JPWO2015052800A1 - Component mounter - Google Patents

Component mounter Download PDF

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JPWO2015052800A1
JPWO2015052800A1 JP2015541369A JP2015541369A JPWO2015052800A1 JP WO2015052800 A1 JPWO2015052800 A1 JP WO2015052800A1 JP 2015541369 A JP2015541369 A JP 2015541369A JP 2015541369 A JP2015541369 A JP 2015541369A JP WO2015052800 A1 JPWO2015052800 A1 JP WO2015052800A1
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component
positioning
component supply
supply device
positioning hole
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JP6412008B2 (en
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克 齋藤
克 齋藤
将志 沖
将志 沖
慎二 瀧川
慎二 瀧川
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Fuji Corp
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Fuji Machine Manufacturing Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0417Feeding with belts or tapes

Abstract

本発明は、機台に配置された取付部および部品供給装置が有する被取付部の一方に形成された位置決めボスを、他方に形成された位置決め孔に嵌入させて部品供給装置を機台に位置決めする部品実装機であって、取付部に形成された位置決めボスまたは位置決め孔の内壁に設けられて制御装置に通信接続された制御側通信素子と、被取付部に形成された位置決め孔の内壁または位置決めボスに設けられて部品供給装置に通信接続された装置側通信素子とを有し、位置決め時に制御側通信素子と装置側通信素子とが対向して非接触通信が可能となる非接触通信装置をさらに備えた。これにより、被取付部が狭隘であっても、非接触通信部を位置決め部に組み入れた簡素な構成を用いて、部品供給装置の取付構造および内部構造の自由度を確保しつつ、コネクタの不要な非接触通信を安定して行える。The present invention positions a component supply device on a machine base by inserting a positioning boss formed on one of a mounting portion arranged on the machine base and a mounted part of the component supply device into a positioning hole formed on the other side. And a control side communication element that is provided on the inner wall of the positioning boss or the positioning hole formed in the mounting portion and is connected to the control device, and the inner wall of the positioning hole formed in the mounting portion or A non-contact communication device that includes a device-side communication element that is provided on a positioning boss and is connected to a component supply device by communication, and that enables non-contact communication when the control-side communication element and the device-side communication element face each other during positioning. Was further provided. As a result, even if the mounted part is narrow, using a simple configuration that incorporates a non-contact communication part into the positioning part, it is possible to eliminate the need for a connector while ensuring the flexibility of the mounting structure and internal structure of the component supply device Stable non-contact communication.

Description

本発明は、付設された部品供給装置から部品を採取して基板に実装する部品実装機に関し、より詳細には、部品供給装置の位置決め部と非接触通信部とを兼ねた取付構造に関する。   The present invention relates to a component mounter that collects components from an attached component supply device and mounts them on a substrate, and more particularly to an attachment structure that serves as both a positioning unit and a non-contact communication unit of the component supply device.

多数の部品が実装された基板を生産する基板用作業機器として、はんだ印刷機、部品実装機、リフロー機、基板検査機などがあり、これらを連結して基板生産ラインを構築する場合が多い。このうち部品実装機は、基板搬送装置、部品供給装置、部品移載装置、および制御装置を備えるのが一般的である。基板搬送装置は、基板の搬入出および位置決めを行う。部品供給装置は、部品を所定の供給位置に順次供給する。部品移載装置は、部品供給装置から部品を採取して位置決めされた基板に実装する。制御装置は、基板搬送装置、部品供給装置、および部品移載装置の動作を制御する。   There are a solder printing machine, a component mounting machine, a reflow machine, a board inspection machine, and the like as a board working device for producing a board on which a large number of parts are mounted, and a board production line is often constructed by connecting them. Of these, the component mounter generally includes a substrate transfer device, a component supply device, a component transfer device, and a control device. The substrate transfer device carries in and out the substrate and positions the substrate. The component supply device sequentially supplies components to a predetermined supply position. The component transfer device collects components from the component supply device and mounts them on the positioned substrate. The control device controls operations of the substrate transfer device, the component supply device, and the component transfer device.

部品供給装置のうちのカセット式フィーダ装置は、上下方向および前後方向に広がり、幅方向が薄い扁平形状とされ、部品実装機の幅方向に複数列設されるのが一般的である。複数の部品供給装置の取付構造として、直接取付構造およびパレット取付構造が用いられる。直接取付構造では、実装機本体の機台に設けられた取付部に、部品供給装置の被取付部を直接的に取り付ける。パレット取付構造では、複数の取付部を有したパレット部材を用いる。詳述すると、部品実装機の外部で予めパレット部材上に複数の部品供給装置を取り付けておき、パレット部材を部品供給装置とともに機台に搭載する。さらに、搭載したパレット部材上で、部品供給装置を個別に着脱することもできる。   Of the component feeders, the cassette type feeder device is generally flattened in the vertical direction and in the front-rear direction and thin in the width direction, and is generally provided in a plurality of rows in the width direction of the component mounter. A direct attachment structure and a pallet attachment structure are used as the attachment structure of the plurality of component supply devices. In the direct attachment structure, the attached portion of the component supply device is directly attached to the attachment portion provided on the mounting base of the mounting machine body. In the pallet mounting structure, a pallet member having a plurality of mounting portions is used. More specifically, a plurality of component supply devices are previously mounted on the pallet member outside the component mounter, and the pallet member is mounted on the machine base together with the component supply device. Furthermore, the component supply device can be individually attached and detached on the mounted pallet member.

部品供給装置は、部品を供給する機構部にモータなどの電気負荷を有し、他にセンサ類などの電気負荷も有している。さらに、部品供給装置は、部品供給動作を制御する制御部を有するのが一般的である。この制御部は、部品実装機本体側の制御装置と通信して、動作状況や指令、応答などの情報を授受する。制御部を含む電気負荷への給電、ならびに制御部と制御装置との間の通信を行うために、従来から多端子コネクタ(多ピンコネクタ)が用いられてきた。しかしながら、多端子コネクタでは抜き差し操作の繰り返しによる端子の変形や折損などのおそれがある。この対策として非接触給電技術を部品実装機に適用した例が特許文献1〜4に開示されている。   The component supply apparatus has an electrical load such as a motor in a mechanism unit that supplies components, and also has an electrical load such as sensors. Furthermore, the component supply apparatus generally has a control unit that controls the component supply operation. This control unit communicates with the control device on the component mounter main body side, and exchanges information such as operation status, commands, and responses. Conventionally, a multi-terminal connector (multi-pin connector) has been used to supply power to an electrical load including a control unit and to perform communication between the control unit and the control device. However, in a multi-terminal connector, there is a risk of terminal deformation or breakage due to repeated insertion and removal operations. As countermeasures, Patent Documents 1 to 4 disclose examples in which contactless power feeding technology is applied to a component mounting machine.

特許文献1の部品供給装置は、部品供給装置の本体側に固定配置されている1次コイルと、部品供給カセットに設けられている2次コイルと、部品供給カセット内の制御用電子回路とを具備し、1次コイルから2次コイルへ供給される電力によって制御用電子回路が駆動されることを特徴としている。さらに、請求項3以降には、電磁的に結合される複数のコイルによって電源の授受および制御信号の授受が行われる態様が開示されている。これにより、コネクタ等を用いて接続する必要がなく、断線や接触不良等のトラブルがなくなる、とされている。   The component supply device of Patent Document 1 includes a primary coil fixedly arranged on the main body side of the component supply device, a secondary coil provided in the component supply cassette, and a control electronic circuit in the component supply cassette. And the control electronic circuit is driven by electric power supplied from the primary coil to the secondary coil. Further, the third and subsequent aspects disclose a mode in which power supply and control signals are transmitted and received by a plurality of electromagnetically coupled coils. Thereby, it is not necessary to connect using a connector etc., and troubles, such as a disconnection and contact failure, are eliminated.

特許文献2の表面実装機は、フィーダに形成された位置決めピンを実装機本体のフィーダ取付部に形成された位置決め孔に挿入して位置決めするものであり、一次コイルが位置決め孔を囲繞するように設けられる一方、位置決めピンに二次コイルが設けられ、電磁誘導によって一次コイルから二次コイルへ電力が供給されることを特徴としている。これにより、簡易的な構成で電力を非接触状態でフィーダへ供給できる、とされている。   The surface mounting machine of Patent Document 2 is for positioning by inserting a positioning pin formed on a feeder into a positioning hole formed in a feeder mounting portion of a mounting machine body so that a primary coil surrounds the positioning hole. On the other hand, the positioning pin is provided with a secondary coil, and electric power is supplied from the primary coil to the secondary coil by electromagnetic induction. Thereby, it is supposed that electric power can be supplied to a feeder in a non-contact state with a simple configuration.

特許文献3の誘導性エネルギ伝達装置は、1次コイルの巻回された第1磁気コアが装着オートマトン(部品実装機本体)に配属され、2次コイルの巻回された第2磁気コアが部品供給装置に配属されており、少なくとも一方の磁気コアが弾性支承されている。これにより、磁気コアの確実な接触が保障されて誘導性エネルギが伝達され、プラグを省略できる、とされている。   In the inductive energy transfer device of Patent Document 3, a first magnetic core wound with a primary coil is assigned to a mounting automaton (component mounting machine body), and a second magnetic core wound with a secondary coil is a component. Assigned to the supply device, at least one of the magnetic cores is elastically supported. Thereby, reliable contact of the magnetic core is ensured, inductive energy is transmitted, and the plug can be omitted.

特許文献4の電子部品実装装置は、取付部と電子部品供給装置の間に設けられた非接触式の電源供給部と、取付部と電子部品供給装置の間の光導波路を確認用信号が往復したことで電子部品供給装置の装着を検出する装着検出部と、電子部品供給装置の装着を確認してから電源供給部による電源供給を開始する制御手段とを備えることを特徴としている。これにより、電子部品供給装置側に給電を行うことなく取り付け検出が行え、電子部品供給装置側に取り付け検出手段や予備電源を不要にできる、とされている。   In the electronic component mounting apparatus disclosed in Patent Document 4, a confirmation signal reciprocates between a non-contact power supply unit provided between the mounting unit and the electronic component supply unit, and an optical waveguide between the mounting unit and the electronic component supply unit. Thus, the apparatus includes a mounting detection unit that detects mounting of the electronic component supply device, and a control unit that starts power supply by the power supply unit after confirming the mounting of the electronic component supply device. Thereby, it is said that attachment detection can be performed without supplying power to the electronic component supply device side, and an attachment detection means and a standby power supply can be made unnecessary on the electronic component supply device side.

特開平9−307283号公報Japanese Patent Laid-Open No. 9-307283 特開2004−335967号公報JP 2004-335967 A 特開2006−191098号公報JP 2006-191098 A 特開2010−283257号公報JP 2010-283257 A

ところで、特許文献2〜4の技術は、非接触給電の構成を開示しているが非接触通信に関する記載はなく、通信用コネクタをなくすことができない。また、特許文献1の技術は、複数のコイルによって電源の授受および制御信号の授受を行うとされているが、コイルの配設位置が制約される。前述したように、カセット式フィーダ装置は扁平形状であるので、狭隘な被取付部に複数のコイル(非接触通信部、非接触給電部)や位置決め部を配設すると取付構造が複雑化し、部品供給装置の内部構造にも制限が生じる。また、被取付部の限られた幅寸法により非接触通信部や非接触給電部の対向面積が制限されるので、安定した通信性能や給電性能の確保が難しい。   By the way, although the technique of patent documents 2-4 is disclosing the structure of non-contact electric power feeding, there is no description regarding non-contact communication and a communication connector cannot be eliminated. Moreover, although the technique of patent document 1 is supposed to perform transmission / reception of a power supply and control signal by several coils, the arrangement | positioning position of a coil is restrict | limited. As described above, since the cassette type feeder device has a flat shape, if a plurality of coils (non-contact communication section, non-contact power feeding section) and positioning sections are arranged on a narrow mounting section, the mounting structure becomes complicated, and the parts There are also restrictions on the internal structure of the feeder. Moreover, since the opposing area of a non-contact communication part and a non-contact electric power feeding part is restrict | limited by the limited width dimension of a to-be-attached part, it is difficult to ensure the stable communication performance and electric power feeding performance.

本発明は、上記背景技術の問題点に鑑みてなされたものであり、部品供給装置の被取付部が狭隘であっても、非接触通信部を位置決め部に組み入れた簡素な構成を用いて、部品供給装置の取付構造および内部構造の自由度を確保しつつ、コネクタの不要な非接触通信を安定して行える部品実装機を提供することを解決すべき課題とする。さらには、部品供給装置の被取付部が狭隘であっても、コネクタの不要な非接触通信および非接触給電を安定して行える部品実装機を提供することを解決すべき課題とする。   The present invention has been made in view of the problems of the background art described above, and even if the mounted portion of the component supply device is narrow, using a simple configuration in which the non-contact communication portion is incorporated in the positioning portion, It is an object to be solved to provide a component mounter that can stably perform unnecessary non-contact communication of a connector while ensuring the flexibility of the mounting structure and internal structure of a component supply device. Furthermore, it is an object to be solved to provide a component mounter that can stably perform non-contact communication and non-contact power feeding of a connector even when a mounted portion of a component supply device is narrow.

上記課題を解決する請求項1に係る部品実装機の発明は、取付部が配置された機台と、前記取付部に取り付けられる被取付部を有して部品を供給する部品供給装置と、前記部品供給装置から前記部品を採取して基板に実装する部品移載装置と、前記機台に設けられて前記部品供給装置および前記部品移載装置を制御する制御装置とを備え、前記取付部および前記被取付部の一方に形成された位置決めボスを前記取付部および前記被取付部の他方に形成された位置決め孔に嵌入させて、前記部品供給装置を前記機台に位置決めする部品実装機であって、前記取付部に形成された前記位置決めボスまたは前記位置決め孔の内壁に設けられて前記制御装置に通信接続された制御側通信素子と、前記被取付部に形成された前記位置決め孔の内壁または前記位置決めボスに設けられて前記部品供給装置に通信接続された装置側通信素子とを有し、前記位置決めボスを前記位置決め孔に嵌入させたときに前記制御側通信素子と前記装置側通信素子とが対向して前記制御装置と前記部品供給装置との間で非接触通信が可能となる非接触通信装置をさらに備えた。   The invention of the component mounting machine according to claim 1 that solves the above-described problem includes a machine base on which a mounting portion is arranged, a component supply device that has a mounted portion that is attached to the mounting portion, and supplies a component, A component transfer device that picks up the component from a component supply device and mounts the component on a substrate; and a control device that is provided on the machine base and controls the component supply device and the component transfer device. A component mounter for positioning a component supply device on the machine base by inserting a positioning boss formed on one of the mounted portions into a positioning hole formed on the other of the mounted portion and the mounted portion. A control side communication element provided on the inner wall of the positioning boss or the positioning hole formed in the mounting portion and connected to the control device, and an inner wall of the positioning hole formed in the mounted portion or A device-side communication element provided on the positioning boss and communicatively connected to the component supply device, and the control-side communication element and the device-side communication element when the positioning boss is inserted into the positioning hole. Is further provided with a non-contact communication device that enables non-contact communication between the control device and the component supply device.

これによれば、部品供給装置の位置決め部として設けられる位置決めボスおよび位置決め孔に、非接触通信部となる制御側通信素子および装置側通信素子を組み入れて簡素な構成にできる。したがって、位置決め部および非接触通信部の配設スペースが節約され、部品供給装置の被取付部が狭隘であっても、取付構造および内部構造の自由度を確保できる。また、制御側通信素子および装置側通信素子は、位置決めボスの長さや位置決め孔の深さを大きくすることで大形化が可能になる。したがって、被取付部の限られた幅寸法に制約されず、制御側通信素子と装置側通信素子との対向面積を十分に確保でき、コネクタの不要な非接触通信を安定して行える。   According to this, the control-side communication element and the apparatus-side communication element that become the non-contact communication part can be incorporated into the positioning boss and the positioning hole provided as the positioning part of the component supply device, and the configuration can be simplified. Therefore, the space for arranging the positioning unit and the non-contact communication unit is saved, and the degree of freedom of the mounting structure and the internal structure can be ensured even when the mounted portion of the component supply device is narrow. Further, the control-side communication element and the apparatus-side communication element can be increased in size by increasing the length of the positioning boss and the depth of the positioning hole. Therefore, the facing area between the control-side communication element and the apparatus-side communication element can be sufficiently secured without being limited by the limited width dimension of the attached portion, and unnecessary non-contact communication of the connector can be stably performed.

本発明の実施形態の部品実装機の全体構成を示した斜視図である。It is the perspective view which showed the whole structure of the component mounting machine of embodiment of this invention. 実施形態におけるパレット部材と部品供給装置との取付構造を示す側面図である。It is a side view which shows the attachment structure of the pallet member and component supply apparatus in embodiment. 図2の矢印A方向から見たパレット部材の正面図である。It is a front view of the pallet member seen from the arrow A direction of FIG. 図2の矢印B方向から見た部品供給装置の前面図である。FIG. 3 is a front view of the component supply device viewed from the direction of arrow B in FIG. 実施形態の部品実装機の非接触通信装置および非接触給電装置の回路構成を模式的に示した図である。It is the figure which showed typically the circuit structure of the non-contact communication apparatus and non-contact electric power feeder of the component mounting machine of embodiment.

本発明の実施形態の部品実装機1について、図1〜図5を参考にして説明する。図1は、本発明の実施形態の部品実装機1の全体構成を示した斜視図である。図1の左奥から右手前に向かう方向がX軸方向、右奥から左手前に向かう方向がY軸方向、上に向かう方向がZ軸方向である。部品実装機1は、基板搬送装置2、複数の部品供給装置3、部品移載装置4、部品カメラ5、および制御装置6(図5示)が機台9に組み付けられて構成されている。基板搬送装置2、部品供給装置3、部品移載装置4、および部品カメラ5は、制御装置6から制御され、それぞれが所定の作業を行うようになっている。   A component mounter 1 according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing an overall configuration of a component mounter 1 according to an embodiment of the present invention. In FIG. 1, the direction from the left back to the right front is the X-axis direction, the direction from the right back to the left front is the Y-axis direction, and the upward direction is the Z-axis direction. The component mounter 1 is configured by assembling a substrate transport device 2, a plurality of component supply devices 3, a component transfer device 4, a component camera 5, and a control device 6 (shown in FIG. 5) on a machine base 9. The substrate transfer device 2, the component supply device 3, the component transfer device 4, and the component camera 5 are controlled by the control device 6, and each performs a predetermined operation.

基板搬送装置2は、基板Kを装着実施位置に搬入し位置決めし搬出する。基板搬送装置2は、第1および第2ガイドレール21、22、一対のコンベアベルト、およびクランプ装置などで構成されている。第1および第2ガイドレール21、22は、機台9の上部中央を横断して搬送方向(X軸方向)に延在し、かつ互いに平行するように機台9に組み付けられている。第1および第2ガイドレール21、22の内側に、互いに平行に配置された一対のコンベアベルト(図略)が並設されている。環状のコンベアベルトは、コンベア搬送面に基板Kを戴置した状態で輪転して、基板Kを機台9の中央部に設定された装着実施位置に搬入および搬出する。装着実施位置のコンベアベルトの下方には、クランプ装置(図略)が設けられている。クランプ装置は、基板Kを押し上げて水平姿勢でクランプし、装着実施位置に位置決めする。これにより、部品移載装置4が装着実施位置で装着動作を行えるようになる。   The substrate transfer device 2 carries the substrate K into the mounting position, positions it, and carries it out. The substrate transfer device 2 includes first and second guide rails 21 and 22, a pair of conveyor belts, a clamp device, and the like. The first and second guide rails 21 and 22 extend in the transport direction (X-axis direction) across the upper center of the machine base 9 and are assembled to the machine base 9 so as to be parallel to each other. Inside the first and second guide rails 21 and 22, a pair of conveyor belts (not shown) arranged in parallel to each other are arranged in parallel. The annular conveyor belt rotates with the substrate K placed on the conveyor conveyance surface, and carries the substrate K into and out of the mounting position set at the center of the machine base 9. A clamp device (not shown) is provided below the conveyor belt at the mounting position. The clamp device pushes up the substrate K, clamps it in a horizontal posture, and positions it at the mounting position. As a result, the component transfer device 4 can perform the mounting operation at the mounting position.

複数の部品供給装置3は、カセット式フィーダ装置であり、それぞれ部品を順次供給する。複数の部品供給装置3は、パレット部材91上に幅方向(X軸方向)に列設され、部品実装機1の長手方向の前部(図1の左手前側)に配置されている。各部品供給装置3は、本体部32と、本体部32の後部に設けられた供給リール33と、本体部32の先端に設けられた部品取出部34とを備えている。供給リール33には多数の部品が所定ピッチで収納された細長いテープ(図略)が巻回保持されている。このテープがスプロケット(図略)により所定ピッチずつ引き出され、部品が収納状態を解除されて部品取出部34に順次送り込まれるようになっている。   The plurality of component supply devices 3 are cassette-type feeder devices, and each sequentially supplies components. The plurality of component supply devices 3 are arranged in the width direction (X-axis direction) on the pallet member 91 and are arranged on the front portion in the longitudinal direction of the component mounter 1 (the left front side in FIG. 1). Each component supply device 3 includes a main body portion 32, a supply reel 33 provided at the rear portion of the main body portion 32, and a component take-out portion 34 provided at the tip of the main body portion 32. An elongated tape (not shown) in which a large number of parts are stored at a predetermined pitch is wound and held on the supply reel 33. The tape is pulled out at a predetermined pitch by a sprocket (not shown), and the components are released from the stored state and sequentially fed into the component take-out portion 34.

部品供給装置3は、上下方向(Z軸方向)および前後方向(Y軸方向)に広がり、幅方向(X軸方向)が薄い扁平形状である。部品供給装置3は、部品を供給する機構部にモータなどの電気負荷87(図5示)を有し、他にセンサ類などの電気負荷87も有している。さらに、部品供給装置3は、部品供給動作を制御する制御部39(図5示)を有している。制御部39は、本体側の制御装置6と通信して、動作状況や指令、応答などの情報を授受する。制御部39も電気負荷87の一部である。   The component supply device 3 has a flat shape that extends in the up-down direction (Z-axis direction) and the front-rear direction (Y-axis direction) and is thin in the width direction (X-axis direction). The component supply device 3 has an electrical load 87 (shown in FIG. 5) such as a motor in a mechanism unit that supplies components, and also has an electrical load 87 such as sensors. Furthermore, the component supply device 3 includes a control unit 39 (shown in FIG. 5) that controls the component supply operation. The control unit 39 communicates with the control device 6 on the main body side, and exchanges information such as operation status, commands, and responses. The control unit 39 is also a part of the electric load 87.

部品移載装置4は、複数の部品供給装置3の各部品取出部34から部品を吸着採取し、位置決めされた基板Kまで搬送して装着する。部品移載装置4は、X軸方向およびY軸方向に水平移動可能なXYロボットタイプの装置である。部品移載装置4は、一対のY軸レール41、42、Y軸スライダ43、ヘッド保持部44、およびノズルヘッド45などで構成されている。一対のY軸レール41、42は、機台9の長手方向(Y軸方向)の後部(図1の右奥側)から前部の部品供給装置3の上方にかけて配設されている。Y軸レール41、42上に、Y軸スライダ43がY軸方向に移動可能に装架されている。Y軸スライダ43には、ヘッド保持部44がX軸方向に移動可能に装架されている。ヘッド保持部44は、その下側にノズルヘッド45を交換可能に保持する。ヘッド保持部44は、2つのサーボモータによって水平2方向(X軸およびY軸方向)に駆動される。また、ヘッド保持部44の底面には、基板Kを撮像する基板カメラ48が下向きに設けられている。基板カメラ48は、位置決めされた基板Kのフィデューシャルマークを読み取り、基板Kの位置決め誤差を検出する。これにより、基板K上の座標値が較正され、部品を装着する位置の制御が正確に行われる。   The component transfer device 4 sucks and collects components from the component take-out portions 34 of the plurality of component supply devices 3, transports them to the positioned substrate K, and mounts them. The component transfer device 4 is an XY robot type device that can move horizontally in the X-axis direction and the Y-axis direction. The component transfer device 4 includes a pair of Y-axis rails 41 and 42, a Y-axis slider 43, a head holding unit 44, a nozzle head 45, and the like. The pair of Y-axis rails 41, 42 are arranged from the rear part (right rear side in FIG. 1) in the longitudinal direction (Y-axis direction) of the machine base 9 to above the front part supply device 3. A Y-axis slider 43 is mounted on the Y-axis rails 41 and 42 so as to be movable in the Y-axis direction. A head holding portion 44 is mounted on the Y-axis slider 43 so as to be movable in the X-axis direction. The head holding portion 44 holds the nozzle head 45 in a replaceable manner on the lower side thereof. The head holding unit 44 is driven in two horizontal directions (X-axis and Y-axis directions) by two servo motors. A substrate camera 48 that captures an image of the substrate K is provided on the bottom surface of the head holding unit 44 downward. The substrate camera 48 reads a fiducial mark of the substrate K that has been positioned, and detects a positioning error of the substrate K. Thereby, the coordinate value on the board | substrate K is calibrated, and control of the position which mounts components is performed correctly.

部品カメラ5は、基板搬送装置2と部品供給装置3との間の機台9の上面に、上向きに設けられている。部品カメラ5は、ノズルヘッド45が部品供給装置3から基板K上に移動する途中で、吸着採取されている部品の状態を撮像して検出するものである。部品カメラ5が部品の吸着姿勢の誤差や回転角のずれなどを検出すると、制御装置6は、必要に応じて部品装着動作を微調整し、装着が困難な場合には当該の部品を廃棄する。   The component camera 5 is provided upward on the upper surface of the machine base 9 between the substrate transfer device 2 and the component supply device 3. The component camera 5 captures and detects the state of the component picked up by suction while the nozzle head 45 moves from the component supply device 3 onto the substrate K. When the component camera 5 detects an error in the component suction posture or a shift in the rotation angle, the control device 6 finely adjusts the component mounting operation as necessary, and discards the component when mounting is difficult. .

制御装置6は、機台9に設けられている。制御装置6は、生産する基板Kの種類と装着する部品の部品種との対応関係、部品の装着座標値、複数の部品供給装置3からそれぞれ供給される部品種、部品種の装着順序などの生産データを保持している。また、制御装置6は、生産完了した基板Kの生産数や、部品の装着に要した装着時間、部品の吸着エラーの発生回数などの稼動データを逐次更新する。そして、制御装置6は、生産データおよび稼動データに加え、基板カメラ47や部品カメラ5の撮像データ、および図略のセンサの検出データなどに基づいて、部品装着動作を制御する。   The control device 6 is provided on the machine base 9. The control device 6 determines the correspondence between the type of board K to be produced and the component type of the component to be mounted, the component mounting coordinate values, the component types supplied from the plurality of component supply devices 3, the mounting order of the component types, and the like. Holds production data. In addition, the control device 6 sequentially updates operation data such as the number of boards K that have been produced, the mounting time required for mounting components, and the number of occurrences of component suction errors. Then, the control device 6 controls the component mounting operation based on the image data of the board camera 47 and the component camera 5 and the detection data of a sensor (not shown) in addition to the production data and the operation data.

次に、部品供給装置3の取付構造について説明する。図2は、実施形態におけるパレット部材91と部品供給装置3との取付構造を示す側面図である。また、図3は、図2の矢印A方向から見たパレット部材91の正面図であり、図4は、図2の矢印B方向から見た部品供給装置3の前面図である。   Next, the mounting structure of the component supply device 3 will be described. FIG. 2 is a side view showing a mounting structure between the pallet member 91 and the component supply device 3 in the embodiment. 3 is a front view of the pallet member 91 seen from the direction of arrow A in FIG. 2, and FIG. 4 is a front view of the component supply device 3 seen from the direction of arrow B in FIG.

パレット部材91は、複数の部品供給装置3を取り付ける部材であり、機台9の上面に着脱可能に保持される。パレット部材91は、底板部92および複数の取付部93からなる。底板部92は、矩形板状であり、その幅寸法(X軸方向寸法)は、機台9の幅寸法に概ね等しいか小さめである。底板部92の長さ寸法(Y軸方向寸法)は、部品供給装置3の本体32の前後方向の長さに概ね等しい。図3に示されるように、底板部92の上面には、溝断面が矩形でY軸方向に延びるガイド溝921が等しいピッチPで平行して刻設されている。ガイド溝921の個数は、取り付ける部品供給装置3の個数に一致している。ガイド溝921のピッチPは、部品供給装置3の本体部32の幅寸法W0(図4示)よりもわずかに大とされている。   The pallet member 91 is a member for attaching the plurality of component supply devices 3, and is detachably held on the upper surface of the machine base 9. The pallet member 91 includes a bottom plate portion 92 and a plurality of attachment portions 93. The bottom plate portion 92 has a rectangular plate shape, and its width dimension (X-axis direction dimension) is substantially equal to or smaller than the width dimension of the machine base 9. The length dimension (Y-axis direction dimension) of the bottom plate portion 92 is approximately equal to the length of the main body 32 of the component supply device 3 in the front-rear direction. As shown in FIG. 3, guide grooves 921 having a rectangular groove cross section and extending in the Y-axis direction are formed on the upper surface of the bottom plate portion 92 in parallel at an equal pitch P. The number of guide grooves 921 matches the number of component supply devices 3 to be attached. The pitch P of the guide grooves 921 is slightly larger than the width dimension W0 (shown in FIG. 4) of the main body 32 of the component supply device 3.

底板部92の前縁の各ガイド溝921が途切れた正面に、それぞれ取付部93が立設されている。図3で、1つの取付部93は実線で表され、その両側の取付部93は外形のみが破線で表され、さらにその両側は図示省略されている。各取付部93は、上下に長い略直方体形状である。取付部93のガイド溝921に向かう側の面には、上側から順番に上側位置決め孔94、給電位置決め孔96、および下側位置決め孔95が設けられている。   Attaching portions 93 are erected on the front surface where the guide grooves 921 at the front edge of the bottom plate portion 92 are interrupted. In FIG. 3, one mounting portion 93 is represented by a solid line, and only the outer shape of the mounting portions 93 on both sides thereof is represented by a broken line, and both sides thereof are not shown. Each attachment portion 93 has a substantially rectangular parallelepiped shape that is long in the vertical direction. An upper positioning hole 94, a power supply positioning hole 96, and a lower positioning hole 95 are provided in order from the upper side on the surface of the mounting portion 93 toward the guide groove 921.

上側位置決め孔94および下側位置決め孔95は、互いに同形同大であり、矩形の孔断面の有底孔である。上側位置決め孔94および下側位置決め孔95の深さD1であり、矩形の孔断面の内側高さH1、内側幅W1である。上側位置決め孔94および下側位置決め孔95の2つの側壁には、それぞれ矩形の通信電極711〜714が埋め込まれている。各通信電極711〜714は、上側位置決め孔94および下側位置決め孔95の開口面よりも少し入った箇所から始まり、上側位置決め孔94および下側位置決め孔95の底面を超えて延在している。各通信電極711〜714は、銅などの導体で形成されており、孔94、95側の表面には絶縁被覆が施されている。かつ、各通信電極711〜714は、上側位置決め孔94および下側位置決め孔95の内壁面よりもわずかに引っ込んでいる。   The upper positioning hole 94 and the lower positioning hole 95 have the same shape and the same size, and are bottomed holes having a rectangular hole cross section. It is the depth D1 of the upper positioning hole 94 and the lower positioning hole 95, and the inner height H1 and the inner width W1 of the rectangular hole cross section. Rectangular communication electrodes 711 to 714 are embedded in the two side walls of the upper positioning hole 94 and the lower positioning hole 95, respectively. Each of the communication electrodes 711 to 714 starts from a position slightly inserted from the opening surfaces of the upper positioning hole 94 and the lower positioning hole 95 and extends beyond the bottom surfaces of the upper positioning hole 94 and the lower positioning hole 95. . Each of the communication electrodes 711 to 714 is made of a conductor such as copper, and an insulating coating is applied to the surfaces of the holes 94 and 95. The communication electrodes 711 to 714 are slightly retracted from the inner wall surfaces of the upper positioning hole 94 and the lower positioning hole 95.

給電位置決め孔96は、上側位置決め孔94と下側位置決め孔95との間に設けられている。給電位置決め孔96は、矩形の開口面よりも矩形の底面が小さく、かつ底の浅い額縁形状の有底孔である。給電位置決め孔96の深さD2は、上側位置決め孔94および下側位置決め孔95の深さD1の数分の1程度と小さい。給電位置決め孔96の矩形の底面の内側高さH2は、上側位置決め孔94および下側位置決め孔95の内側高さH1の数倍程度と大きく、内側幅W2は、上側位置決め孔94および下側位置決め孔95の内側幅W1に概ね等しい。   The power feeding positioning hole 96 is provided between the upper positioning hole 94 and the lower positioning hole 95. The feed positioning hole 96 is a bottomed hole having a frame shape with a rectangular bottom surface smaller than the rectangular opening surface and a shallow bottom. The depth D2 of the power supply positioning hole 96 is as small as about a fraction of the depth D1 of the upper positioning hole 94 and the lower positioning hole 95. The inner height H2 of the rectangular bottom surface of the power supply positioning hole 96 is as large as several times the inner height H1 of the upper positioning hole 94 and the lower positioning hole 95, and the inner width W2 is larger than the upper positioning hole 94 and the lower positioning hole 94. It is approximately equal to the inner width W1 of the hole 95.

取付部93の給電位置決め孔96の底面の奥には、非接触給電部81が配設されている。非接触給電部81は、位置決め孔96の底面に臨んで上下に配置された1対の給電電極811、812を含んでいる。給電電極811、812は、銅などの導体で形成されており、その表面には絶縁被覆が施されている。   A non-contact power feeding portion 81 is disposed at the back of the bottom surface of the power feeding positioning hole 96 of the mounting portion 93. The non-contact power supply unit 81 includes a pair of power supply electrodes 811 and 812 that are arranged vertically so as to face the bottom surface of the positioning hole 96. The power supply electrodes 811 and 812 are formed of a conductor such as copper, and an insulating coating is applied to the surface thereof.

取付部93は、全体が樹脂製の一体成型品とされている。取付部93は、例えば、通信用電極711〜714および非接触給電部81を鋳込みつつ、3つの位置決め孔94〜96を形成する樹脂成型加工法により製造できる。さらに、樹脂表面の適宜箇所に電磁遮蔽塗料を塗布してフレームグラウンドに接地している。   The mounting portion 93 is an integrally molded product made entirely of resin. The attachment portion 93 can be manufactured by, for example, a resin molding method that forms the three positioning holes 94 to 96 while casting the communication electrodes 711 to 714 and the non-contact power feeding portion 81. Further, an electromagnetic shielding paint is applied to an appropriate location on the resin surface and grounded to the frame ground.

部品供給装置3は、図2に示されるように、本体32の底面にガイド突部321を有し、本体32の前面に被取付部35を有している。ガイド突部321は、断面が矩形でY軸方向に延在している。ガイド突部321は、パレット部材91の底板92のガイド溝921に嵌入してスライド移動可能であり、底板92上で部品供給装置3を取付部93に向けて案内する。   As shown in FIG. 2, the component supply device 3 includes a guide protrusion 321 on the bottom surface of the main body 32, and a mounted portion 35 on the front surface of the main body 32. The guide protrusion 321 has a rectangular cross section and extends in the Y-axis direction. The guide protrusion 321 is slidable by being inserted into the guide groove 921 of the bottom plate 92 of the pallet member 91, and guides the component supply device 3 toward the mounting portion 93 on the bottom plate 92.

被取付部35は、本体部32と同じ幅寸法W0で、上下に長い略直方体形状である。被取付部35の前面には、上側から順番に上側位置決めボス36、受電位置決めボス38、および下側位置決めボス37が突設されている。上側位置決めボス36、受電位置決めボス38、および下側位置決めボス37の配設高さ位置(Z軸方向位置)は、それぞれパレット部材91の上側位置決め孔94、給電位置決め孔96、および下側位置決め孔95に合わせられている。上側位置決めボス36および下側位置決めボス37は、互いに同形同大であり、矩形に突出している。上側位置決めボス36および下側位置決めボス37の突出した長さL1は、上側位置決め孔94および下側位置決め孔95の深さD1よりわずかに小さい。上側位置決めボス36および下側位置決めボス37の突出の高さH3および幅W3は、上側位置決め孔94および下側位置決め孔95の内側高さH1および内側幅W1よりわずかに小さい。したがって、上側位置決めボス36および下側位置決めボス37は、上側位置決め孔94および下側位置決め孔95に正面から嵌入でき、斜め方向からは嵌入できない。   The attached portion 35 has the same width W0 as the main body portion 32 and has a substantially rectangular parallelepiped shape that is long in the vertical direction. An upper positioning boss 36, a power receiving positioning boss 38, and a lower positioning boss 37 project from the front surface of the attached portion 35 in order from the upper side. The placement height positions (Z-axis direction positions) of the upper positioning boss 36, the power receiving positioning boss 38, and the lower positioning boss 37 are the upper positioning hole 94, the power feeding positioning hole 96, and the lower positioning hole of the pallet member 91, respectively. 95. The upper positioning boss 36 and the lower positioning boss 37 have the same shape and the same size, and protrude in a rectangular shape. The protruding length L1 of the upper positioning boss 36 and the lower positioning boss 37 is slightly smaller than the depth D1 of the upper positioning hole 94 and the lower positioning hole 95. The protruding height H3 and width W3 of the upper positioning boss 36 and the lower positioning boss 37 are slightly smaller than the inner height H1 and the inner width W1 of the upper positioning hole 94 and the lower positioning hole 95. Therefore, the upper positioning boss 36 and the lower positioning boss 37 can be fitted into the upper positioning hole 94 and the lower positioning hole 95 from the front, and cannot be fitted from an oblique direction.

上側位置決めボス36および下側位置決めボス37の2つの側面には、それぞれ矩形の通信電極721〜724が埋め込まれている。各通信電極721〜724は、上側位置決めボス36および下側位置決めボス37の先端よりも少し後ろの箇所から始まり、突出の根元まで延在している。各通信電極721〜724は、銅などの導体で形成されており、表面には絶縁被覆が施されている。かつ、各通信電極721〜724は、上側位置決めボス36および下側位置決めボス37の表面よりもわずかに引っ込んでいる。   Rectangular communication electrodes 721 to 724 are embedded in two side surfaces of the upper positioning boss 36 and the lower positioning boss 37, respectively. Each of the communication electrodes 721 to 724 starts from a position slightly behind the tips of the upper positioning boss 36 and the lower positioning boss 37 and extends to the base of the protrusion. Each communication electrode 721-724 is formed with conductors, such as copper, and the insulation coating is given to the surface. The communication electrodes 721 to 724 are slightly recessed from the surfaces of the upper positioning boss 36 and the lower positioning boss 37.

受電位置決めボス38は、上側位置決めボス36と下側位置決めボス37との間に設けられている。受電位置決めボス38は、矩形の根元よりも矩形の先端が小さくかつ低い額縁形状の突部である。受電位置決めボス38の突出長さL2は、給電位置決め孔96の深さD2よりわずかに大きい。受電位置決めボス38の矩形の先端の高さH4は、給電位置決め孔96の内側高さH2に概ね等しく、先端の幅W4は、給電位置決め孔96の内側幅W2に概ね等しい。   The power receiving positioning boss 38 is provided between the upper positioning boss 36 and the lower positioning boss 37. The power receiving positioning boss 38 is a frame-shaped protrusion having a rectangular tip smaller and lower than the rectangular base. The protruding length L2 of the power receiving positioning boss 38 is slightly larger than the depth D2 of the power feeding positioning hole 96. The height H4 of the rectangular tip of the power receiving positioning boss 38 is substantially equal to the inner height H2 of the power feeding positioning hole 96, and the width W4 of the tip is substantially equal to the inner width W2 of the power feeding positioning hole 96.

受電位置決めボス38の内部には、非接触受電部85が配設されている。非接触受電部85は、受電位置決めボス38の先端面に臨んで上下に配置された1対の受電電極851、852を含んでいる。受電電極851、852は、銅などの導体で形成されており、その表面には絶縁被覆が施されている。   A non-contact power receiving portion 85 is disposed inside the power receiving positioning boss 38. The non-contact power reception unit 85 includes a pair of power reception electrodes 851 and 852 that are arranged vertically so as to face the distal end surface of the power reception positioning boss 38. The power receiving electrodes 851 and 852 are made of a conductor such as copper, and an insulating coating is applied to the surface thereof.

被取付部35は、取付部93と同様に、全体が樹脂製の一体成型品とされている。被取付部35は、例えば、通信用電極721〜724および非接触受電部85を鋳込みつつ、3つの位置決めボス36〜38を形成する樹脂成型加工法により製造できる。さらに、樹脂表面の適宜箇所に電磁遮蔽塗料を塗布してフレームグラウンドに接地している。なお、図2に破線で示されるように、部品供給装置3の本体部32の上部の被取付部35に近い箇所に、部品取出部34が配置される。   Similar to the attachment portion 93, the entire attachment portion 35 is an integrally molded product made of resin. The attached portion 35 can be manufactured by, for example, a resin molding method that forms the three positioning bosses 36 to 38 while casting the communication electrodes 721 to 724 and the non-contact power receiving portion 85. Further, an electromagnetic shielding paint is applied to an appropriate location on the resin surface and grounded to the frame ground. Note that, as indicated by a broken line in FIG. 2, the component take-out unit 34 is disposed at a location near the mounted portion 35 on the upper portion of the main body 32 of the component supply device 3.

次に、部品供給装置3をパレット部材91に取り付ける手順について説明する。作業者は、部品供給装置3をパレット部材91の底板92上に載置し、ガイド突部321をガイド溝921に嵌入させる。次に、図2の太線矢印Cに示されるように、部品供給装置3をパレット部材91の取付部93に向けてスライド移動させる。これにより、上側位置決めボス36および下側位置決めボス37を平行操作できる。上側位置決めボス36および下側位置決めボス37は、同時に上側位置決め孔94および下側位置決め孔95に嵌入し始める。これにより、部品供給装置3とパレット部材91との上下方向(Z軸方向)および幅方向(X軸方向)の位置関係が決まる。   Next, a procedure for attaching the component supply device 3 to the pallet member 91 will be described. The operator places the component supply device 3 on the bottom plate 92 of the pallet member 91 and inserts the guide protrusion 321 into the guide groove 921. Next, as indicated by a thick arrow C in FIG. 2, the component supply device 3 is slid toward the attachment portion 93 of the pallet member 91. Thereby, the upper positioning boss 36 and the lower positioning boss 37 can be operated in parallel. The upper positioning boss 36 and the lower positioning boss 37 start to be fitted into the upper positioning hole 94 and the lower positioning hole 95 at the same time. Thereby, the positional relationship between the vertical direction (Z-axis direction) and the width direction (X-axis direction) between the component supply device 3 and the pallet member 91 is determined.

さらに、部品供給装置3をスライド移動させてゆくと、受電位置決めボス38が給電置決め孔96に正対して、まっすぐに嵌入する。最終的に、受電電極851、852が給電電極811、812に電極面全体で当接して、スライド移動は終了する。これにより、部品供給装置3とパレット部材91とのスライド方向(Y軸方向)の位置関係が決まり、取り付け手順が終了する。このとき、上下の位置決めボス36、37の大部分が上下の位置決め孔94、95へ嵌入し、嵌入深さが定まる。そして、位置決めボス36、37側の各通信電極721〜724の表面積の大部分は、位置決め孔94、95側の各通信電極711〜714に離隔対向する。   Further, when the component supply device 3 is slid, the power receiving positioning boss 38 faces the power supply positioning hole 96 and is fitted straight. Finally, the power receiving electrodes 851 and 852 come into contact with the power feeding electrodes 811 and 812 on the entire electrode surface, and the sliding movement is finished. Thereby, the positional relationship of the sliding direction (Y-axis direction) of the component supply apparatus 3 and the pallet member 91 is determined, and an attachment procedure is complete | finished. At this time, most of the upper and lower positioning bosses 36 and 37 are inserted into the upper and lower positioning holes 94 and 95, and the insertion depth is determined. And most of the surface areas of the communication electrodes 721 to 724 on the positioning bosses 36 and 37 side face the communication electrodes 711 to 714 on the positioning holes 94 and 95 side.

この後、パレット部材91を部品供給装置3とともに機台9上に搭載すると、図5に示される非接触通信装置7および非接触給電装置8の回路構成が実現される。図5は、実施形態の部品実装機1の非接触通信装置7および非接触給電装置8の回路構成を模式的に示した図である。図5の左側が機台9およびパレット部材91側の構成であり、右側が部品供給装置3側の構成である。なお、図5は、1台の部品供給装置3ついて示したものであり、部品実装機1の全体では、複数の部品供給装置3の台数分の回路構成が実現される。   Thereafter, when the pallet member 91 is mounted on the machine base 9 together with the component supply device 3, the circuit configurations of the non-contact communication device 7 and the non-contact power supply device 8 shown in FIG. 5 are realized. FIG. 5 is a diagram schematically illustrating a circuit configuration of the contactless communication device 7 and the contactless power supply device 8 of the component mounter 1 according to the embodiment. The left side of FIG. 5 is the configuration on the machine base 9 and the pallet member 91 side, and the right side is the configuration on the component supply device 3 side. FIG. 5 shows one component supply device 3, and the entire component mounter 1 realizes a circuit configuration corresponding to the number of the plurality of component supply devices 3.

図5に示されるように、位置決め孔94、95側の各通信電極711〜714は、機台9側の制御装置6の通信インターフェース61に通信接続される。一方、位置決めボス36、37側の通信電極721〜724は、部品供給装置3側の制御部39の通信インターフェース391に通信接続されている。位置決め孔94、95側の通信電極711〜714と、位置決めボス36、37側の通信電極721〜724とはそれぞれ離隔対向し、4個のコンデンサが構成されて容量結合される。   As shown in FIG. 5, the communication electrodes 711 to 714 on the positioning holes 94 and 95 side are communicatively connected to the communication interface 61 of the control device 6 on the machine base 9 side. On the other hand, the communication electrodes 721 to 724 on the positioning bosses 36 and 37 side are communicatively connected to the communication interface 391 of the control unit 39 on the component supply device 3 side. The communication electrodes 711 to 714 on the positioning holes 94 and 95 side and the communication electrodes 721 to 724 on the positioning bosses 36 and 37 are spaced apart from each other, and four capacitors are configured and capacitively coupled.

これにより、4線からなる非接触通信装置7が構成される。非接触通信装置7は、制御装置6と部品供給装置3の制御部39との間で非接触通信を行う。非接触通信に用いる信号の形態として、容量結合の大きさ、換言すればコンデンサの静電容量値に合わせた高周波信号を用いる。位置決め孔94、95側の各通信電極711〜714は、本発明の制御側通信素子に相当し、位置決めボス36、37側の通信電極721〜724は、本発明の装置側通信素子に相当している。   Thereby, the non-contact communication apparatus 7 which consists of four lines is comprised. The non-contact communication device 7 performs non-contact communication between the control device 6 and the control unit 39 of the component supply device 3. As a form of a signal used for non-contact communication, a high-frequency signal matching the magnitude of capacitive coupling, in other words, the capacitance value of the capacitor is used. The communication electrodes 711 to 714 on the positioning holes 94 and 95 side correspond to the control side communication elements of the present invention, and the communication electrodes 721 to 724 on the positioning bosses 36 and 37 side correspond to the apparatus side communication elements of the present invention. ing.

さらに、図5に示されるように、非接触給電部81の2個の給電電極811、812は、機台9側の電源82に接続される。給電電極811、812と電源82との間に、それぞれ共振用コイル831、832が直列接続される。一方、非接触受電部85の2個の受電電極851、852は、部品供給装置3の受電回路86を介して電気負荷87に接続されている。2個の給電電極811、812と、2個の受電電極851、852とは離隔対向し、2個のコンデンサが構成されて容量結合される。   Further, as shown in FIG. 5, the two power supply electrodes 811 and 812 of the non-contact power supply unit 81 are connected to a power supply 82 on the machine base 9 side. Resonant coils 831 and 832 are connected in series between the power supply electrodes 811 and 812 and the power source 82, respectively. On the other hand, the two power receiving electrodes 851 and 852 of the non-contact power receiving unit 85 are connected to the electric load 87 via the power receiving circuit 86 of the component supply device 3. The two power supply electrodes 811 and 812 and the two power reception electrodes 851 and 852 are opposed to each other, and two capacitors are formed and capacitively coupled.

これにより、静電結合方式で直列共振を利用した非接触給電装置8が構成される。つまり、電源82の出力周波数は、2個のコンデンサおよび2個の共振用コイル831、832で定まる直列共振周波数に概ね一致するように設定される。あるいは、電源82の出力周波数は、直列共振周波数に一致するように可変に制御されてもよい。非接触給電装置8は、電源82から電気負荷87への非接触給電を行う。2個の給電電極811、812は、本発明の給電素子に相当し、2個の受電電極851、852は、本発明の受電素子に相当している。   Thereby, the non-contact electric power feeder 8 using a series resonance by an electrostatic coupling system is comprised. That is, the output frequency of the power source 82 is set so as to substantially match the series resonance frequency determined by the two capacitors and the two resonance coils 831 and 832. Alternatively, the output frequency of the power source 82 may be variably controlled so as to match the series resonance frequency. The non-contact power supply device 8 performs non-contact power supply from the power source 82 to the electric load 87. The two power feeding electrodes 811 and 812 correspond to the power feeding element of the present invention, and the two power receiving electrodes 851 and 852 correspond to the power receiving element of the present invention.

実施形態の部品実装機1は、取付部93が配置されたパレット部材91(機台9)と、取付部93に取り付けられる被取付部35を有して部品を供給する部品供給装置3と、部品供給装置3から部品を採取して基板Kに実装する部品移載装置4と、機台9に設けられて部品供給装置3および部品移載装置4を制御する制御装置6とを備え、被取付部35に形成された位置決めボス36、37を取付部93に形成された位置決め孔94、95に嵌入させて、部品供給装置3を機台9(パレット部材91)に位置決めする部品実装機1であって、取付部93に形成された位置決め孔94、95の内壁に設けられて制御装置6に通信接続された通信用電極711〜714(制御側通信素子)と、被取付部35に形成された位置決めボス36、37に設けられて部品供給装置3の制御部39に通信接続された通信用電極721〜724(装置側通信素子)とを有し、位置決めボス36、37を位置決め孔94、95に嵌入させたときに通信用電極711〜714(制御側通信素子)と通信用電極721〜724(装置側通信素子)とが対向して制御装置6と部品供給装置3の制御部39との間で非接触通信が可能となる非接触通信装置7をさらに備えた。   The component mounting machine 1 according to the embodiment includes a pallet member 91 (machine base 9) in which an attachment portion 93 is disposed, a component supply device 3 that includes a mounted portion 35 that is attached to the attachment portion 93, and supplies components. A component transfer device 4 that collects components from the component supply device 3 and mounts them on the substrate K; and a control device 6 that is provided on the machine base 9 and controls the component supply device 3 and the component transfer device 4. The component mounting machine 1 for positioning the component supply device 3 on the machine base 9 (pallet member 91) by fitting the positioning bosses 36, 37 formed on the mounting portion 35 into the positioning holes 94, 95 formed on the mounting portion 93. The communication electrodes 711 to 714 (control-side communication elements) provided on the inner walls of the positioning holes 94 and 95 formed in the attachment portion 93 and connected to the control device 6 are formed in the attachment portion 35. The positioning bosses 36 and 37 When the positioning bosses 36 and 37 are fitted in the positioning holes 94 and 95, respectively, having communication electrodes 721 to 724 (device side communication elements) connected to the control unit 39 of the component supply device 3. Communication electrodes 711 to 714 (control-side communication elements) and communication electrodes 721 to 724 (device-side communication elements) face each other, and non-contact communication is performed between the control device 6 and the control unit 39 of the component supply device 3. A non-contact communication device 7 is further provided.

これによれば、部品供給装置3の位置決め部として設けられる位置決めボス36、37および位置決め孔94、95に、非接触通信部となる通信用電極711〜714(制御側通信素子)および通信用電極721〜724(装置側通信素子)を組み入れて簡素な構成にできる。したがって、位置決め部および非接触通信部の配設スペースが節約され、部品供給装置3の被取付部35が狭隘であっても、取付構造および内部構造の自由度を確保できる。本実施形態では、上下の位置決め部の間に広い配設スペースを確保でき、大きな対向面積を有する非接触給電装置8を配設している。   According to this, in the positioning bosses 36 and 37 and the positioning holes 94 and 95 provided as the positioning unit of the component supply device 3, the communication electrodes 711 to 714 (control-side communication elements) and the communication electrodes that are non-contact communication units are provided. 721 to 724 (device side communication elements) can be incorporated into a simple configuration. Therefore, the arrangement space of the positioning unit and the non-contact communication unit is saved, and the degree of freedom of the mounting structure and the internal structure can be secured even if the mounted portion 35 of the component supply device 3 is narrow. In this embodiment, a wide arrangement space can be secured between the upper and lower positioning portions, and the non-contact power feeding device 8 having a large facing area is provided.

また、通信用電極711〜714(制御側通信素子)および通信用電極721〜724(装置側通信素子)は、位置決めボス36、37の長さL1や位置決め孔94、95の深さD1を大きくすることで大形化が可能になる。したがって、被取付部35の限られた幅寸法W0に制約されず、通信用電極711〜714(制御側通信素子)と通信用電極721〜724(装置側通信素子)との対向面積を十分に確保でき、コネクタの不要な非接触通信を安定して行える。   In addition, the communication electrodes 711 to 714 (control-side communication elements) and the communication electrodes 721 to 724 (device-side communication elements) increase the length L1 of the positioning bosses 36 and 37 and the depth D1 of the positioning holes 94 and 95. By doing so, it becomes possible to increase the size. Therefore, the facing area between the communication electrodes 711 to 714 (control side communication elements) and the communication electrodes 721 to 724 (device side communication elements) is not limited to the limited width dimension W0 of the mounted portion 35. Can be ensured, and non-contact communication unnecessary for the connector can be stably performed.

さらに、実施形態の部品実装機1は、取付部93に設けられて電源82に接続された給電電極811、812(給電素子)と、被取付部35に設けられて電気負荷87に接続された受電電極851、852(受電素子)とを有し、位置決めボス36、37を位置決め孔94、95に嵌入させたときに給電電極811、812(給電素子)と受電電極851、852(受電素子)とが対向して、電源82から電気負荷57への非接触給電が可能となる非接触給電装置8をさらに備えている。   Furthermore, the component mounter 1 according to the embodiment is provided with power supply electrodes 811 and 812 (power supply elements) provided in the attachment portion 93 and connected to the power source 82, and provided in the attachment portion 35 and connected to the electric load 87. Power receiving electrodes 851 and 852 (power receiving elements), and when the positioning bosses 36 and 37 are fitted into the positioning holes 94 and 95, the power feeding electrodes 811 and 812 (power feeding elements) and the power receiving electrodes 851 and 852 (power receiving elements). Is further provided with a non-contact power feeding device 8 that enables non-contact power feeding from the power source 82 to the electric load 57.

これによれば、位置決め部として設けられる位置決めボス36、37および位置決め孔94、95の作用により、給電電極811、812(給電素子)と受電電極851、852(受電素子)との対向配置が安定するので、安定した非接触給電が可能となる。   According to this, the opposing arrangement of the feeding electrodes 811 and 812 (feeding element) and the receiving electrodes 851 and 852 (receiving element) is stable by the action of the positioning bosses 36 and 37 and the positioning holes 94 and 95 provided as the positioning portions. Therefore, stable non-contact power feeding becomes possible.

さらに、実施形態の部品実装機1で、取付部93に形成された複数の位置決め孔94、95の間に給電電極811、812(給電素子)が配置され、被取付部35に形成された複数の位置決めボス36、37の間に受電電極851、852(受電素子)が配置されており、複数の位置決めボス36、37を平行操作して複数の位置決め孔94、95に嵌入させてゆくと、給電電極811、812(給電素子)と受電電極851、852(受電素子)とが当接して、位置決めボス36、37の位置決め孔94、95への嵌入深さが定まる。   Further, in the component mounter 1 according to the embodiment, the power supply electrodes 811 and 812 (power supply elements) are arranged between the plurality of positioning holes 94 and 95 formed in the attachment portion 93, and the plurality of portions formed in the attachment portion 35. Power receiving electrodes 851 and 852 (power receiving elements) are arranged between the positioning bosses 36 and 37, and when the plurality of positioning bosses 36 and 37 are operated in parallel to be inserted into the plurality of positioning holes 94 and 95, The feeding electrodes 811 and 812 (power feeding elements) and the power receiving electrodes 851 and 852 (power receiving elements) come into contact with each other, and the insertion depths of the positioning bosses 36 and 37 into the positioning holes 94 and 95 are determined.

これによれば、位置決め部として設けられる複数の位置決めボス36、37および複数の位置決め孔94、95の作用により、受電電極851、852(受電素子)が給電電極811、812(給電素子)に正対し、確実に電極面全体で当接する。したがって、非接触給電において高い結合効率が得られ、実施形態においてはコンデンサの大きな静電容量値が得られ、結果として高い給電効率が得られる。   According to this, the power receiving electrodes 851 and 852 (power receiving elements) are positively connected to the power feeding electrodes 811 and 812 (power feeding elements) by the action of the plurality of positioning bosses 36 and 37 and the plurality of positioning holes 94 and 95 provided as positioning portions. On the other hand, it contacts reliably on the whole electrode surface. Therefore, high coupling efficiency is obtained in non-contact power feeding, and in the embodiment, a large capacitance value of the capacitor is obtained, and as a result, high power feeding efficiency is obtained.

さらに、実施形態の部品実装機1では、上下の位置決めボス36、37および位置決め孔94、95の内壁の1箇所あたりに、2個の通信用電極711〜714(制御側通信素子)および2個の通信用電極721〜724(装置側通信素子)が設けられている。   Furthermore, in the component mounting machine 1 of the embodiment, two communication electrodes 711 to 714 (control-side communication elements) and two pieces are provided per one position on the inner walls of the upper and lower positioning bosses 36 and 37 and the positioning holes 94 and 95. Communication electrodes 721 to 724 (device-side communication elements) are provided.

これによれば、4線からなる非接触通信装置7を構成できるので、並列化による通信速度の高速化が可能になる。   According to this, since the non-contact communication apparatus 7 consisting of four lines can be configured, the communication speed can be increased by parallelization.

さらに、実施形態の部品実装機1で、取付部93および被取付部35の両方は、位置決めボス36、37または位置決め孔94、95の内壁を含む樹脂製の一体成型品とされている。   Furthermore, in the component mounter 1 of the embodiment, both the attachment portion 93 and the attachment portion 35 are integrally molded products made of resin including the positioning bosses 36 and 37 or the inner walls of the positioning holes 94 and 95.

これによれば、通信用電極711〜714、721〜724や非接触給電部81および非接触受電部85を鋳込みつつ、位置決めボス36〜38や位置決め孔94〜96を形成する樹脂成型加工法により、取付部93および被取付部35を製造できる。したがって、組み立ての手間が簡素化され、製造コストを低減できる。さらに、取付部93および被取付部35を金属製とする従来技術と比較して、絶縁の安全性が高い。また、金属製と比較して樹脂製の断熱性が良好であるので、部品供給装置3の受電電極851、852(受電素子)の発熱を近くの部品取出部34に伝えず、部品を熱的ストレスに曝さない。また、樹脂表面に電磁遮蔽塗料を塗布することで、金属製と同等の電磁遮蔽効果を具備できる。   According to this, by casting the communication electrodes 711 to 714, 721 to 724, the non-contact power feeding part 81 and the non-contact power receiving part 85, the resin molding process for forming the positioning bosses 36 to 38 and the positioning holes 94 to 96 is performed. The attachment portion 93 and the attached portion 35 can be manufactured. Therefore, the labor of assembly is simplified and the manufacturing cost can be reduced. Furthermore, the safety of insulation is high compared with the prior art which makes the attachment part 93 and the to-be-attached part 35 metal. Further, since the heat insulation of resin is better than that of metal, the heat generated by the power receiving electrodes 851 and 852 (power receiving elements) of the component supply device 3 is not transmitted to the nearby component take-out unit 34, and the components are thermally treated. Do not expose to stress. Moreover, the electromagnetic shielding effect equivalent to metal can be provided by apply | coating an electromagnetic shielding coating material to the resin surface.

さらに、実施形態の部品実装機1で、機台9は、複数の部品供給装置3をそれぞれ取り付ける複数の取付部93を有したパレット部材91を着脱可能に保持する。   Further, in the component mounter 1 of the embodiment, the machine base 9 detachably holds a pallet member 91 having a plurality of attachment portions 93 to which the plurality of component supply devices 3 are respectively attached.

これによれば、パレット取付構造を用いて複数の部品供給装置3を取り付ける部品実装機1で本発明を実施でき、前記した各効果が得られる。   According to this, this invention can be implemented with the component mounting machine 1 which mounts the some component supply apparatus 3 using a pallet mounting structure, and each effect mentioned above is acquired.

さらに、実施形態の部品実装機1で、制御側通信素子および装置側通信素子は、非接触での静電結合を可能とする通信用電極711〜714、721〜724である。   Furthermore, in the component mounter 1 of the embodiment, the control-side communication element and the device-side communication element are communication electrodes 711 to 714 and 721 to 724 that enable non-contact electrostatic coupling.

これによれば、容量結合の程度に合わせた高周波信号を用いて非接触通信を行うことができる。   According to this, non-contact communication can be performed using a high-frequency signal matched to the degree of capacitive coupling.

なお、パレット部材91は必須の構成要件でなく、例えば、機台9上に取付部93およびガイド溝921が設けられていてもよい。また、位置決めボス36〜38および位置決め孔94〜96の配置を入れ替えてもよく、換言すれば、パレット部材91に位置決めボスを設け、部品供給装置3に位置決め孔を設けてもよい。さらに、位置決めボス36、37および位置決め孔94、95の1箇所あたりに、3個以上の通信用電極を設けてもよい。例えば、実施形態の通信用電極711〜714、721〜724を、それぞれ半分の幅に分割すれば、通信用電極の個数を倍増できる。また例えば、位置決めボス36、37および位置決め孔94、95の側面だけでなく、底面や上面に通信用電極を設けてもよい。これにより、通信速度のより一層の高速化が可能になる。   Note that the pallet member 91 is not an essential component, and for example, the mounting portion 93 and the guide groove 921 may be provided on the machine base 9. In addition, the positioning bosses 36 to 38 and the positioning holes 94 to 96 may be rearranged. In other words, the pallet member 91 may be provided with a positioning boss, and the component supply device 3 may be provided with a positioning hole. Further, three or more communication electrodes may be provided for each of the positioning bosses 36 and 37 and the positioning holes 94 and 95. For example, the number of communication electrodes can be doubled by dividing the communication electrodes 711 to 714 and 721 to 724 of the embodiment into half widths. Further, for example, not only the side surfaces of the positioning bosses 36 and 37 and the positioning holes 94 and 95 but communication electrodes may be provided on the bottom surface and the top surface. As a result, the communication speed can be further increased.

さらになお、制御側通信素子および装置側通信素子は、電極711〜714、721〜724に限定されず、非接触での電磁結合を可能とするコイルであってもよい。コイルの場合でも大形化が可能であり、非接触通信を安定して行える。また、給電素子および受電素子も、電極811、812、851、852に限定されず、鉄心を備えたコイルであってもよい。給電素子および受電素子をコイルとした場合には、共振用コイル831、832に代えて、共振用コンデンサを用いることが好ましい。本発明は、その他にも様々な応用や変形が可能である。   Furthermore, the control-side communication element and the device-side communication element are not limited to the electrodes 711 to 714 and 721 to 724, and may be coils that enable non-contact electromagnetic coupling. Even in the case of a coil, the size can be increased, and non-contact communication can be performed stably. Further, the power feeding element and the power receiving element are not limited to the electrodes 811, 812, 851, and 852, and may be a coil including an iron core. When the power feeding element and the power receiving element are coils, it is preferable to use a resonance capacitor instead of the resonance coils 831 and 832. Various other applications and modifications are possible for the present invention.

1:部品実装機 2:基板搬送装置
3:部品供給装置 32:本体部 34:部品取出部
35:被取付部 36:上側位置決めボス
37:下側位置決めボス 38:受電位置決めボス
39:制御部 391:通信インターフェース
4:部品移載装置 5:部品カメラ
6:制御装置 61:通信インターフェース
7:非接触通信装置
711〜714:通信電極(装置側通信素子)
721〜724:通信電極(制御側通信素子)
8:非接触給電装置 811、812:給電電極(給電素子)
82:電源 851、852:受電電極(受電素子)
86:受電回路 87:電気負荷
9:機台 91:パレット部材 92:底板部
93:取付部 94:上側位置決め孔
95:下側位置決め孔 96:給電位置決め孔
DESCRIPTION OF SYMBOLS 1: Component mounting machine 2: Board | substrate conveyance apparatus 3: Component supply apparatus 32: Main body part 34: Component extraction part 35: Mounted part 36: Upper side positioning boss 37: Lower side positioning boss 38: Power receiving positioning boss 39: Control part 391 : Communication interface 4: Component transfer device 5: Component camera 6: Control device 61: Communication interface 7: Non-contact communication device 711-714: Communication electrode (device-side communication element)
721-724: Communication electrode (control side communication element)
8: Non-contact power supply device 811, 812: Power supply electrode (power supply element)
82: Power supply 851, 852: Power receiving electrode (power receiving element)
86: Power receiving circuit 87: Electric load 9: Machine base 91: Pallet member 92: Bottom plate portion 93: Mounting portion 94: Upper positioning hole 95: Lower positioning hole 96: Feeding positioning hole

Claims (7)

取付部が配置された機台と、前記取付部に取り付けられる被取付部を有して部品を供給する部品供給装置と、前記部品供給装置から前記部品を採取して基板に実装する部品移載装置と、前記機台に設けられて前記部品供給装置および前記部品移載装置を制御する制御装置とを備え、
前記取付部および前記被取付部の一方に形成された位置決めボスを前記取付部および前記被取付部の他方に形成された位置決め孔に嵌入させて、前記部品供給装置を前記機台に位置決めする部品実装機であって、
前記取付部に形成された前記位置決めボスまたは前記位置決め孔の内壁に設けられて前記制御装置に通信接続された制御側通信素子と、前記被取付部に形成された前記位置決め孔の内壁または前記位置決めボスに設けられて前記部品供給装置に通信接続された装置側通信素子とを有し、前記位置決めボスを前記位置決め孔に嵌入させたときに前記制御側通信素子と前記装置側通信素子とが対向して前記制御装置と前記部品供給装置との間で非接触通信が可能となる非接触通信装置をさらに備えた部品実装機。
A machine base on which the mounting portion is arranged, a component supply device that has a mounted portion that is attached to the mounting portion and supplies a component, and a component transfer that collects the component from the component supply device and mounts the component on a substrate An apparatus, and a control device that is provided on the machine base and controls the component supply device and the component transfer device,
A component for positioning the component supply device on the machine base by fitting a positioning boss formed on one of the mounting portion and the mounted portion into a positioning hole formed on the other of the mounting portion and the mounted portion. A mounting machine,
A control-side communication element provided on the inner wall of the positioning boss or the positioning hole formed in the mounting portion and connected to the control device, and an inner wall of the positioning hole or the positioning formed in the mounting portion A device-side communication element provided on the boss and connected to the component supply device, and the control-side communication element and the device-side communication element face each other when the positioning boss is inserted into the positioning hole. A component mounting machine further comprising a non-contact communication device that enables non-contact communication between the control device and the component supply device.
前記取付部に設けられて電源に接続された給電素子と、前記被取付部に設けられて電気負荷に接続された受電素子とを有し、前記位置決めボスを前記位置決め孔に嵌入させたときに前記給電素子と前記受電素子とが対向して、前記電源から前記電気負荷への非接触給電が可能となる非接触給電装置をさらに備えた請求項1に記載の部品実装機。   A power feeding element provided in the attachment portion and connected to a power source; and a power receiving element provided in the attachment portion and connected to an electric load, and when the positioning boss is fitted into the positioning hole. The component mounting machine according to claim 1, further comprising a non-contact power feeding device that enables the non-contact power feeding from the power source to the electric load by facing the power feeding element and the power receiving element. 前記取付部に形成された複数の位置決めボスまたは位置決め孔の間に前記給電素子が配置され、前記被取付部に形成された複数の位置決め孔または位置決めボスの間に前記受電素子が配置されており、
前記複数の位置決めボスを平行操作して前記複数の位置決め孔に嵌入させてゆくと、前記給電素子と前記受電素子とが当接して、前記位置決めボスの前記位置決め孔への嵌入深さが定まる請求項2に記載の部品実装機。
The power feeding element is disposed between a plurality of positioning bosses or positioning holes formed in the mounting portion, and the power receiving element is disposed between a plurality of positioning holes or positioning bosses formed in the mounted portion. ,
When the plurality of positioning bosses are operated in parallel and inserted into the plurality of positioning holes, the feeding element and the power receiving element come into contact with each other, and the insertion depth of the positioning boss into the positioning hole is determined. Item mounting machine according to Item 2.
前記位置決めボスおよび前記位置決め孔の内壁の1箇所あたりに、複数の同数個の前記制御側通信素子および前記装置側通信素子が設けられている請求項1〜3のいずれか一項に記載の部品実装機。   4. The component according to claim 1, wherein a plurality of the same number of the control-side communication elements and the device-side communication elements are provided at one location on the positioning boss and the inner wall of the positioning hole. Mounting machine. 前記取付部および前記被取付部の少なくとも一方は、前記位置決めボスまたは前記位置決め孔の内壁を含む樹脂製の一体成型品とされている請求項1〜4のいずれか一項に記載の部品実装機。   5. The component mounting machine according to claim 1, wherein at least one of the attachment portion and the attachment portion is an integrally molded product made of resin including an inner wall of the positioning boss or the positioning hole. . 前記機台は、複数の部品供給装置をそれぞれ取り付ける複数の取付部を有したパレット部材を着脱可能に保持する請求項1〜5のいずれか一項に記載の部品実装機。   The component mounting machine according to any one of claims 1 to 5, wherein the machine base detachably holds a pallet member having a plurality of attachment portions to which a plurality of component supply devices are respectively attached. 前記制御側通信素子および前記装置側通信素子は、非接触での電磁結合を可能とするコイル、または非接触での静電結合を可能とする電極である請求項1〜6のいずれか一項に記載の部品実装機。   The control-side communication element and the apparatus-side communication element are a coil that enables non-contact electromagnetic coupling or an electrode that enables non-contact electrostatic coupling. The component mounting machine described in 1.
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