), and a reflector that reflects the light emitted from the light emitting module toward the front of the vehicle (a high beam diffusion reflector 116a, a condensing reflector unit). 161, a low beam diffusion reflector 117a). The light emitting module is arranged so that the light emitting surface of the LED faces the reflector.

  As described above, the present invention has been described with reference to the above-described embodiments. However, the present invention is not limited to the above-described embodiments, and the configurations of the embodiments are appropriately combined or replaced. Those are also included in the present invention. Further, it is possible to appropriately change the combination and processing order in each embodiment based on the knowledge of those skilled in the art and to add various modifications such as various design changes to each embodiment. Embodiments to which is added can also be included in the scope of the present invention.

  12 is a cross-sectional view showing a modification of the pressing portion of the leaf spring shown in FIG. As for the leaf | plate spring 66 shown in FIG. 12, the surface of the main-body part 24a is flat. And the main-body part 24a is integrally formed with the press part 24a2 provided in the back surface side. Thereby, not the pressing portion 24a2, but the main body portion 24a is mainly deformed, so that the pressing portion 24a2 biases the conductive portion 22a1 to the electrode portion 20b via the insulating member 22b.

  Further, the surface of the leaf spring may be subjected to antireflection treatment so that the light reflected on the surface of each leaf spring described above does not become glare. In the antireflection treatment, for example, a low-reflection coating may be applied, or the surface may be roughened.

  10 light emitting module, 12 circuit module, 14 LED, 16 heat sink, 16a screw hole, 16b locking part, 16c holding part, 18 screw, 20 element mounting board, 20a mounting part, 20b electrode part, 22 FPC board, 22a1 conductive Part, 22a wiring layer, 22b insulating member, 24 leaf spring, 24a2 pressing part, 24a body part, 24a1 opening part, 24b fixing part, 24c crank part, 26 connector, 100 vehicle lamp.

  The present invention can be used for circuit modules and light emitting modules.

Claims (8)

An element mounting substrate having a mounting portion on which a semiconductor light emitting element is mounted and an electrode portion to which a current is supplied to the semiconductor light emitting element;
A power supply member having a conductive portion through which a current supplied to the electrode portion passes;
A pressing member having a pressing portion for pressing the conductive portion,
The conductive module is in contact with the electrode unit by being sandwiched between the electrode unit and the pressing unit.   The pressing member is a plate-like member having an opening formed so as to expose the mounting portion, and the pressing portion is provided on a surface of the plate-like member facing the element mounting substrate. The circuit module according to claim 1. The power supply member is a flexible printed wiring board,
The conductive part as wiring, and an insulating part in which the wiring is formed,
The circuit module according to claim 1, wherein the conductive portion is disposed so as to face the electrode portion, and the insulating portion is opposed to the pressing portion.   The circuit module according to any one of claims 1 to 3, wherein the pressing member is a metal member and has a shape in which at least a part thereof is flexible. A first positioning mechanism that determines a position of the power supply member with respect to the element mounting substrate or a heat dissipation member on which the element mounting substrate is mounted;
5. The apparatus according to claim 1, further comprising a second positioning mechanism that determines a position of the pressing member with respect to the element mounting substrate or a heat radiating member on which the element mounting substrate is mounted. The circuit module according to Item 1.   5. The positioning device according to claim 1, further comprising a positioning mechanism that determines positions of the power feeding member and the pressing member with respect to the element mounting substrate or a heat dissipation member on which the element mounting substrate is mounted. The circuit module according to Item 1. The circuit module according to any one of claims 1 to 6,
A semiconductor light emitting device mounted on the mounting portion,
The light emitting module, wherein the conductive portion is configured to be positioned closer to the element mounting substrate than the light emitting surface of the semiconductor light emitting element. An element mounting substrate having a mounting part on which a semiconductor light emitting element is mounted, an electrode part to which a current to the semiconductor light emitting element is supplied, and a power supply member having a conductive part through which the current supplied to the electrode part passes And a pressing member for fixing
The pressing member has a pressing part that presses the conductive part,
The pressing portion is configured to sandwich the conductive portion between the pressing portion and the electrode portion.
A pressing member characterized by that.

Images