JPWO2007097273A1 - Resin cell culture container and method for producing the same - Google Patents

Abstract

It is an object of the present invention to provide a resin-made cell culture container capable of increasing the survival rate of cells to be cultured and a method for producing the same. The resin-made cell culture container according to the present invention includes an inorganic membrane 1 having a thickness of 0.002 μm to 5 μm on at least a surface on which cells are cultured, and has an oxygen permeability of 500 fmol / m 2 · s · at 20 ° C. in a dry state. Pa or less. This provides a resinous cell culture container that can significantly increase the survival rate of cell types that are difficult to culture by inhibiting the release of toxic substances from the resinous cell culture container into the culture medium. it can.

Description

  The present invention relates to a resin cell culture vessel and a method for producing the same.

  Cell death is roughly divided into apoptosis and necrosis. Apoptosis is a type of death of cells that make up the body of a multicellular organism, and refers to suicide of controlled and regulated cells that are actively triggered to keep an individual in a better state. On the other hand, necrosis refers to cell death caused by deterioration of the environment inside and outside the cell due to poor blood circulation, trauma, etc., that is, necrosis.

  Necrosis is the death of a portion of a living tissue. Necrosis differs from normal death in that only the cells that make up part of the body die. Caused by infection, physical destruction, chemical damage, decreased blood flow, etc. Those caused by decreased blood flow are called infarctions. Even if the cells are dead, normal cells such as blood cells, skin, and mucosal epithelium of the digestive tract, and tissues that are replenished one after another and do not leave functional disorders or histological abnormalities are not called necrosis. The necrotic tissue is finally removed by the living body's immune system, and the defective part is compensated by the regeneration or fibrosis of the original tissue.

  For testing and research on such cells, it is necessary to culture cells isolated from tissues. In recent years, this cell culture has been carried out for various purposes such as drug discovery development, drug production, basic tests in regenerative medicine, and drug effect determination, and has become an indispensable method in biotechnology-related fields. The adhesion ability of cells cultured in a cell incubator is an extremely important factor for the proliferation ability of cells, and thus affects the speed of research and development. Moreover, since the cell culture strain used for the culture test is very expensive, it directly affects the test cost.

  When cells are cultured in cell culture containers such as plastic petri dishes, glass petri dishes, glass plates fixed in containers, well plates, etc., pH changes due to carbon dioxide discharged from the cultured cells may affect the activity of the cultured cells. It is known to have a significant effect. For this reason, in conventional long-term culture, researchers maintain the activity of cultured cells by periodically exchanging the culture solution.

Patent Document 1 proposes a cell culture container characterized in that a protrusion group having an equivalent diameter of 10 nm to 1 mm is formed on the surface of the cell culture container. This is because the formation of protrusions spreads the culture solution to the lower part of the cell, promotes the supply of nutrients required by the cell and the discharge of waste products released by the cell, and the point contact between the cell and the container. This prevents cell damage that occurs during cell detachment.
JP 2005-168494 A

  However, in order to suppress necrosis of tissues that do not regenerate, such as nerve cells, cardiac muscle, and skeletal muscle, and cell death of tissues that are difficult to culture, such as nerve cells, cardiac muscle, and liver cells, replacement of fresh culture fluid However, the present situation is that suppression of cell death cannot be realized by itself. In particular, in a culture species that is difficult to culture, the survival rate with respect to the number of initially placed cells is about 20 to 40% even if the fresh culture medium is replaced.

  In addition, according to the method shown in Patent Document 1, the formation of the protrusion group allows the culture solution to spread to the lower part of the cell to promote the supply of nutrients required by the cell and the discharge of the waste product released by the cell. I can. However, it is not possible to prevent the plastic material from releasing into the culture solution additives such as low molecular weight components, plasticizers, polymerization catalysts, or the like, or gas decomposed during thermoforming of the plastic material. These release components are extremely toxic to cultured cells and directly cause cell death. Therefore, it is necessary to prevent toxic substances from being released into the culture solution from the surface of the cell culture container before supplying the fresh culture solution. In particular, in cell types that are difficult to culture, such as nerve cells and cardiomyocytes, glass materials are used rather than plastic materials. This is because when a plastic cell culture vessel is used, nearly 80% of the initially placed cells are killed. Similarly, cell culture containers such as commercially available plastic petri dishes, plastic plates fixed in containers, well plates, etc. have a problem that the release of toxic substances into the culture solution cannot be prevented. ing.

  The present invention has been made to solve such problems, and an object of the present invention is to provide a resin-made cell culture container and a method for producing the same, which can increase the survival rate of cells to be cultured.

The resin-made cell culture container according to the present invention includes an inorganic film having a thickness of 0.002 μm to 5 μm on at least a surface on which cells are cultured, and has an oxygen permeability of 500 fmol / m ² · s · at 20 ° C. in a dry state. Pa or less.

  The method for producing a resin-made cell culture container according to the present invention includes a step of forming a pattern on a substrate, and a step of forming a metal structure by attaching a metal according to the pattern formed on the substrate or a transfer pattern thereof. And a step of transferring a pattern of the metal structure to form a cell culture container, and a step of forming an inorganic film on at least a surface of the cell container on which cells are cultured.

  ADVANTAGE OF THE INVENTION According to this invention, the resin-made cell culture containers which can improve the survival rate of the cell to culture | cultivate, and its manufacturing method can be provided.

It is a figure which shows typically the structure of the resin-made cell culture containers concerning Embodiment 1 of this invention. It is a figure which shows typically the structure of the resin-made cell culture containers concerning Embodiment 2 of this invention. It is a figure which shows typically the structure of the resin-made cell culture containers concerning Embodiment 2 of this invention. It is a figure which shows typically the manufacturing method of the resin-made cell culture containers concerning Embodiment 2 of this invention. It is a figure which shows typically the manufacturing method of the resin-made cell culture containers concerning Embodiment 2 of this invention. It is a figure which shows typically the manufacturing method of the resin-made cell culture containers concerning Embodiment 2 of this invention. It is a figure which shows typically the manufacturing method of the resin-made cell culture containers concerning Embodiment 2 of this invention. It is a figure which shows typically the manufacturing method of the resin-made cell culture containers concerning Embodiment 2 of this invention. It is a figure which shows typically the manufacturing method of the resin-made cell culture containers concerning Embodiment 2 of this invention. It is a figure which shows typically the manufacturing method of the resin-made cell culture containers concerning Embodiment 2 of this invention. It is a figure which shows typically the manufacturing method of the resin-made cell culture containers concerning Embodiment 2 of this invention. It is a top view which shows typically the cell culture container concerning Example 4 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inorganic film 2 Concave part 3 1st convex part 4 2nd convex part 5 Two-stage convex part 6 Side wall of 1st convex part 7 Side wall of 2nd convex part
11 Substrate 12 First resist layer 13 Mask A
14 Second resist layer 15 Mask B
16 Resist pattern 17 Conductive film 18 Metal structure 19 Resin molded product

  As a result of intensive research, the present inventors have formed an inorganic material having a gas permeability within a specified value on the surface of a resin cell culture vessel, so that a toxic substance from a plastic material into a culture solution can be obtained. It has been found that a cell culture vessel can be provided that can significantly increase the survival rate even in cell types that are inhibited from being released and difficult to culture. Hereinafter, embodiments of the present invention will be described with reference to the drawings.

Embodiment 1 of the Invention
FIG. 1 is a cross-sectional view showing the configuration of the cell culture container according to the first embodiment. The cell culture container according to Embodiment 1 includes an inorganic film 1 on the surface where cells are cultured.

The thickness of the inorganic membrane 1 covering at least the cell culture surface of the resin cell culture vessel is preferably 0.002 μm to 5 μm, and preferably 0.005 μm to 1 μm in order to prevent the release of toxic substances into the culture solution. More preferred. If it is 0.002 μm or less, it is difficult to prevent the release of toxic substances into the culture solution, and if it is 5 μm or more, the film formation time becomes long and the cost is high, which is not suitable for practical use. The oxygen permeability in the dry state 20 ° C., in order to prevent the release of toxic substances into the culture medium, is preferably from ^{500fmol / m 2 · s · Pa} , more preferably at most ^{250fmol / m 2 · s · Pa} . If the oxygen permeability is low, the release of toxic substances from the cell culture container into the culture solution can be further suppressed. On the other hand, since it is necessary to increase the film thickness, the film formation time becomes long and the cost becomes high. Therefore, it is preferable to select appropriately according to the application.

A method for forming the inorganic film 1 will be described. The following method is an example, and the present invention is not limited to this. Examples of the method for forming the inorganic film 1 include inorganic material forming methods such as sputtering using a vacuum apparatus, vacuum vapor deposition, electron beam vapor deposition, electroplating, electroless plating, and Kanigen plating. Sputtering is preferred when the formed inorganic film 1 is required to be uniform and dense. However, the equipment cost is high, and when the film thickness is 0.1 μm or more, the film tends to peel off due to film stress. is there. The vacuum vapor deposition method is relatively inexpensive and can reduce the film stress, so that the film thickness can be increased. However, the uniformity and denseness of the film thickness are inferior to the sputtering method. Examples of the inorganic film 1 that can be formed by sputtering or vacuum deposition include Cu, Al, Au, Ag, SiO ₂ , Ni, Mg, Fe, and Cr. These inorganic films 1 can achieve a desired gas permeability by having a constant film thickness, unlike a plastic material having a molecular structure and a gas permeability that is greatly different.

In observing cultured cells, transmitted light observation using an inverted microscope is the mainstream. For this reason, the inorganic film coated on the cell culture container is required not to scatter visible light having a wavelength of 450 nm to 600 nm, that is, to have transparency. As a range that satisfies both prevention of release of toxic substances into the culture solution and transparency, it is preferable to set the film thickness to 400 nm or less or to use a transparent inorganic material such as SiO ₂ .

  To make the resin plate have the same light transmittance as that of the glass plate in order to enable the transmitted light observation, the light transmittance at a wavelength of 300 nm to 800 nm including the ultraviolet region is set to 80% or more and the haze value is set to 10% or less. It is preferable. In order to satisfy the above requirements, it is necessary to use an acrylic resin that does not contain an ultraviolet absorber for the cell culture container, or select a material that does not have a ring structure in its chemical structure, such as PC (polycarbonate), polystyrene, or the like. In addition, additives such as an antioxidant, a viscosity improver, a heat stabilizer, and an anti-sticking agent need not contain an ultraviolet absorber.

  In the fluorescence observation method, the light (excitation light) for causing the fluorescent dye to shine cannot be discriminated from the fluorescence (fluorescence radiation light) generated unless it passes through the cell culture vessel. Therefore, the cell culture container is required to have high light transmittance. The transparency necessary for identifying the fluorescence (fluorescence emission light) needs to be 80% or more of the total light transmittance of visible light and within 10% of the haze value. In order to satisfy the above requirements, it is preferable to use a material having excellent optical properties such as polymethylmethacrylate for the cell culture container, and when using a polyolefin-based resin which is a crystalline resin, it should be used in an amorphous state. preferable.

  Autofluorescence means that after a polymer molecule absorbs ultraviolet / visible light, it emits light and emits fluorescence. While glass plates do not emit autofluorescence, many resin plates do autofluorescence, making it impossible to identify fluorescence (fluorescent radiation) generated from the sample, making it difficult to perform microanalysis, which is a feature of fluorescence analysis.

  In order not to be affected by the autofluorescence, it is required that the autofluorescence does not occur by irradiating light with a wavelength of 230 nm to 800 nm. Therefore, it is necessary to select a resin material that does not have a ring structure in the chemical structure such as PC (polycarbonate) or polystyrene for the cell culture container. Further, in order to eliminate the possibility of autofluorescence as much as possible, it is preferable that the additives such as antioxidants, viscosity improvers, heat stabilizers, and anti-sticking agents be as small as possible or not added.

  In order to observe with a polarizing microscope or a differential interference microscope without reducing the contrast of the differential interference observation method, a material having a small optical distortion is required. Therefore, it is necessary to select a resin material that does not have a ring structure in the chemical structure such as PC (polycarbonate) or polystyrene for the cell culture container.

  By coating the cell culture vessel with an organic film or an inorganic film, it can be made hydrophilic or hydrophobic. Thereby, the adhesion prevention of the bubble to a cell culture surface and the adhesion degree of a cell are controllable. Examples of the method for coating the organic film include a method of applying collagen, polylysine or the like, which is a protein that promotes cell adhesion, by spin coating or dipping, vapor deposition polymerization, plasma polymerization, and the like. Examples of the method for coating the inorganic film include a sputtering method and a vapor deposition method. In addition, by masking a part of the cell culture container, only the other part can be covered with an organic film or an inorganic film. Thereby, the range of culture test conditions can be further widened.

Inorganic film formation methods such as sputtering and vapor deposition can also be applied to oil immersion lens observation methods. Usually, an oil used for an oil immersion lens is mixed with an organic solvent in order to make optical properties compatible with a glass plate for culturing cells and an optical lens. Organic solvents may not be applicable because they penetrate into resinous cell culture vessels and cause whitening and dissolution problems. Inorganic materials are resistant to organic solvents at the same time as the gas barrier effect, so by forming an inorganic film on the bottom of the cell culture vessel that comes in contact with the oil in the oil immersion lens, it can also be applied to oil immersion lens observation methods. It becomes possible, and the application range of the resin-made cell culture container can be expanded. When performing transmitted light observation, it is preferable that the film thickness is 400 nm or less, or a transparent inorganic material such as SiO ₂ is used.

Embodiment 2 of the Invention
A resin-made cell culture vessel having a plurality of micro-space structures can also be used on the surface on which the cells are cultured. The configuration of the cell culture container according to Embodiment 2 will be described with reference to FIGS. 2A and 2B. FIG. 2A is a plan view showing a configuration of the cell culture container according to the second exemplary embodiment. 2B is a cross-sectional view taken along the line IIB-IIB ′ of FIG. 2A.

  In the cell culture container, as shown in FIG. 2A, an uneven pattern constituting a plurality of micro space structures is formed. The concavo-convex pattern is formed in a two-step shape as shown in FIG. 2B. That is, a two-step convex portion 5 comprising a first convex portion 3 formed in a lattice shape and a rectangular parallelepiped second convex portion 4 formed on the surface of the cell culture vessel on which the cells are cultured. Is formed. A space formed by the two-stage convex portions 5 becomes the concave portion 2. That is, the concave portion 2 includes a concave portion completely surrounded by the first convex portion 3 and a concave portion formed by the second convex portion 4. The side wall 6 of the first convex part 3 and the side wall 7 of the second convex part 4 are formed substantially perpendicular to the bottom surface. Furthermore, the inorganic film 1 is formed on the entire surface of the cell culture container.

  The 1st convex part 3 is arrange | positioned at the grid | lattice form so that the four sides of the rectangular recessed part 2 may be surrounded, as shown to FIG. 2A. The 2nd convex part 4 is arrange | positioned on the 1st convex part 3 between the adjacent recessed parts 2 at island shape. The second convex portion 4 is provided on each of the four sides of the rectangular concave portion 2. Therefore, the concave portion 2 is not completely partitioned, and communicates with the adjacent concave portion 2 at the four apex portions of the rectangular concave portion 2. In addition, although it is preferable to form an uneven | corrugated pattern in the step shape of two or more steps, one step may be sufficient.

  By forming the inorganic membrane 1 having a desired thickness and oxygen permeability on at least the surface of the resin cell culture vessel having a plurality of micro-space structures, the cell adhesion ability and the proliferation function can be obtained. In addition, it can be provided for a wide range of applications such as cell extension direction and morphology control tests. Further, this cell culture container can exhibit sufficiently high accuracy even when compared with a conventional patterned glass plate. Furthermore, since it can be formed at a low cost, it is particularly suitable for applications that are used in large quantities in the industry that can exhibit its advantages.

  A method for producing a resin-made cell culture vessel having a plurality of micro-space structures on the surface on which the cells are cultured will be described. The manufacturing method includes a step of forming a micro space structure on a substrate, a metal is attached according to the micro space structure pattern formed on the substrate or a transfer pattern thereof, and has a pattern opposite to the structure pattern of the resin plate. Forming a metal structure; and transferring a pattern of the metal structure to form a resin plate.

Details are as follows.
(I) Formation of first resist layer on substrate (ii) Position alignment between substrate and mask A (iii) Exposure of first resist layer using mask A (iv) Heat treatment of first resist layer (v) Formation of second resist layer on first resist layer (vi) Alignment of substrate and mask B (vii) Exposure of second resist layer using mask B (viii) Heat treatment of second resist layer (ix) The resist layer is developed to form a desired resist pattern.
(X) Further, after conducting the conductive treatment on the formed resist pattern, a metal structure is formed on the substrate by plating according to the formed resist pattern.
(Xi) A cell culture container is manufactured by forming a resin molded product using this metal structure as a mold.
The steps (v) to (viii) are optional and can be omitted. On the other hand, the steps (v) to (viii) can be repeated a plurality of times.

The resist pattern forming process will be described in more detail.
For example, when a structure having a depth of 30 μm and a depth of 100 μm is to be obtained on the substrate, a first resist layer (thickness 70 μm) and a second resist layer (thickness 30 μm) are formed in this order, and each layer is exposed. Alternatively, exposure and heat treatment are performed. In the development step, a pattern having a depth of 30 μm, which is the second resist layer, is first obtained, and then a pattern having a depth of 100 μm is obtained by combining the first resist layer and the second resist layer. When a pattern having a depth of 100 μm is obtained, it is necessary to control the solubility of each layer in the developer so as not to dissolve or deform the pattern of the second resist layer having a depth of 30 μm in the developer. Is done.

  One method of developing alkali resistance using a photolytic positive resist is to increase the baking time (solvent drying time) and cure the resist. Usually, the baking time is set according to the film thickness, solvent concentration such as thinner, and sensitivity. By increasing this time, alkali resistance can be provided. In addition, if the baking of the first resist layer proceeds too much, the resist is extremely hardened, and it becomes difficult to form a pattern by dissolving the portion irradiated with light in the subsequent development. It is preferable to select as appropriate. The apparatus used for baking is not particularly limited as long as the solvent can be dried, and examples thereof include an oven, a hot plate, and a hot air dryer. The photodegradable positive resist has a limited range of alkali resistance as compared with the photocrosslinking negative resist, so the resist thickness to be set is preferably within the range of 5 to 200 μm in total for each layer. More preferably, it is in the range of 10 to 100 μm.

  As a method of developing alkali resistance using a photo-crosslinking negative resist, optimization of the crosslinking density can be mentioned in addition to optimization of the baking time. Usually, the crosslinking density of the negative resist can be set by the exposure amount. In the case of a chemically amplified negative resist, the crosslinking density can be set by the exposure amount and the heat treatment time. By increasing the exposure amount or the heat treatment time, alkali resistance can be exhibited. In the case of a photo-crosslinking negative resist, the resist thickness to be set is preferably in the range of 5 to 500 μm, more preferably in the range of 10 to 300 μm, for each layer.

(I) The formation of the first resist layer 12 on the substrate 11 will be described.
FIG. 3A shows a state where the first resist layer 12 is formed on the substrate 11. The flatness of the resin-made cell container obtained in the molded product forming step is determined by the process of forming the first resist layer 12 on the substrate 11. That is, the flatness at the time when the first resist layer 12 is formed on the substrate 11 is reflected in the flatness of the metal structure, and thus the cell culture container.

  The method for forming the first resist layer 12 on the substrate 11 is not limited at all, and generally includes a spin coat method, a dipping method, a roll method, and a dry film resist bonding. Among these, the spin coating method is a method of applying a resist on a rotating glass substrate, and has an advantage of applying the resist to a glass substrate having a diameter of more than 300 mm with high flatness. Therefore, the spin coating method is preferable from the viewpoint of realizing high flatness.

  The resist used as the first resist layer 12 may be either a positive resist or a negative resist. In either case, the depth of focus of the resist varies depending on the sensitivity of the resist and the exposure conditions. Therefore, for example, when a UV exposure apparatus is used, it is preferable to select the exposure time and UV output value according to the resist thickness and sensitivity.

  When the resist used as the first resist layer 12 is a wet resist, for example, as a method for obtaining a predetermined resist thickness by a spin coating method, there is a method by changing the spin coating rotational speed or adjusting the viscosity. The method by changing the spin coat rotational speed is to obtain a desired resist thickness by appropriately setting the spin coater rotational speed. The viscosity adjustment method adjusts the viscosity according to the flatness required in actual use because there is a concern that the flatness may decrease when the resist thickness is large or the coating area is large. is there.

  For example, in the case of the spin coat method, the thickness of the resist layer applied at one time is preferably in the range of 10 to 50 μm, more preferably in the range of 20 to 50 μm in consideration of maintaining high flatness. preferable. In order to obtain a desired resist layer thickness while maintaining high flatness, the resist layer can be formed in a plurality of times.

  When a positive resist is used for the first resist layer 12, if the baking time (drying of the solvent) proceeds excessively, the resist is extremely cured, and it becomes difficult to form a pattern in the subsequent development. Therefore, when the resist thickness to be set is not 100 μm or more, it is preferable to select appropriately such as shortening the baking time.

(Ii) The alignment between the substrate 11 and the mask A13 will be described.
In order to make the positional relationship between the pattern of the first resist layer 12 and the pattern of the second resist layer 14 as desired, it is necessary to perform accurate alignment at the time of exposure using the mask A13. For alignment, a method of cutting and fixing the substrate 11 and the mask A13 at the same position, a method of positioning using a laser interferometer, a position mark at the same position of the substrate 11 and the mask A13, and an optical microscope Examples of the method include positioning. As a method of aligning with an optical microscope, for example, a position mark is formed on the substrate 11 by a photolithographic method, and the position mark is drawn on a mask A13 by a laser drawing apparatus. Even manual operation using an optical microscope is effective in that accuracy within 5 μm can be easily obtained.

(Iii) The exposure of the first resist layer 12 using the mask A13 will be described.
The mask A13 used in the step shown in FIG. 3B is not limited in any way, and examples thereof include an emulsion mask and a chrome mask. In the resist pattern forming step, the size and accuracy depend on the mask A13 used. And the dimension and precision are reflected also in a resin-made cell culture container. Therefore, in order to make each dimension and accuracy of the resin-made cell culture container predetermined, it is necessary to define the size and accuracy of the mask A13. The method for increasing the accuracy of the mask A13 is not limited at all. For example, the laser light source used for pattern formation of the mask A13 can be changed to one having a shorter wavelength, but the equipment cost is high, and the mask A13 is expensive. Since the production cost is high, it is preferable to appropriately define the resin-made cell culture container according to the accuracy required for practical use.

  The material of the mask A13 is preferably quartz glass from the viewpoint of temperature expansion coefficient and UV transmission absorption performance, but is relatively expensive. Therefore, it is preferable to appropriately define the resin molded product according to the accuracy required for practical use. In order to obtain structures having different desired depths or heights as designed, or structures having different first and second resist patterns, they are used for exposure of the first resist layer 12 and the second resist layer 14. The mask pattern design (transmission / shading part) needs to be reliable, and simulation using CAE analysis software is one of the solutions.

  The light source used for the exposure is preferably ultraviolet light or laser light, which has a low equipment cost. Synchrotron radiation can be used when the equipment cost is high and the price of the resin plate is substantially high, but it is desired to obtain a deep exposure depth.

  Since exposure conditions such as exposure time and exposure intensity vary depending on the material, thickness, and the like of the first resist layer 12, it is preferable to adjust appropriately according to the pattern to be obtained. In particular, adjustment of exposure conditions is important because it affects the size and accuracy of the spatial structure pattern. Further, since the depth of focus varies depending on the type of resist, for example, when a UV exposure apparatus is used, it is preferable to select the exposure time and the UV output value according to the thickness and sensitivity of the resist.

(Iv) The heat treatment of the first resist layer 12 will be described.
As heat treatment after exposure, heat treatment called annealing is known in order to correct the shape of the resist pattern. Here, heat treatment is performed only when a chemically amplified negative resist is used for the purpose of chemical crosslinking. The chemically amplified negative resist is mainly composed of a two-component system or a three-component system. For example, an epoxy group at the end of a chemical structure is opened by light at the time of exposure, and a crosslinking reaction is caused by heat treatment. . For example, when the heat treatment time is 100 μm, the crosslinking reaction proceeds in several minutes under the condition of a set temperature of 100 ° C.

  If the heat treatment of the first resist layer 12 proceeds excessively, it becomes difficult to dissolve the uncrosslinked portion and form a pattern in subsequent development. Therefore, when the resist thickness to be set is not 100 μm or more, the heat treatment time is shortened. It is preferable to select appropriately, for example, or only heat treatment of the second resist layer 14 later.

(V) The formation of the second resist layer 14 on the first resist layer 12 will be described.
FIG. 3C shows a state where the second resist layer 14 is formed. The formation of the second resist layer 14 is performed by the same method as the formation of the first resist layer 12 described in (i) above. Moreover, when forming a resist layer using a positive resist by a spin coat system, alkali resistance can be expressed by making baking time about 1.5 to 2.0 times normal. Thereby, dissolution or deformation of the resist pattern of the second resist layer 14 can be prevented at the end of development of the first resist layer 12 and the second resist layer 14.

(Vi) The alignment between the substrate 11 and the mask B15 will be described.
The alignment between the substrate 11 and the mask B15 is performed by the same method as the alignment between the substrate 11 and the mask A13 described in (ii) above.

(Vii) Exposure of the second resist layer 14 using the mask B15 will be described.
The exposure of the second resist layer 14 using the mask B15 is performed in the same manner as the exposure of the first resist layer 12 using the mask A13 described in (iii) above. FIG. 3D shows how the second resist layer 14 is exposed.

(Viii) The heat treatment of the second resist layer 14 will be described.
The heat treatment of the second resist layer 14 is performed by the same method as the heat treatment of the first resist layer 12 described in (iv) above. The heat treatment of the second resist layer 14 is performed so that the pattern of the second resist layer 14 is not dissolved or deformed when the pattern of the first resist layer 12 is obtained in the subsequent development. Chemical crosslinking proceeds by heat treatment, and alkali resistance is developed by increasing the crosslinking density. It is preferable that the heat treatment time for developing alkali resistance is appropriately selected according to the thickness of the resist from the usual 1.1 to 2.0 times range.

(Ix) The development of the resist layers 12 and 14 will be described.
In the developing step shown in FIG. 3E, it is preferable to use a predetermined developer corresponding to the resist used. Development conditions such as development time, development temperature, and developer concentration are preferably adjusted as appropriate according to the resist thickness and pattern shape. For example, if the development time is too long in order to obtain the required depth, it becomes larger than a predetermined dimension, so it is preferable to set conditions appropriately. By this development process, a resist pattern 16 is formed.

  Examples of methods for improving the planar accuracy of the upper surface of the cell culture container or the bottom of the fine pattern include a method of changing the resist type (negative type or positive type) used in resist coating, a method of polishing the surface of the metal structure, etc. Can be given.

  When forming a plurality of resist layers in order to obtain a desired molding depth, the resist layers are exposed and developed at the same time, or after forming and exposing one resist layer, a resist layer is further formed. The two resist layers can be developed at the same time.

(X) The metal structure forming step will be described in more detail.
The metal structure forming step is to form a metal along the resist pattern 16 obtained in the resist pattern forming step, and to form a micro space structure surface of the metal structure 18 along the resist pattern 16, thereby forming the metal structure. 18 is a step of obtaining 18.

  As shown in FIG. 3F, in this step, a conductive film 17 is formed along the resist pattern 16 in advance. A method for forming the conductive film 17 is not particularly limited, but preferably, a vacuum deposition method, a sputtering method, or the like is used. Examples of the conductive material used for the conductive film 17 include gold, silver, platinum, copper, and aluminum.

  As shown in FIG. 3G, after the conductive film 17 is formed, a metal is formed along the resist pattern 16 by plating to form a metal structure 18. The plating method is not particularly limited, and examples thereof include electrolytic plating and electroless plating. Although the metal used is not specifically limited, Nickel, nickel-cobalt alloy, copper, and gold can be mentioned, and nickel is preferably used from the viewpoint of economy and durability.

  The metal structure 18 may be polished according to the surface state. However, since there is a concern that dirt adheres to the modeled object, it is preferable to perform ultrasonic cleaning after polishing. The metal structure 18 may be surface-treated with a release agent or the like in order to improve the surface state. In addition, the inclination angle in the depth direction of the metal structure 18 is desirably 50 ° to 90 °, more desirably 60 ° to 87 °, from the shape of the resin molded product. The metal structure 18 formed by plating is separated from the resist pattern 16.

(Xi) The molded product forming step will be described in detail.
As shown in FIG. 3H, the molded product forming step is a process of forming a resin molded product 19 using the metal structure 18 as a mold. The method for forming the resin molded product 19 is not particularly limited, and examples thereof include injection molding, press molding, monomer cast molding, solvent cast molding, roll transfer method by extrusion molding, and the like, from the viewpoint of productivity and mold transferability. Injection molding is preferably used. In the case where the resin molded product 19 is formed by injection molding using the metal structure 18 with a predetermined dimension selected as a mold, the shape of the metal structure 18 can be reproduced on the resin molded product 19 with a high transfer rate. As a method for confirming the transfer rate, there are methods using an optical microscope, a scanning electron microscope (SEM), a transmission electron microscope (TEM), and the like.

  The minimum value of the flatness of the resin molded product 19 is preferably 1 μm or more from the viewpoint of easy industrial reproduction. The maximum value of the flatness of the resin molded product 19 is preferably 200 μm or less from the viewpoint of preventing the molded product from warping and coming into contact with the optical system unit. The dimensional accuracy of the molded part of the resin molded product is preferably within a range of ± 0.5 to 10% from the viewpoint of easy industrial reproduction.

  Below, the Example and comparative example concerning this invention are shown. In these Examples and Comparative Examples, the material / thickness and oxygen permeability of the inorganic film 1 to be formed are varied, and the cell viability, that is, the adhesion ability and the proliferation ability of the cultured cells are analyzed. The thickness of the inorganic film 1 was measured by a stylus method using a surface shape measuring instrument (DEKTAK3030) manufactured by ULVAC, Inc. The oxygen permeability in a dry state of 20 ° C. was measured using a Toyo Seiki gas permeability measuring device (model: NO.571). The total light transmittance and haze value, which are optical properties, were measured using a visible light transmittance meter (model: HA-TR) manufactured by Suga Test Instruments Co., Ltd. Specifically, the total light transmittance was measured twice by a method based on JIS K6714, and the average value was obtained. Cell adhesion was analyzed by the Crystal Violet method, which is a colorimetric analysis method. The proliferation ability of the cells was analyzed by the MTT method, which is a colorimetric analysis method, and Comparative Example 1 was taken as 100%.

The Crystal Violet method is a colorimetric analysis method that utilizes the incorporation of Crystal Violet into living cells. Specifically, 5.0 × 10 ⁵ rat brain hippocampal neurons were cultured in an incubator for 2 hours, washed with physiological saline, and suspended (dead) from cells adhering to the substrate. Cell). Next, after staining with Crystal Violet, cells adhering to the substrate were lysed using an SDS (sodium dodecyl sulfate) solution, and the absorbance at a wavelength of 540 nm was measured and compared with Comparative Example 1.

The MTT method is a staining method that utilizes the fact that MTT (a kind of tetrazolium salt) is converted into formazan by a reaction with intracellular dehydrogenase. When the cells are healthy, the enzyme activity is high, the reduction to formazan is high, and the formazan concentration is high. This difference in concentration is used as the absorbance for counting the number of cells. Specifically, 5.0 × 10 ⁵ rat brain hippocampal neurons were cultured in an incubator for 3 hours, washed with physiological saline, and suspended (dead) from cells adhering to the substrate. Cell). After culturing in an incubator for 48 hours, the medium was replaced with a culture solution containing MTT and further cultured for 3 hours. Then, isopropanol was added to dissolve formazan, the absorbance at a wavelength of 570 nm was measured, and compared with Comparative Example 1.

[Comparative Example 1]
A commercially available polystyrene petri dish (φ90 mm, depth 20 mm, plate thickness 1.0 mm) was used. Coating with the inorganic film 1 was not performed. The oxygen transmission rate in a dry state at 20 ° C. was 6500 fmol / m ² · s · Pa. The protrusion shape of the surface to be cultured was 10 nm in width and 0.05 in aspect ratio. The total light transmittance was 86%, and the haze value was 2.7%.

[Comparative Example 2]
A resin plate having a width of 24 mm, a length of 74 mm, and a thickness of 1.0 mm was produced by an injection molding method using an acrylic resin (Parapet GH-S) manufactured by Kuraray Co., Ltd., and then sterilized. Coating with the inorganic film 1 was not performed. The oxygen transmission rate in a dry state at 20 ° C. was 9500 fmol / m ² · s · Pa. The optical properties were a total light transmittance of 91% and a haze value of 2.1%.

[Comparative Example 3]
A resin plate having a width of 24 mm, a length of 74 mm, and a thickness of 1.0 mm was produced by an injection molding method using an acrylic resin (Parapet GH-S) manufactured by Kuraray Co., Ltd., and then sterilized. Next, a nickel (Ni) film was formed using a deposition apparatus of ULVAC, Inc. (model: UEP). The film thickness was 0.001 μm. The oxygen transmission rate in a dry state at 20 ° C. was 750 fmol / m ² · s · Pa. The optical properties were a total light transmittance of 88% and a haze value of 5.7%.

[Comparative Example 4]
A resin plate having a width of 24 mm, a length of 74 mm, and a thickness of 1.0 mm was produced by an injection molding method using an acrylic resin (Parapet GH-S) manufactured by Kuraray Co., Ltd., and then sterilized. Next, an aluminum (Al) film was formed using a deposition apparatus of ULVAC, Inc. (model: UEP). The film thickness was 0.001 μm. The oxygen transmission rate in a dry state at 20 ° C. was 1500 fmol / m ² · s · Pa. The optical physical properties were a total light transmittance of 82% and a haze value of 7.9%.

[Example 1]
A resin plate having a width of 24 mm, a length of 74 mm, and a thickness of 1.0 mm was produced by an injection molding method using an acrylic resin (Parapet GH-S) manufactured by Kuraray Co., Ltd., and then sterilized. Next, an aluminum (Al) film was formed using a deposition apparatus of ULVAC, Inc. (model: UEP). The film thickness was 0.02 μm. The oxygen transmission rate in a dry state at 20 ° C. was 75 fmol / m ² · s · Pa. The optical properties were a total light transmittance of 21% and a haze value of 1.9%.

[Example 2]
A resin plate having a width of 24 mm, a length of 74 mm, and a thickness of 1.0 mm was produced by an injection molding method using an acrylic resin (Parapet GH-S) manufactured by Kuraray Co., Ltd., and then sterilized. Next, ULVAC, Inc. (model: UEP) using a vapor deposition apparatus, to form a silicon oxide (SiO ₂₎ film. The film thickness was 0.10 μm. The oxygen transmission rate in a dry state at 20 ° C. was 10 fmol / m ² · s · Pa. The optical physical properties were a total light transmittance of 90% and a haze value of 3.8%.

[Example 3]
A resin plate having a width of 24 mm, a length of 74 mm, and a thickness of 1.0 mm was produced by an injection molding method using an acrylic resin (Parapet GH-S) manufactured by Kuraray Co., Ltd., and then sterilized. Next, ULVAC, Inc. (model: UEP) using a vapor deposition apparatus, to form a silicon oxide (SiO ₂₎ film. The film thickness was 2.0 μm. The oxygen transmission rate in a dry state at 20 ° C. was 0.5 fmol / m ² · s · Pa. The optical properties were a total light transmittance of 87% and a haze value of 5.5%.

[Example 4]
Using an acrylic resin (Parapet GH-S) manufactured by Kuraray Co., Ltd., a plurality of 20 μm high on a resin plate having a width of 24 mm, a length of 74 mm and a thickness of 1.0 mm by an injection molding method using a stamper A plate having a microspace structure formed by sidewalls was produced. FIG. 4 is a plan view showing the configuration of the cell culture container according to Example 4. This is a structure having only the second protrusion 4 without the first protrusion 3 shown in FIG. The dimensions of the second protrusions 4 are 10 μm in width, 60 μm in length, and 20 μm in height, and the arrangement pitch is 100 μm in both length and width. The resin plate was sterilized. Next, ULVAC, Inc. (model: UEP) using a vapor deposition apparatus, to form a silicon oxide (SiO ₂₎ film. The film thickness was 0.3 μm. The oxygen transmission rate in a dry state at 20 ° C. was 15 fmol / m ² · s · Pa. The optical physical properties were a total light transmittance of 86% and a haze value of 7.7%.

  The results of the comparative examples and examples are summarized in Table 1.

When the thickness of the inorganic film 1 was 0.002 μm or less and the oxygen permeability in a dry state at 20 ° C. was larger than 500 fmol / m ² · s · Pa, both the adhesion ability and the growth ability were lower than those in Comparative Example 1. Compared to the adhesive ability, the proliferation ability was further reduced. In Comparative Examples 3 and 4, since the inorganic film 1 is thin, transparency is maintained. On the other hand, the oxygen permeability is high because the surface coating is incomplete. In particular, in the vacuum vapor deposition method of Comparative Example 4, since the film thickness varies, the surface coating tends to be incomplete. Therefore, it is considered that the release of toxic substances from the cell culture container into the culture solution could not be prevented, and the cell viability of the cultured cells was not improved. In addition, it is considered that the decrease in proliferation ability is remarkable because toxic substances are released into the culture solution for a long time.

In the examples, the inorganic membrane 1 has a thickness of 0.002 μm to 5 μm, and the oxygen permeability in a dry state of 20 ° C. is 500 fmol / m ² · s · Pa or less, so that the cells are significantly higher than Comparative Example 1. The survival rate was shown. In Examples 3 and 4, since the inorganic film 1 is a silicon oxide (SiO ₂ ) film, both the high transparency and cell viability are satisfied, and it is particularly suitable for cell observation using transmitted light. ing.

  The present invention is used, for example, in a cell culture container for culturing cells isolated from tissues and using them for testing and testing.

Claims (10)

A resinous cell culture vessel having an inorganic membrane having a thickness of 0.002 μm to 5 μm on at least a surface on which cells are cultured and having an oxygen permeability of 500 fmol / m ² · s · Pa or less in a dry state at 20 ° C.   The resin cell culture container according to claim 1, which has transparency.   The resin-made cell culture container according to claim 1 or 2, wherein the inorganic film is silicon oxide.   The resin-made cell culture container according to any one of claims 1 to 3, wherein a hydrophilic or hydrophobic organic film or inorganic film is provided on all or a part of the outermost surface of the cell culture container.   The resin cell culture container according to any one of claims 1 to 4, wherein the cell culture surface has a plurality of microspace structures. Forming a pattern on the substrate;
Attaching a metal according to a pattern formed on the substrate or a transfer pattern thereof to form a metal structure;
Transferring a pattern of the metal structure to form a cell culture vessel;
And a step of forming an inorganic film on a surface of the cell container on which at least cells are cultured.   The method for producing a resin-made cell culture container according to claim 6, wherein the step of forming the inorganic film is a vacuum deposition method.   In the step of forming a pattern on the substrate, the step of forming the resist pattern includes repeating the formation and exposure of the resist layer a plurality of times until the resist layer is formed into a structure having a desired height or depth. The manufacturing method of the resin-made cell culture container of Claim 6 or 7 characterized by the above-mentioned.   9. The method of manufacturing a resin-made cell culture container according to claim 8, further comprising a step of aligning a mask position in order to align a pattern position in the step of repeating the formation and exposure of the resist layer a plurality of times.   The method for producing a resin-made cell culture container according to claim 8 or 9, wherein a mask having a different pattern is used in the step of repeating the formation and exposure of the resist layer a plurality of times.

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