JPWO2004029532A1

JPWO2004029532A1 - Hinge mechanism, flow path movable heat transfer device, and flow path movable heat pipe

Info

Publication number: JPWO2004029532A1
Application number: JP2004539498A
Authority: JP
Inventors: 志村　隆広; 隆広志村; 山本　雅章; 雅章山本; 木村　裕一; 裕一木村
Original assignee: THE FURUKAW ELECTRIC CO., LTD.
Current assignee: THE FURUKAW ELECTRIC CO., LTD.
Priority date: 2002-09-26
Filing date: 2003-09-24
Publication date: 2006-01-26
Anticipated expiration: 2023-09-24
Also published as: JP4297364B2; WO2004029532A1

Abstract

放熱手段に熱的に接続される第１中空状部材と、被冷却物に熱的に接続される第２中空状部材と、第１中空状部材の他方の端部に気密に接続される、内部に中空状の連通部を備えた第１コネクタ部と、第２中空状部材の他方の端部に気密に接続され、第１コネクタ部と気密に接続可能な、対応する中空状の連通部を内部に備えた第２コネクタ部とからなる、軸線の回りに回動可能なコネクタと、第１中空状部材、第１コネクタ部、第２コネクタ部、および、第２中空状部材によって形成される密閉容器内に封入される作動流体とを備えた流路可動型ヒートパイプ。A first hollow member thermally connected to the heat dissipation means, a second hollow member thermally connected to the object to be cooled, and an airtight connection to the other end of the first hollow member; Corresponding hollow communication portion that is hermetically connected to the first connector portion having a hollow communication portion therein and the other end portion of the second hollow member and is airtightly connectable to the first connector portion. Formed by a connector that is rotatable about an axis, a first hollow member, a first connector portion, a second connector portion, and a second hollow member. A fluid-movable heat pipe having a working fluid sealed in a closed container.

Description

本発明は、小さい熱抵抗のヒンジ機構、小さい熱抵抗で高温部から低温部へ熱を輸送する流路可動型伝熱装置、および、流路可動型ヒートパイプに関する。 The present invention relates to a hinge mechanism having a small heat resistance, a flow path movable heat transfer device that transports heat from a high temperature portion to a low temperature portion with a small heat resistance, and a flow path movable heat pipe.

従来、ノートパソコンにおけるキーボード側に配置されたＣＰＵの発熱を液晶ディスプレイ側に輸送するために、ヒートパイプを利用するヒンジ機構が用いられている。例えば、特開平１０−１８７２８４号公報に上述したヒートパイプを利用するヒンジ構造が開示されている。図１９は、従来のヒンジ機構を示す図である。図１９に示すように、冷却手段または発熱体が所定の回転軸に沿って回転移動する。即ち、２本のヒートパイプ１３５、１５５がヒンジ機構１５２によって接続され、ヒンジ機構によって各ヒートパイプが保持され、一方のヒートパイプがヒンジ機構を介して、他方のヒートパイプに熱移動される。即ち、ヒートパイプとヒンジ機構との間を熱接触によって熱を輸送している。
ヒンジ機構はヒートパイプとの熱接触を維持したまま、ヒートパイプを所定の回転軸の回りに回動させることが可能であり、ヒンジ機構によって、液晶ディスプレイの開閉を可能にしつつ、ＣＰＵの発熱を液晶ディスプレイ側に輸送している。
更に、実願昭６２−１６０１７９は、２つのパイプの内壁にグルーブを形成し、コネクタの接続とともに、２つのグルーブを接触させる方法が開示されている。２つのパイプの内壁に形成されたグルーブを安定して接触させることは容易ではなく、コネクタ内でグルーブ間に連続性がなくなることがある。
シール構造を設けつつ、コネクタ内壁面に作動液の濡れ性を高める細工を施こすこと（例えば、溝を形成する、酸化処理をする）は困難であり、コネクタ内壁面と作動液の濡れ性は高くないのが通常である。
上述した従来のヒンジ機構によって、液晶ディスプレイの開閉を可能にしつつ、ＣＰＵの発熱を液晶ディスプレイ側に熱を輸送することは可能になったけれども、ＣＰＵの発熱は、ヒートパイプとヒンジ機構の熱接触およびヒンジ機構内における熱伝導によって輸送される、更に、作動流体のヒートパイプ内面における熱交換箇所が４箇所と多く、熱抵抗が大きく、熱性能の改善が必要とされている。
更に、上述したように、コネクタ内でグルーブ間に連続性がなくなり、且つ、作動液とコネクタ内壁の濡れ性が悪いと、コネクタ内部で作動液が雫状のまま停滞することがある。雫状の作動液は作動液蒸気の流れを阻害し、ヒートパイプ伝熱性能低下を引き起こす。更に、作動液の循環が完全に止まり、ヒートパイプ機能が停止することがある。
この発明の目的は、熱抵抗の小さいヒンジ機構、流路可動型伝熱装置および流路可動型ヒートパイプを提供することにある。Conventionally, a hinge mechanism using a heat pipe has been used to transport heat generated by a CPU arranged on the keyboard side of a notebook computer to the liquid crystal display side. For example, Japanese Patent Application Laid-Open No. 10-187284 discloses a hinge structure using the heat pipe described above. FIG. 19 is a view showing a conventional hinge mechanism. As shown in FIG. 19, the cooling means or the heating element rotates and moves along a predetermined rotation axis. That is, the two heat pipes 135 and 155 are connected by the hinge mechanism 152, each heat pipe is held by the hinge mechanism, and one heat pipe is thermally transferred to the other heat pipe via the hinge mechanism. That is, heat is transported between the heat pipe and the hinge mechanism by thermal contact.
The hinge mechanism can rotate the heat pipe around a predetermined rotation axis while maintaining the thermal contact with the heat pipe, and the hinge mechanism can open and close the liquid crystal display while the CPU generates heat. Transported to the LCD display side.
Further, Japanese Utility Model Application No. 62-160179 discloses a method in which grooves are formed on the inner walls of two pipes, and the two grooves are brought into contact with the connectors. It is not easy to stably contact the grooves formed on the inner walls of the two pipes, and there may be no continuity between the grooves in the connector.
While providing a seal structure, it is difficult to craft a work that increases the wettability of the hydraulic fluid on the inner wall surface of the connector (for example, to form a groove or to perform an oxidation treatment). It is usually not expensive.
Although the above-described conventional hinge mechanism enables the liquid crystal display to be opened and closed, and the heat generated by the CPU can be transported to the liquid crystal display side, the heat generated by the CPU is caused by thermal contact between the heat pipe and the hinge mechanism. Further, there are many heat exchange locations on the inner surface of the heat pipe of the working fluid that are transported by heat conduction in the hinge mechanism, and there is a large thermal resistance, and improvement in thermal performance is required.
Furthermore, as described above, if there is no continuity between the grooves in the connector and the wettability between the working fluid and the inner wall of the connector is poor, the working fluid may stagnate inside the connector. The bowl-shaped hydraulic fluid obstructs the flow of the hydraulic fluid vapor and causes heat pipe heat transfer performance to deteriorate. Furthermore, the circulation of the hydraulic fluid may completely stop and the heat pipe function may stop.
An object of the present invention is to provide a hinge mechanism, a flow path movable heat transfer device, and a flow path movable heat pipe having a low thermal resistance.

発明者は、上述した従来の問題点を解決するために鋭意研究を重ねた。その結果、ヒートパイプと回動可能な中空のコネクタを気密に接続し、コネクタの一部を固定し、他の部分を所定の摺動抵抗を備えて回転させることによって、熱抵抗の小さいヒンジ機構を提供することができることが判明した。即ち、内部にそれぞれ対応する中空状の連通部を備え、一方が所定の位置に固定され、他方が軸線の回りに回動可能の、気密に接続可能な１組のコネクタと、１組のコネクタのそれぞれに気密に接続され、連通部と連通する中空状部材とからなるヒンジ機構を使用することによって、熱抵抗が著しく小さくなることが判明した。
更に、第１コネクタ部および第２コネクタ部の連通部を貫通して、第１中空部材と第２中空部材を連絡する単体のウイック部材を使用することによって、コネクタ部に作動液が雫状のまま滞留することを防止することができることが判明した。
この発明は、上述した研究結果に基づいてなされたものであって、この発明のヒンジ機構の第１の態様は、内部にそれぞれ対応する中空状の連通部を備え、一方が所定の位置に固定され、他方が軸線の回りに回動可能の、気密に接続可能な１組のコネクタと、前記１組のコネクタのそれぞれに気密に接続され、前記連通部と連通する中空状部材とからなるヒンジ機構である。
この発明のヒンジ機構の第２の態様は、前記中空状部材が棒状ヒートパイプからなり、前記１組のコネクタの前記一方がキーボード部またはディスプレー部に固定され、前記キーボード部およびディスプレー部の開閉を制御するヒンジ機構である。
この発明のヒンジ機構の第３の態様は、前記１組のコネクタが所定の摺動抵抗を備えて軸線の回りに回転する、ヒンジ機構である。
この発明の流路可動型伝熱装置の第１の態様は、一方の端部が封止され放熱手段に熱的に接続される第１中空状部材と、
一方の端部が封止され被冷却物に熱的に接続される第２中空状部材と、
前記第１中空状部材の他方の端部に気密に接続される、内部に中空状の連通部を備えた第１コネクタ部と、前記第２中空状部材の他方の端部に気密に接続され、前記第１コネクタ部と気密に接続可能な、対応する中空状の連通部を内部に備えた第２コネクタ部とからなり、前記第１コネクタまたは前記第２コネクタが所定の位置に固定され、他方が軸線の回りに回動可能なコネクタと、
前記第１中空状部材、前記第１コネクタ部、前記第２中空状部材、前記第２コネクタによって形成される密閉容器内に封入される作動流体とを備えた流路可動型伝熱装置である。
この発明の流路可動型伝熱装置の第２の態様は、前記第１中空状部材、前記第１コネクタ部、前記第２中空状部材、前記第２コネクタによって形成される密閉容器が閉ループを形成している、流路可動型伝熱装置である。
この発明の流路可動型伝熱装置の第３の態様は、それぞれ前記第１中空状部材、前記第１コネクタ部、前記第２中空状部材、前記第２コネクタによって形成される２組の密閉容器を備えており、前記２組の密閉容器のそれぞれの前記第２コネクタが、所定の位置に固定され、それぞれの前記第１コネクタが、対応する前記第２コネクタの軸線の回りに所定の摺動抵抗を備えて回転する、流路可動型伝熱装置である。
この発明の流路可動型伝熱装置の第４の態様は、前記第１中空状部材、前記第１コネクタ部、前記第２中空状部材、前記第２コネクタによって形成される少なくとも２組の密閉容器を備えており、前記少なくとも２組の密閉容器のそれぞれの第１中空状部材が一体的に連通して接続され、それぞれの前記第２コネクタが、所定の位置に固定され、それぞれの前記第１コネクタが、対応する前記第２コネクタの軸線の回りに所定の摺動抵抗を備えて回転する、流路可動型伝熱装置である。
この発明の流路可動型伝熱装置の第５の態様は、前記第１中空状部材、前記第１コネクタ部、前記第２中空状部材、前記第２コネクタによって形成される少なくとも２組の密閉容器を備えており、前記少なくとも２組の密閉容器のそれぞれの第１中空状部材が一体的に連通して接続され、それぞれの第２中空状部材が一体的に連通して接続されて閉ループを形成し、それぞれの前記第２コネクタが、所定の位置に固定され、それぞれの前記第１コネクタが、対応する前記第２コネクタの軸線の回りに所定の摺動抵抗を備えて回転する、流路可動型伝熱装置である。
この発明の流路可動型伝熱装置の第６の態様は、前記閉ループを形成するそれぞれの前記第２中空状部材に、更に流体循環装置が接続されている、流路可動型伝熱装置である。
この発明の流路可動型伝熱装置の第７の態様は、前記作動流体が臨界密度以上の充填密度（＝充填重量／密閉容器内容積）の二酸化炭素である、流路可動型伝熱装置である。
この発明の流路可動型伝熱装置の第８の態様は、前記作動流体が臨界密度以上の充填密度（＝充填重量／密閉容器内容積）で、且つ、伝熱装置作動時に臨界温度以上の温度になっているの二酸化炭素である、流路可動型伝熱装置である。
この発明の流路可動型伝熱装置の第９の態様は、前記作動流体が水である、流路可動型伝熱装置である。
この発明の流路可動型ヒートパイプの第１の態様は、放熱手段に熱的に接続される第１中空状部材と、
被冷却物に熱的に接続される第２中空状部材と、
前記第１中空状部材の他方の端部に気密に接続される、内部に中空状の連通部を備えた第１コネクタ部と、前記第２中空状部材の他方の端部に気密に接続され、前記第１コネクタ部と気密に接続可能な、対応する中空状の連通部を内部に備えた第２コネクタ部とからなる、軸線の回りに回動可能なコネクタと、
前記第１中空状部材、前記第１コネクタ部、前記第２コネクタ部、および、前記第２中空状部材によって形成される密閉容器内に封入される作動流体と、
前記密閉容器の前記第１コネクタ部および前記第２コネクタ部の前記連通部を貫通して、前記第１中空部材と前記第２中空部材を連絡する単体のウイック部材を備えた流路可動型ヒートパイプである。
この発明の流路可動型ヒートパイプの第２の態様は、前記ウイック部材の前記第１中空状部材側に位置する端部が、少なくとも前記第１コネクタ部と同じ高さ以上に位置している、流路可動型ヒートパイプである。
この発明の流路可動型ヒートパイプの第３の態様は、前記ウイック部材が帯状のメッシュからなっている、流路可動型ヒートパイプである。
この発明の流路可動型ヒートパイプの第４の態様は、前記ウイック部材が１本以上のワイヤからなっている、流路可動型ヒートパイプである。
この発明の流路可動型ヒートパイプの第５の態様は、液化した作動流体が前記ウイック部材を膜状に濡らす、流路可動型ヒートパイプである。The inventor has intensively studied to solve the above-described conventional problems. As a result, the heat pipe and the rotatable hollow connector are connected in an airtight manner, a part of the connector is fixed, and the other part is rotated with a predetermined sliding resistance, whereby the hinge mechanism has a low thermal resistance. Turned out to be able to provide. That is, one set of connectors that can be connected in an airtight manner and one set of connectors, each having a hollow communication portion corresponding to the inside, one of which is fixed at a predetermined position and the other is rotatable around an axis. It has been found that the thermal resistance is remarkably reduced by using a hinge mechanism comprising a hollow member that is airtightly connected to each other and communicates with the communicating portion.
Further, by using a single wick member that passes through the communication portion of the first connector portion and the second connector portion and connects the first hollow member and the second hollow member, the working fluid is in a bowl-like shape in the connector portion. It has been found that it is possible to prevent staying as it is.
The present invention has been made on the basis of the above-described research results. The first aspect of the hinge mechanism of the present invention is provided with hollow communication portions respectively corresponding to the interior thereof, one of which is fixed at a predetermined position. A pair of airtightly connectable connectors, the other of which can be rotated about an axis, and a hollow member that is airtightly connected to each of the one set of connectors and communicates with the communicating portion. Mechanism.
According to a second aspect of the hinge mechanism of the present invention, the hollow member is formed of a rod-like heat pipe, the one of the pair of connectors is fixed to a keyboard part or a display part, and the keyboard part and the display part are opened and closed. It is a hinge mechanism to control.
A third aspect of the hinge mechanism according to the present invention is a hinge mechanism in which the one set of connectors rotates around an axis line with a predetermined sliding resistance.
A first aspect of the flow path movable heat transfer device according to the present invention includes: a first hollow member whose one end is sealed and thermally connected to the heat radiating means;
A second hollow member whose one end is sealed and thermally connected to the object to be cooled;
A first connector portion having a hollow communication portion therein, which is airtightly connected to the other end portion of the first hollow member, and an airtight connection to the other end portion of the second hollow member. The second connector portion having a corresponding hollow communication portion that can be hermetically connected to the first connector portion, and the first connector or the second connector is fixed at a predetermined position, A connector that is rotatable about an axis,
A flow path movable heat transfer device comprising: the first hollow member, the first connector portion, the second hollow member, and a working fluid sealed in a sealed container formed by the second connector. .
According to a second aspect of the flow path movable heat transfer device of the present invention, the closed container formed by the first hollow member, the first connector portion, the second hollow member, and the second connector has a closed loop. The flow path movable heat transfer device is formed.
According to a third aspect of the flow path movable heat transfer device of the present invention, two sets of sealing formed by the first hollow member, the first connector portion, the second hollow member, and the second connector, respectively. Each of the two sets of sealed containers is fixed at a predetermined position, and each of the first connectors is a predetermined slide around the axis of the corresponding second connector. It is a flow path movable heat transfer device that rotates with dynamic resistance.
According to a fourth aspect of the flow path movable heat transfer device of the present invention, at least two sets of sealing formed by the first hollow member, the first connector portion, the second hollow member, and the second connector. A first hollow member of each of the at least two sets of sealed containers is integrally connected and connected, and each of the second connectors is fixed at a predetermined position, One connector is a flow path movable heat transfer device that rotates with a predetermined sliding resistance around the axis of the corresponding second connector.
According to a fifth aspect of the flow path movable heat transfer device of the present invention, at least two sets of sealing formed by the first hollow member, the first connector portion, the second hollow member, and the second connector. A first hollow member of each of the at least two sets of closed containers is integrally connected and connected, and each second hollow member is integrally connected and connected to form a closed loop. Each of the second connectors is fixed at a predetermined position, and each of the first connectors rotates with a predetermined sliding resistance around the axis of the corresponding second connector. It is a movable heat transfer device.
A sixth aspect of the flow path movable heat transfer device of the present invention is a flow path movable heat transfer device in which a fluid circulation device is further connected to each of the second hollow members forming the closed loop. is there.
A seventh aspect of the flow path movable heat transfer apparatus of the present invention is the flow path movable heat transfer apparatus, wherein the working fluid is carbon dioxide having a filling density equal to or higher than the critical density (= filling weight / closed container internal volume). It is.
According to an eighth aspect of the flow path movable heat transfer device of the present invention, the working fluid has a filling density equal to or higher than a critical density (= filling weight / closed vessel internal volume) and is higher than a critical temperature when the heat transfer device is operated. This is a flow path movable heat transfer device that is carbon dioxide at a temperature.
A ninth aspect of the flow path movable heat transfer device of the present invention is the flow path movable heat transfer device, wherein the working fluid is water.
The first aspect of the flow path movable heat pipe of the present invention includes a first hollow member thermally connected to the heat radiating means,
A second hollow member thermally connected to the object to be cooled;
A first connector portion having a hollow communication portion therein, which is airtightly connected to the other end portion of the first hollow member, and an airtight connection to the other end portion of the second hollow member. A connector that can be connected airtightly to the first connector portion, and a second connector portion having a corresponding hollow communication portion therein, and a connector that is rotatable about an axis,
A working fluid sealed in an airtight container formed by the first hollow member, the first connector portion, the second connector portion, and the second hollow member;
Flow path movable heat provided with a single wick member that passes through the communicating portion of the first connector portion and the second connector portion of the sealed container and connects the first hollow member and the second hollow member. It is a pipe.
According to a second aspect of the flow path movable heat pipe of the present invention, an end portion of the wick member positioned on the first hollow member side is positioned at least equal to or higher than the first connector portion. The flow path movable heat pipe.
A third aspect of the flow path movable heat pipe of the present invention is a flow path movable heat pipe in which the wick member is made of a belt-like mesh.
A fourth aspect of the flow path movable heat pipe of the present invention is a flow path movable heat pipe in which the wick member is made of one or more wires.
A fifth aspect of the flow path movable heat pipe of the present invention is a flow path movable heat pipe in which the liquefied working fluid wets the wick member in a film shape.

図１は、この発明のヒンジ機構の１つの態様を示す図である。図１Ａは、組み立てられたヒンジ機構を示す図であり、図１Ｂは、ヒンジ機構の分解図である。
図２は、ヒンジ機構の気密な接続状態を説明する図である。
図３は、この発明の流路可動型伝熱装置の１つの態様を説明する図である。
図４は、図３に示す態様のこの発明の流路可動型伝熱装置の側面図である。
図５は、図３に示す態様のこの発明の流路可動型伝熱装置の側面図である。
図６は、この発明の流路可動型伝熱装置の他の１つの態様を説明する図である。
図７は、この発明の流路可動型伝熱装置の他の１つの態様を説明する図である。
図８は、この発明の流路可動型伝熱装置の他の１つの態様を説明する図である。
図９は、この発明の流路可動型伝熱装置の他の１つの態様を説明する図である。
図１０は、この発明の流路可動型ヒートパイプの１つの態様を示す図である。
図１１は、この発明の流路可動型ヒートパイプを説明する図である。
図１２は、ウイック材を部分的に使用したこの発明の流路可動型ヒートパイプを説明する図である。
図１３は、パソコンに取り付けられたこの発明の流路可動型ヒートパイプの１つの態様を示す図である。
図１４は、図１３における流路可動型ヒートパイプのみを取り出して示す図である。
図１５は、図１５は、パソコンに取り付けられたこの発明の流路可動型ヒートパイプの他の態様を示す図である。
図１６は、図１５における流路可動型ヒートパイプのみを取り出して示す図である。
図１７は、実験に使用した流路可動型ヒートパイプを説明する図である。
図１８は、ウイック材の態様を示す図である。
図１９は、従来のヒンジ機構を示す図である。FIG. 1 is a view showing one embodiment of the hinge mechanism of the present invention. FIG. 1A is a diagram illustrating the assembled hinge mechanism, and FIG. 1B is an exploded view of the hinge mechanism.
FIG. 2 is a diagram illustrating an airtight connection state of the hinge mechanism.
FIG. 3 is a view for explaining one aspect of the flow path movable heat transfer device of the present invention.
FIG. 4 is a side view of the flow path movable heat transfer device of the present invention in the embodiment shown in FIG.
FIG. 5 is a side view of the flow path movable heat transfer device of the present invention according to the embodiment shown in FIG.
FIG. 6 is a diagram for explaining another embodiment of the flow path movable heat transfer device of the present invention.
FIG. 7 is a diagram for explaining another embodiment of the flow path movable heat transfer device of the present invention.
FIG. 8 is a diagram illustrating another embodiment of the flow path movable heat transfer device of the present invention.
FIG. 9 is a diagram for explaining another embodiment of the flow path movable heat transfer device of the present invention.
FIG. 10 is a view showing one aspect of the flow path movable heat pipe of the present invention.
FIG. 11 is a view for explaining the flow path movable heat pipe of the present invention.
FIG. 12 is a diagram for explaining the flow path movable heat pipe of the present invention in which a wick material is partially used.
FIG. 13 is a view showing one aspect of the flow path movable heat pipe of the present invention attached to a personal computer.
FIG. 14 is a view showing only the flow path movable heat pipe in FIG.
FIG. 15 is a diagram showing another embodiment of the flow path movable heat pipe of the present invention attached to a personal computer.
FIG. 16 is a view showing only the flow path movable heat pipe in FIG.
FIG. 17 is a diagram for explaining the flow path movable heat pipe used in the experiment.
FIG. 18 is a diagram showing an aspect of the wick material.
FIG. 19 is a view showing a conventional hinge mechanism.

この発明のヒンジ機構および流路可動型伝熱装置を図面を参照しながら説明する。
この発明のヒンジ機構の１つの態様は、内部にそれぞれ対応する中空状の連通部を備え、一方が所定の位置に固定され、他方が軸線の回りに回動可能の、気密に接続可能な１組のコネクタと、前記１組のコネクタのそれぞれに気密に接続され、前記連通部と連通する中空状部材とからなるヒンジ機構である。
この発明のヒンジ機構においては、前記中空状部材が棒状ヒートパイプからなり、前記１組のコネクタの前記一方が第１筐体部（ノート型パソコンを例にするとキーボード部）または第２筐体部（ノート型パソコンを例にするとディスプレー部）に固定され、前記第１筺体部および第２筐体部の開閉を制御する。更に、前記１組のコネクタが所定の摺動抵抗を備えて軸線の回りに回転する。
図１は、この発明のヒンジ機構の１つの態様を示す図である。図１Ａは、組み立てられたヒンジ機構を示す図である。図１Ｂは、ヒンジ機構の分解図である。図１Ａに示すように、ヒンジ機構は、中空状部材、例えば、丸型ヒートパイプ５の１つの端部に気密に接続された内部に中空状の連通部を備える第１コネクタ３と、中空状部材、例えば、丸型ヒートパイプ６の１つの端部に気密に接続された内部に中空状の連通部を備える第２コネクタ４からなっており、第１コネクタ３と第２コネクタ４とが、回動可能に気密に接続される。
図１Ｂに示すように、丸型ヒートパイプ５の１つの端部に気密に接続された内部に中空状の連通部を備える第１コネクタ３と、丸型ヒートパイプ６の１つの端部に気密に接続された内部に中空状の連通部を備える第２コネクタ４とが、回動可能に気密に接続されている。丸型ヒートパイプ５の中空状の内部、第１コネクタ３の中空状の連通部、丸型ヒートパイプ６の中空状の内部、および、第２コネクタ４の中空状の連通部が、気密に連通されている。
更に、上述したように、第１コネクタ３と第２コネクタ４とが、回動可能に気密に接続されている。更に、上述した第１コネクタ３と第２コネクタ４からなる１組のコネクタが所定の摺動抵抗を備えて軸線の回りに回転する。従って、第１コネクタまたは第２コネクタを固定することによって、他方のコネクタは、所定の摺動抵抗を備えて軸線の回りに回転するので、ヒンジ機構として、様々な利用が可能である。
図２は、ヒンジ機構の気密な接続状態を説明する図である。図２に示すように、丸型ヒートパイプ５の１つの端部と、内部に中空状の連通部を備える第１コネクタ３とを気密に接続する方法は、内部に封入される作動流体が粘性の小さいガス状になった場合でも、接合部から外部に漏れないように接続すればよく、特に限定されるものではない。例えば、丸型ヒートパイプ５の１つの端部と、内部に中空状の連通部を備える第１コネクタ３との接続面に対応するネジ山を形成して、丸型ヒートパイプ５の端部を、第１コネクタ３にねじ込んで固定してもよいし、ろう付けにより金属的に接合させてもよい。
丸型ヒートパイプ６の１つの端部と、内部に中空状の連通部を備える第２コネクタ４との気密な接続は、上述したと同一の方法によって行われる。このようにして、丸型ヒートパイプ５の１つの端部と、内部に中空状の連通部を備える第１コネクタ３とが固定されて、一体的に形成され、丸型ヒートパイプ６の１つの端部と、内部に中空状の連通部を備える第２コネクタ４とが固定されて、一体的に形成される。
このようにヒートパイプと固定された第１コネクタ３と、ヒートパイプと固定された第２コネクタ４とが、回動可能にかつ気密に接続される。即ち、第１コネクタ３と第２コネクタ４には、それぞれ径の異なる所定の長さの延伸部７、１０が備えられており、延伸部１０が延伸部７に挿入される。延伸部１０は、円筒部８と先端部９からなっており、先端部９の端部は、円筒部８の径よりも大きく形成されて、コネクタの係止を可能としている。延伸部７の内部の所定の位置には、例えば、Ｏリングが設けられて、更に、気密な接続を容易にしている。場合によっては気密性を高めるために、Ｏリングを複数設置するなど、延伸部７、１０同士が互いに接触する箇所を複数設けてもよい。リングの材質としては、ガス透過性の低い材質が好ましく、例えば、ブチルゴム、フッ素ゴム、ヒドリンゴム、クロルスルホン化ポリエチレンなどを用いると良い。
上述したように、ヒートパイプと固定された第１コネクタ３と、ヒートパイプと固定された第２コネクタ４とが、回動可能にかつ気密に接続される。上述したこの発明のヒンジ機構の、第１コネクタ３と第２コネクタ４からなる１組のコネクタの一方を、例えばキーボード部またはディスプレー部に固定することによって、キーボード部およびディスプレー部の開閉を所定の摺動抵抗を備えて行うことができる。
図３は、この発明の流路可動型伝熱装置の１つの態様を説明する図である。この態様の流路可動型伝熱装置は、一方の端部が封止され放熱手段に熱的に接続される第１中空状部材と、一方の端部が封止され被冷却物に熱的に接続される第２中空状部材と、第１中空状部材の他方の端部に気密に接続される、内部に中空状の連通部を備えた第１コネクタ部と、第２中空状部材の他方の端部に気密に接続され、第１コネクタ部と気密に接続可能な、対応する中空状の連通部を内部に備えた第２コネクタ部とからなり、第１コネクタまたは第２コネクタが所定の位置に固定され、他方が軸線の回りに回動可能なコネクタと、第１中空状部材、第１コネクタ部、第２中空状部材、第２コネクタによって形成される密閉容器内に封入される作動流体とを備えた流路可動型伝熱装置である。
図３に示すように、この態様の流路可動型伝熱装置は、一方の端部１７が封止され放熱手段１９に熱的に接続される第１中空状部材、例えば、丸型ヒートパイプ１６と、一方の端部１８が封止され被冷却物２０に熱的に接続される第２中空状部材、例えば、丸型ヒートパイプ１５と、第１中空状部材である丸型ヒートパイプ１６の他方の端部に気密に接続される、内部に中空状の連通部を備えた第１コネクタ部１４と、第２中空状部材である丸型ヒートパイプ１５の他方の端部に気密に接続され、第１コネクタ部１４と気密に接続可能な、対応する中空状の連通部を内部に備えた第２コネクタ部１３とからなっている。
第１コネクタ１４または第２コネクタ１３が所定の位置に固定され、他方が軸線の回りに回動可能であり、上述した第１中空状部材である丸型ヒートパイプ１６、第１コネクタ部１４、第２中空状部材である丸型ヒートパイプ１５、第２コネクタ１３によって形成される密閉容器内には、作動流体が封入されている。
更に、図３に示すように、放熱手段１９、被冷却物２０との相対的な位置関係に適合するように、ヒートパイプは所定の位置において所定の方向に屈折してもよい。
図４および図５は、図３に示す態様のこの発明の流路可動型伝熱装置の側面図である。この態様においては、第２コネクタ１３が固定され、第１コネクタ１４が軸線方向を中心として回動可能である。図４は、第１コネクタ１４および第２コネクタ１３が、ヒートパイプ１６およびヒートパイプ１５に関して、回転していない状態を示している。即ち、被冷却物１５と放熱手段１９とが同一水平面に位置している。図５は、第１コネクタ１４が第２コネクタ１３に関して、矢印の方向に回転している状態を示している。即ち、放熱手段１９およびヒートパイプ１６が、被冷却物２０およびヒートパイプ１５と、角度θを形成している。この態様の流路可動型伝熱装置において、例えば、キーボード側に被冷却物２０を配置し、ディスプレイ側に放熱手段を配置し、第２コネクタ１３をディスプレイ側に固定すれば、従来技術に示したヒンジ機構に代わる、パソコン用の熱抵抗の小さいヒンジ機構を提供することができる。
被冷却物の熱によってヒートパイプ１５内の作動液が蒸発し第２コネクタ１３、第１コネクタ１４の中空状の連通部を通過して、ヒートパイプ１６に移動し、放熱手段によって放熱して、再び液相に戻り、第１コネクタ１４、第２コネクタ１３の中空状の連通部を通過して、ヒートパイプ１５に還流する。上述したように、第１コネクタ１４、第２コネクタ１３は、中空状の連通部からなっているので、気相、液相の作動流体の移動は容易であり、熱抵抗が極めて小さい。更に、第１コネクタ１４、第２コネクタ１３の材料を適切に選択する、例えば、熱伝導性の低い材料を使用することによって、コネクタに接続される部分の温度を低く維持することができる。
図６は、この発明の流路可動型伝熱装置の他の１つの態様を説明する図である。この態様の流路可動型伝熱装置は、それぞれ上述した第１中空状部材、第１コネクタ部、第２中空状部材、第２コネクタによって形成される２組の密閉容器を備えており、２組の密閉容器のそれぞれの第２コネクタが、所定の位置に固定され、それぞれの第１コネクタが、対応する第２コネクタの軸線の回りに所定の摺動抵抗を備えて回転する、流路可動型伝熱装置である。
即ち、図６に示すように、２組の密閉容器を備えている。第１の密閉容器は、一方の端部が封止され放熱手段２９に熱的に接続される第１中空状部材としての丸型ヒートパイプ２６と、第１中空状部材としての丸型ヒートパイプ２６の他方の端部に気密に接続される、内部に中空状の連通部を備えた第１コネクタ部２４と、第１コネクタ部２４と気密に接続可能な、対応する中空状の連通部を内部に備えた第２コネクタ部２３と、一方の端部が封止され被冷却物に熱的に接続される第２中空状部材としての丸型ヒートパイプ２５とからなっている。
第２の密閉容器は、一方の端部が封止され放熱手段２９に熱的に接続される第１中空状部材としての丸型ヒートパイプ３６と、第１中空状部材としての丸型ヒートパイプ３６の他方の端部に気密に接続される、内部に中空状の連通部を備えた第１コネクタ部３４と、第１コネクタ部３４と気密に接続可能な、対応する中空状の連通部を内部に備えた第２コネクタ部３３と、一方の端部が封止され被冷却物に熱的に接続される第２中空状部材としての丸型ヒートパイプ３５とからなっている。
２組のコネクタ、即ち、第１コネクタ部２４、第２コネクタ部２３、および、第１コネクタ部３４、第２コネクタ部３３は、同一回転軸の回りに回動可能である。第１コネクタ２４、３４または第２コネクタ２３、３３のうちのいずれか一方、例えば、第１コネクタ２４、３４を例えば放熱手段が配置されるディスプレイ側に固定することによって、図５に示したように、キーボード側、ディスプレイ側の開閉、および、所定の位置での維持が可能になる。第１コネクタ部と第２コネクタ部の間は、気密に接続され、所定の摺動抵抗で回動可能である。
図６に示す態様の流路可動型伝熱装置においては、回動可能なコネクタを含む第１の密閉容器、第２の密閉容器のそれぞれの内部において作動流体が相変化しながら熱移動する。即ち、被冷却物の熱によって、２本のヒートパイプ２５、３５内の作動液が蒸発し、第２コネクタ２３、３３、第１コネクタ２４、３４の中空状の連通部を通過して、ヒートパイプ２６、３６に移動し、放熱手段２９によって放熱して、再び液相に戻り、第１コネクタ２４、３４、第２コネクタ２３、３３の中空状の連通部を通過して、ヒートパイプ２５、３５に還流する。上述したように、第１コネクタ２４、３４、第２コネクタ２３、３３は、中空状の連通部からなっているので、気相、液相の作動流体の移動は容易であり、熱抵抗が極めて小さい。
図７は、この発明の流路可動型伝熱装置の他の１つの態様を説明する図である。この態様の流路可動型伝熱装置は、それぞれ上述した第１中空状部材、第１コネクタ部、第２中空状部材、前記第２コネクタによって形成される少なくとも２組の密閉容器を備えており、少なくとも２組の密閉容器のそれぞれの第１中空状部材が一体的に連通して接続され、それぞれの第２コネクタが、所定の位置に固定され、それぞれの第１コネクタが、対応する第２コネクタの軸線の回りに所定の摺動抵抗を備えて回転する、流路可動型伝熱装置である。
即ち、図７に示すように、図６に示した態様の２組の密閉容器が共通の第１中空状部材であるヒートパイプによって一体的に連通して接続されている。この態様の流路可動型伝熱装置においては、放熱手段５９に熱的に接続される第１中空状部材としての丸型ヒートパイプ４６の一方の端部が第１コネクタ４４に気密に接続され、他方の端部が第１コネクタ５４に気密に接続されている。第１中空状部材としての丸型ヒートパイプは、図７に示すように、放熱手段による効率的な放熱が可能なように、所定の形状に屈折されて、放熱手段に熱的に接続される。
上述した丸型ヒートパイプが気密に接続された、内部に中空状の連通部を備えた第１コネクタ４４、５４は、それぞれ、気密に且つ回動可能に、対応する中空状の連通部を内部に備えた第２コネクタ４３、５３に接続される。第２コネクタ４３、５３のそれぞれの端部が、一方の端部が封止され被冷却物に熱的に接続される第２中空状部材としての丸型ヒートパイプ４５、５５と気密に接続される。
２組のコネクタ、即ち、第１コネクタ４４、第２コネクタ４３、および、第１コネクタ５４、第２コネクタ５３は、同一回転軸の回りに回動可能である。第１コネクタ４４、５４または第２コネクタ４３、５３のうちのいずれか一方、例えば、第１コネクタ４４、５４を例えば放熱手段が配置されるディスプレイ側に固定することによって、図５に示したと同様に、キーボード側、ディスプレイ側の開閉、および、所定の位置での維持が可能になる。第１コネクタと第２コネクタの間は、気密に接続され、所定の摺動抵抗で回動可能である。
図７に示す態様の流路可動型伝熱装置においては、回動可能なコネクタを含む密閉容器の内部において作動流体が相変化しながら熱移動する。即ち、被冷却物６０の熱によって、２本のヒートパイプ４５、５５内の作動液が蒸発し、第２コネクタ４３、５３、第１コネクタ４４、５４の中空状の連通部を通過して、ヒートパイプ４６に移動し、放熱手段５９によって放熱して、再び液相に戻り、第１コネクタ４４、５４、第２コネクタ４３、５３の中空状の連通部を通過して、ヒートパイプ４５、５５に還流する。上述したように、第１コネクタ４４、５４、第２コネクタ４３、５３は、中空状の連通部からなっているので、気相、液相の作動流体の移動は容易であり、熱抵抗が極めて小さい。
図８は、この発明の流路可動型伝熱装置の他の１つの態様を説明する図である。
この態様の流路可動型伝熱装置は、それぞれ上述した第１中空状部材、第１コネクタ部、第２中空状部材、第２コネクタによって形成される２組の密閉容器が、それぞれの第１中空状部材が一体的に連通して接続され、それぞれの第２中空状部材が一体的に連通して接続されて閉ループを形成し、それぞれの第２コネクタが、所定の位置に固定され、それぞれの第１コネクタが、対応する第２コネクタの軸線の回りに所定の摺動抵抗を備えて回転する、流路可動型伝熱装置である。
即ち、図８に示すように、図６に示した態様の２組の密閉容器が共通の第１中空状部材であるヒートパイプによって一体的に連通して接続され、共通の第２中空状部材であるヒートパイプによって一体的に連通して接続されている。この態様の流路可動型伝熱装置においては、放熱手段６９に熱的に接続される第１中空状部材としての丸型ヒートパイプ６６の一方の端部が第１コネクタ６４に気密に接続され、他方の端部が第１コネクタ７４に気密に接続されている。第１中空状部材としての丸型ヒートパイプは、図８に示すように、放熱手段による効率的な放熱が可能なように、所定の形状に屈折されて、放熱手段に熱的に接続される。
上述した丸型ヒートパイプが気密に接続された、内部に中空状の連通部を備えた第１コネクタ６４、７４は、それぞれ、気密に且つ回動可能に、対応する中空状の連通部を内部に備えた第２コネクタ６３、７３に接続される。第２コネクタ６３には、第２中空状部材としての丸型ヒートパイプ６５の一方の端部が気密に接続され、第２コネクタ７３には、第２中空状部材としての丸型ヒートパイプ６５の他方の端部が気密に接続されている。第２中空状部材としての丸型ヒートパイプの彎曲部は、被冷却物７０に熱的に接続されている。
この態様の流路可動型伝熱装置においても、２組のコネクタ、即ち、第１コネクタ６４、第２コネクタ６３、および、第１コネクタ７４、第２コネクタ７３は、同一回転軸の回りに回動可能である。第１コネクタ６４、７４または第２コネクタ６３、７３のうちのいずれか一方、例えば、第１コネクタ６４、７４を例えば放熱手段が配置されるディスプレイ側に固定することによって、図５に示したと同様に、キーボード側、ディスプレイ側の開閉、および、所定の位置での維持が可能になる。第１コネクタと第２コネクタの間は、気密に接続され、所定の摺動抵抗で回動可能である。
図８に示す態様の流路可動型伝熱装置においては、回動可能なコネクタを含む密閉容器の内部において作動流体が相変化しながら熱移動する。即ち、被冷却物７０の熱によって、丸型ヒートパイプ６５内の作動液が蒸発し、第２コネクタ６３、７３、第１コネクタ６４、７４の中空状の連通部を通過して、ヒートパイプ６６に移動し、放熱手段６９によって放熱して、再び液相に戻り、第１コネクタ６４、７４、第２コネクタ６３、７３の中空状の連通部を通過して、ヒートパイプ６５に還流する。上述したように、第１コネクタ６４、７４、第２コネクタ６３、７３は、中空状の連通部からなっているので、気相、液相の作動流体の移動は容易であり、熱抵抗が極めて小さい。
図９は、この発明の流路可動型伝熱装置の他の１つの態様を説明する図である。この態様の流路可動型伝熱装置は、それぞれ上述した第１中空状部材、第１コネクタ部、第２中空状部材、前記第２コネクタによって形成される２組の密閉容器を備えており、２組の密閉容器のそれぞれの第１中空状部材が一体的に連通して接続され、それぞれの第２中空状部材に、更に流体循環装置が接続されて閉ループを形成し、それぞれの第２コネクタが、所定の位置に固定され、それぞれの第１コネクタが、対応する第２コネクタの軸線の回りに所定の摺動抵抗を備えて回転する、流路可動型伝熱装置である。
即ち、図９に示すように、図６に示した態様の２組の密閉容器が共通の第１中空状部材であるヒートパイプによって一体的に連通して接続され、第２中空部材であるヒートパイプの一方の端部に流体循環装置が接続されて、全体として閉ループを形成している。この態様の流路可動型伝熱装置においては、放熱手段９９に熱的に接続される第１中空状部材としての丸型ヒートパイプ９６の一方の端部が第１コネクタ８４に気密に接続され、他方の端部が第１コネクタ９４に気密に接続されている。
第１中空状部材としての丸型ヒートパイプは、図９に示すように、放熱手段による効率的な放熱が可能なように、所定の形状に屈折されて、放熱手段に熱的に接続される。上述した丸型ヒートパイプが気密に接続された、内部に中空状の連通部を備えた第１コネクタ８４、９４は、それぞれ、気密に且つ回動可能に、対応する中空状の連通部を内部に備えた第２コネクタ８３、９３に接続される。第２コネクタ８３、９３のそれぞれの端部が、一方の端部が流体循環装置に気密に接続され、被冷却物に熱的に接続される第２中空状部材としての丸型ヒートパイプ８５、９５と気密に接続される。
２組のコネクタ、即ち、第１コネクタ８４、第２コネクタ８３、および、第１コネクタ９４、第２コネクタ９３は、同一回転軸の回りに回動可能である。第１コネクタ８４、９４または第２コネクタ８３、９３のうちのいずれか一方、例えば、第１コネクタ８４、９４を例えば放熱手段が配置されるディスプレイ側に固定することによって、図５に示したと同様に、キーボード側、ディスプレイ側の開閉、および、所定の位置での維持が可能になる。第１コネクタと第２コネクタの間は、気密に接続され、所定の摺動抵抗で回動可能である。
流体循環装置は、例えば、流体駆動装置からなっており、一方から入った作動流体を他方から排出して閉ループ内を循環させる被冷却物および放熱手段が熱的に接続された中空状部材に連絡されて閉ループを形成し、封入された作動流体を閉ループ内に循環させるように駆動する。流体駆動装置は、例えば、作動流体吸引口および作動流体排出口を備えたピストン型ポンプからなっている。流体駆動装置は、内部ファンを備え、内部ファンによって作動流体を駆動するファンユニットからなっていてもよい。
更に、流体駆動装置は、外部から磁力によってファンを駆動させるタイプの内部ファンを備えていてもよい。即ち、内部ファンに磁性体を取り付け、そして、複数の電磁石外側に所定の間隔を置いて設け、所定の順に、電磁石に通電して内部ファンを誘導する。磁性流体からなる作動流体を使用し、外部駆動装置が磁場を用いてもよい。または、作動流体が誘電性流体からなっており、外部駆動装置が電場を用いている。即ち、外表面に複数の電磁石を配置して、所定の順に電磁石に通電し、通電を止めて、作動流体を強制的に循環させる。
図９に示す態様の流路可動型伝熱装置においては、回動可能なコネクタを含む密閉容器の内部において作動流体が相変化しながら熱移動する。即ち、被冷却物６０の熱によって、流体循環装置内の作動液が蒸発し、気相の作動流体が、第２コネクタ８３、第１コネクタ８４の中空状の連通部を通過して、ヒートパイプ９６に移動し、放熱手段９９によって放熱して、再び液相に戻り、第１コネクタ９４、第２コネクタ９３の中空状の連通部を通過して、流体循環装置内に還流する。上述したように、第１コネクタ８４、９４、第２コネクタ８３、９３は、中空状の連通部からなっているので、気相、液相の作動流体の移動は容易であり、熱抵抗が極めて小さい。
上述した閉ループ内に水を流し、循環させてもよい。パイプの材質および作動流体は特に限定されないが、例えば、銅−水、アルミニウム−シクロペンタン等の組合わせが考えられる。作動流体が臨界密度以上の充填密度（＝充填重量／密閉容器内容積）の二酸化炭素であってもよい。更に、作動流体が臨界密度以上の充填密度（＝充填重量／密閉容器内容積）で、且つ、伝熱装置作動時に臨界温度以上の温度になっている二酸化炭素であってもよい。
被冷却物としての電子部品および放熱板、放熱フィン等の放熱手段が、グリース、受熱ブロック、受熱板、ろう材、はんだ材等の適切な手段によって熱的に接続されている。
更に、この発明の流路可動型ヒートパイプの１つの態様は、放熱手段に熱的に接続される第１中空状部材と、
被冷却物に熱的に接続される第２中空状部材と、
前記第１中空状部材の他方の端部に気密に接続される、内部に中空状の連通部を備えた第１コネクタ部と、前記第２中空状部材の他方の端部に気密に接続され、前記第１コネクタ部と気密に接続可能な、対応する中空状の連通部を内部に備えた第２コネクタ部とからなる、軸線の回りに回動可能なコネクタと、
前記第１中空状部材、前記第１コネクタ部、前記第２コネクタ部、および、前記第２中空状部材によって形成される密閉容器内に封入される作動流体と、
前記密閉容器の前記第１コネクタ部および前記第２コネクタ部の前記連通部を貫通して、前記第１中空部材と前記第２中空部材を連絡する単体のウイック部材を備えた流路可動型ヒートパイプである。
上述したウイック部材の前記第１中空状部材側に位置する端部が、少なくとも前記第１コネクタ部と同じ高さ以上に位置していることが好ましい。更に、上述したウイック部材が帯状のメッシュからなっている。更に、上述したウイック部材が１本以上のワイヤからなっていてもよい。
図１０は、この発明の流路可動型ヒートパイプの１つの態様を説明する図である。図１０に示すように、この発明の流路可動型ヒートパイプは、放熱手段１９に熱的に接続される第１中空状部材１６と、被冷却物２０に熱的に接続される第２中空状部材１５と、第１中空状部材１６の他方の端部に気密に接続される、内部に中空状の連通部を備えた第１コネクタ部１４と、第２中空状部材１５の他方の端部に気密に接続され、第１コネクタ部１４と気密に接続可能な、対応する中空状の連通部を内部に備えた第２コネクタ部１３とからなる、軸線の回りに回動可能なコネクタと、第１中空状部材１６、第１コネクタ部１４、第２コネクタ部１３、および、第２中空状部材１５によって形成される密閉容器内に封入される作動流体と、密閉容器の第１コネクタ部１４および第２コネクタ部１３の連通部を貫通して、第１中空部材１６と第２中空部材１５を連絡する単体のウイック部材１１を備えている。
上述した密閉容器内の内部流路全域に、作動流体を内部に吸収可能なウイック材が挿入されている。第１および第２中空部材として例えば銅製のパイプを使用し、第１コネクタ部１４および第２コネクタ部１３として同様に銅製のパイプを使用し、作動流体として水を使用する。ウイック材として、例えば、酸化処理をされた銅製メッシュを用いる。
図１８にウイック材の態様を示す。図１８Ａに示すように、ウイック材を複数の帯状メッシュを重ねて形成する。または、図１８Ｂに示すように、ウイック材を、１枚の帯状メッシュを折り畳んで、上方に積層して形成してもよい。
更に、このようなウイック材を使用して、よりウイック効果を高めるために、中空状部材の内壁に溝を形成したり、中空状部材の内周面を酸化処理して、濡れ性を高めてもよい。
上述したように、この発明においては、第１中空部材、第２中空部材、第１コネクタ部、第２コネクタ部と独立した単体のウイック材を使用している。単体のウイック材は、一本でもよく複数本でもよい。いずれにしても、独立した単体のウイック材によって、第１コネクタ部１４および第２コネクタ部１３の連通部を貫通して、第１中空部材１６と第２中空部材１５を連絡する。このように独立したウイック材を使用することによって、２本のパイプの内壁面にグルーブを形成して、回転させる場合に、２本のパイプの接合面において作動液が雫状に停滞し、最悪の場合は作動流体の循環が完全にとまりヒートパイプ機能が停止するという従来の問題点（実願昭６２−１６０１７９参照）を解決することができる。
コネクタ内の濡れ性は高くないことが多いので、ウイック材の濡れ性を高めておくことは、流路可動型ではない通常のヒートパイプ以上に重要である。
図１１に示すように、冷却手段１９がコネクタ部１４、１３よりも常に上側に位置する場合は、途中までは作動流体は重力により停滞することなく移動することができる。好ましくは、図１０に示すように、全域にウイック材を挿入したほうがよいが、図１１のような状況では、図１２に示すように、重力による作動流体の移動が期待できないところ、即ち、少なくとも第１コネクタ部と同じ高さになる部分にはウイック材を挿入することが必要である。
図１３は、パソコンに取り付けられたこの発明の流路可動型ヒートパイプの１つの態様を示す図である。図１４は、図１３における流路可動型ヒートパイプのみを取り出して示す図である。図１３に示すように、コネクタ１４、１３は、ノートパソコンのディスプレイ１４０とキーボード１３０を繋ぐヒンジ部１４１と同軸に設置されている。第２中空部材１１５がＣＰＵ１２０と熱的に接続される。ＣＰＵと熱的に接続される部分では第２中空部材１１５を扁平化させてもよい。更に、第２中空部材１１５は、図に示すように、ノートパソコンのヒンジ部１４１とＣＰＵの高さの違いに応じて曲げ加工を施してもよい。ディスプレイ１４０背面にアルミニウム板などの放熱板１１９を設置し、第１中空部材１１６をアルミニウム放熱板の対角線上に配置するように、アルミニウム放熱板に接触させる。
上述したように配置することによって、比較的直接手で触れる可能性の高いディスプレイ端部の温度を上げずに、ディスプレイ中央部のみで放熱が可能になる。なお、第１中空部材１１６の一部を扁平化して放熱板との熱接触性を高めてもよい。ウイック材は、図１４に示すように、密閉容器内の全域に配置されている。
上述したように、ＣＰＵからの発熱をディスプレイ側に効率的に放熱することができる。
図１５は、パソコンに取り付けられたこの発明の流路可動型ヒートパイプの他の態様を示す図である。図１６は、図１５における流路可動型ヒートパイプのみを取り出して示す図である。図１５に示すように、コネクタ１４、１３は、ノートパソコンのディスプレイ１４０とキーボード１３０を繋ぐヒンジ部１４１と同軸に設置されている。第２中空部材１１５がＣＰＵ１２０と熱的に接続される。ＣＰＵと熱的に接続される部分では第２中空部材１１５を扁平化させてもよい。更に、第２中空部材１１５は、図に示すように、ノートパソコンのヒンジ部１４１とＣＰＵの高さの違いに応じて曲げ加工を施してもよい。ディスプレイ１４０背面にアルミニウム板などの放熱板１１９を設置し、第１中空部材１１６を蛇行するように曲げて、アルミニウム放熱板に接触させる。
上述したように配置することによって、ディスプレイの端部も放熱部分として使用できる環境では、より効率的な放熱が可能になる。なお、第１中空部材１１６の一部を扁平化して放熱板との熱接触性を高めてもよい。ウイック材は、図１６に示すように、密閉容器内の全域に配置されている。
図１７Ａに示すような、流路可動型ヒートパイプを、図１７Ｂに示すように第１中空部材１６を垂直に立て、コネクタ１４、１３および第２中空部材１５を水平に配置して、実験を行った。中空部材１６、１５として、外径φ６ｍｍで内部に溝が形成された銅製パイプを使用し、作動流体として水を使用した。ウイック材は、折り畳んで層状にメッシュが重なった図１８Ｂに示すような構造で、酸化処理を施して濡れ性を高めたあと還元処理を施して酸化物を除去したものを使用した。第１中空部材を自然空冷（＝放熱手段）した。その結果、ウイックを用いない場合は、８Ｗの熱量で３０ｍｍ分を加熱したところヒートパイプとして機能しなくなった（即ち、ヒートパイプ内の温度差が４０℃以上になった）。これに対して、ウイック材を挿入した場合は、２０Ｗの熱量で３０ｍｍ分を加熱したけれども、ヒートパイプ内の温度差１℃で正常に熱を輸送できることが確認できた。
コネクタとして、例えば、エアー配管、油圧ポンプの配管をつなぐコネクタとして知られているカプラ（商標名）を使用することができる。しかし、それに限定されることはなく、密閉性を維持しつつ、回動可能なコネクタであればよい。
ヒートパイプ内からの空気の排出、作動流体の注入は、ヒートパイプ端部から行なわれ、注入され、注入後、封止される。ただし、真空状態を必要とするヒートパイプ以外の伝熱装置を用いる場合は必ずしも空気を排出しなくてもよい。
放熱手段または被冷却物に中空状部材を熱接触させる際には、中空状部材を蛇行させて接触面積を増大しても良い。更に、複数流路を並列に配置して、接触面積を増大しても良い。接触抵抗を低減させるために、金属などの熱伝導性の部材を介して中空状部材と放熱手段、または、被冷却物が接触していても良い。
中空状部材はパイプに限定されず、内部に作動流体が通る流路があるものであれば良い。例えば、押しだし多穴管とか、切削加工やプレス加工等により流路形成部材を含む少なくとも一つ以上の部材を溶接またはろう付けにより接合したものであっても良い。
被冷却物および放熱手段はそれぞれ一つづつであるけれども、必要に応じて複数個設置しても良い。放熱手段として、ペルチェ素子、放熱フィン等を利用することができる。
なお、コネクタの装置内への接続は、固定部品を用いてもよく、接着材によって接合してもよい。
コネクタ部は、図示したようなヒートパイプと別部材に限定されることはなく、例えば、ヒートパイプの一方の端部を所定の形状に加工した一体型であってもよい。即ち、ヒートパイプの一方の端部がコネクタ機能を備える一体型の態様であってもよい。The hinge mechanism and the flow path movable heat transfer device of the present invention will be described with reference to the drawings.
One aspect of the hinge mechanism of the present invention is an airtightly connectable 1 provided with hollow communicating portions respectively corresponding to the inside thereof, one of which is fixed at a predetermined position and the other is rotatable around an axis. The hinge mechanism includes a set of connectors and a hollow member that is airtightly connected to each of the one set of connectors and communicates with the communication portion.
In the hinge mechanism according to the present invention, the hollow member is formed of a rod-shaped heat pipe, and the one of the pair of connectors is a first housing part (a keyboard part when a notebook computer is taken as an example) or a second housing part. It is fixed to (a display part when a notebook type personal computer is taken as an example), and controls opening and closing of the first casing part and the second casing part. Further, the one set of connectors rotates around an axis with a predetermined sliding resistance.
FIG. 1 is a view showing one embodiment of the hinge mechanism of the present invention. FIG. 1A shows the assembled hinge mechanism. FIG. 1B is an exploded view of the hinge mechanism. As shown in FIG. 1A, the hinge mechanism includes a hollow connector, for example, a first connector 3 having a hollow communication portion inside which is hermetically connected to one end of a round heat pipe 5, and a hollow shape. It consists of a second connector 4 having a hollow communication part inside which is airtightly connected to one end of a member, for example, a round heat pipe 6, and the first connector 3 and the second connector 4 are: It is pivotally and airtightly connected.
As shown in FIG. 1B, the first connector 3 having a hollow communication portion connected to one end portion of the round heat pipe 5 in an airtight manner and the one end portion of the round heat pipe 6 are airtight. The second connector 4 having a hollow communication portion inside is connected in a gastight manner so as to be rotatable. The hollow interior of the round heat pipe 5, the hollow communication portion of the first connector 3, the hollow interior of the round heat pipe 6, and the hollow communication portion of the second connector 4 communicate in an airtight manner. Has been.
Furthermore, as described above, the first connector 3 and the second connector 4 are connected in an airtight manner so as to be rotatable. Further, a pair of connectors including the first connector 3 and the second connector 4 described above has a predetermined sliding resistance and rotates around the axis. Therefore, by fixing the first connector or the second connector, the other connector rotates around the axis line with a predetermined sliding resistance, and thus can be used in various ways as a hinge mechanism.
FIG. 2 is a diagram illustrating an airtight connection state of the hinge mechanism. As shown in FIG. 2, the method of airtightly connecting one end portion of the round heat pipe 5 and the first connector 3 having a hollow communication portion therein is that the working fluid sealed inside is viscous. Even if it becomes a small gaseous state, it may be connected so as not to leak outside from the joint, and is not particularly limited. For example, a thread corresponding to the connection surface between one end of the round heat pipe 5 and the first connector 3 having a hollow communication portion inside is formed, and the end of the round heat pipe 5 is The first connector 3 may be screwed and fixed, or may be metallically joined by brazing.
The airtight connection between one end of the round heat pipe 6 and the second connector 4 having a hollow communication portion therein is performed by the same method as described above. In this way, one end of the round heat pipe 5 and the first connector 3 having a hollow communication portion inside are fixed and integrally formed, and one end of the round heat pipe 6 is formed. The end portion and the second connector 4 having a hollow communication portion inside are fixed and integrally formed.
In this way, the first connector 3 fixed to the heat pipe and the second connector 4 fixed to the heat pipe are rotatably and airtightly connected. That is, the first connector 3 and the second connector 4 are provided with extending portions 7 and 10 having predetermined lengths with different diameters, and the extending portion 10 is inserted into the extending portion 7. The extending portion 10 includes a cylindrical portion 8 and a distal end portion 9, and the end portion of the distal end portion 9 is formed to be larger than the diameter of the cylindrical portion 8 so that the connector can be locked. For example, an O-ring is provided at a predetermined position inside the extending portion 7 to facilitate airtight connection. In some cases, in order to improve airtightness, a plurality of portions where the extending portions 7 and 10 are in contact with each other may be provided, such as a plurality of O-rings. As a material for the ring, a material having low gas permeability is preferable. For example, butyl rubber, fluorine rubber, hydrin rubber, chlorosulfonated polyethylene, or the like may be used.
As described above, the first connector 3 fixed to the heat pipe and the second connector 4 fixed to the heat pipe are rotatably and hermetically connected. By fixing one of the pair of connectors including the first connector 3 and the second connector 4 of the hinge mechanism of the present invention described above to, for example, a keyboard portion or a display portion, the keyboard portion and the display portion are opened and closed in a predetermined manner. This can be done with sliding resistance.
FIG. 3 is a view for explaining one aspect of the flow path movable heat transfer device of the present invention. The flow path movable heat transfer device of this aspect includes a first hollow member that is sealed at one end and thermally connected to the heat radiating means, and is thermally sealed to the object to be cooled. A second hollow member connected to the first connector, a first connector portion that is hermetically connected to the other end of the first hollow member, and has a hollow communication portion therein, and a second hollow member The second connector portion is airtightly connected to the other end portion and is airtightly connectable with the first connector portion, and has a corresponding hollow communication portion therein, and the first connector or the second connector is predetermined. The other end is sealed in a sealed container formed by a connector that is rotatable about an axis, and a first hollow member, a first connector portion, a second hollow member, and a second connector. It is a flow path movable type heat transfer device provided with a working fluid.
As shown in FIG. 3, the flow path movable heat transfer device according to this aspect includes a first hollow member whose one end 17 is sealed and thermally connected to the heat radiating means 19, for example, a round heat pipe. 16 and a second hollow member whose one end 18 is sealed and thermally connected to the object 20 to be cooled, for example, a round heat pipe 15 and a round heat pipe 16 which is the first hollow member. The first connector portion 14 having a hollow communication portion therein and hermetically connected to the other end portion of the round heat pipe 15 that is the second hollow member, which is hermetically connected to the other end portion. The second connector portion 13 is internally provided with a corresponding hollow communication portion that can be airtightly connected to the first connector portion 14.
The first connector 14 or the second connector 13 is fixed at a predetermined position, and the other is rotatable around the axis, and the round heat pipe 16, which is the first hollow member described above, the first connector portion 14, A working fluid is sealed in a sealed container formed by the round heat pipe 15 and the second connector 13 which are the second hollow members.
Further, as shown in FIG. 3, the heat pipe may be refracted in a predetermined direction at a predetermined position so as to match a relative positional relationship with the heat dissipating means 19 and the object to be cooled 20.
4 and 5 are side views of the flow path movable heat transfer device of the present invention in the embodiment shown in FIG. In this aspect, the second connector 13 is fixed, and the first connector 14 is rotatable about the axial direction. FIG. 4 shows a state in which the first connector 14 and the second connector 13 are not rotating with respect to the heat pipe 16 and the heat pipe 15. That is, the object 15 to be cooled and the heat radiating means 19 are located on the same horizontal plane. FIG. 5 shows a state where the first connector 14 is rotating in the direction of the arrow with respect to the second connector 13. That is, the heat radiating means 19 and the heat pipe 16 form an angle θ with the object to be cooled 20 and the heat pipe 15. In the flow path movable heat transfer device of this aspect, for example, if the object to be cooled 20 is arranged on the keyboard side, the heat radiating means is arranged on the display side, and the second connector 13 is fixed on the display side, the conventional technique shows. It is possible to provide a hinge mechanism with a low thermal resistance for a personal computer that replaces the hinge mechanism.
The working fluid in the heat pipe 15 evaporates due to the heat of the object to be cooled, passes through the hollow communication portions of the second connector 13 and the first connector 14, moves to the heat pipe 16, and dissipates heat by the heat dissipation means. It returns to the liquid phase again, passes through the hollow communication portions of the first connector 14 and the second connector 13, and returns to the heat pipe 15. As described above, since the first connector 14 and the second connector 13 are formed of hollow communication portions, the movement of the gas-phase and liquid-phase working fluid is easy, and the thermal resistance is extremely small. Furthermore, the temperature of the portion connected to the connector can be kept low by appropriately selecting the material of the first connector 14 and the second connector 13, for example, by using a material having low thermal conductivity.
FIG. 6 is a diagram for explaining another embodiment of the flow path movable heat transfer device of the present invention. The flow path movable heat transfer device of this aspect includes two sets of sealed containers formed by the first hollow member, the first connector portion, the second hollow member, and the second connector, respectively. Each second connector of the pair of closed containers is fixed at a predetermined position, and each first connector rotates with a predetermined sliding resistance around the axis of the corresponding second connector. It is a mold heat transfer device.
That is, as shown in FIG. 6, two sets of sealed containers are provided. The first sealed container includes a round heat pipe 26 as a first hollow member sealed at one end and thermally connected to the heat radiating means 29, and a round heat pipe as a first hollow member. A first connector portion 24 having a hollow communication portion therein, which is airtightly connected to the other end portion of 26, and a corresponding hollow communication portion capable of being airtightly connected to the first connector portion 24. It consists of a second connector part 23 provided inside and a round heat pipe 25 as a second hollow member sealed at one end and thermally connected to the object to be cooled.
The second sealed container includes a round heat pipe 36 as a first hollow member that is sealed at one end and is thermally connected to the heat radiating means 29, and a round heat pipe as a first hollow member. A first connector portion 34 having a hollow communication portion therein, which is hermetically connected to the other end of 36, and a corresponding hollow communication portion which can be airtightly connected to the first connector portion 34. It consists of a second connector part 33 provided inside and a round heat pipe 35 as a second hollow member sealed at one end and thermally connected to the object to be cooled.
Two sets of connectors, that is, the first connector portion 24, the second connector portion 23, the first connector portion 34, and the second connector portion 33 are rotatable about the same rotation axis. As shown in FIG. 5, by fixing one of the first connectors 24 and 34 or the second connectors 23 and 33, for example, the first connectors 24 and 34, for example, to the display side where the heat dissipating means is arranged. In addition, it is possible to open and close the keyboard side and the display side, and maintain it at a predetermined position. The first connector portion and the second connector portion are hermetically connected and can be rotated with a predetermined sliding resistance.
In the flow path movable heat transfer device shown in FIG. 6, the working fluid undergoes heat transfer while changing phase in each of the first sealed container and the second sealed container including the rotatable connector. That is, the working fluid in the two heat pipes 25 and 35 evaporates due to the heat of the object to be cooled, passes through the hollow communication portions of the second connectors 23 and 33 and the first connectors 24 and 34, and is heated. It moves to the pipes 26, 36, dissipates heat by the heat dissipating means 29, returns to the liquid phase again, passes through the hollow communication portions of the first connectors 24, 34, the second connectors 23, 33, and the heat pipe 25, Reflux to 35. As described above, since the first connectors 24 and 34 and the second connectors 23 and 33 are formed of hollow communication portions, it is easy to move the working fluid in the gas phase and the liquid phase, and the thermal resistance is extremely high. small.
FIG. 7 is a diagram for explaining another embodiment of the flow path movable heat transfer device of the present invention. The flow path movable heat transfer device of this aspect includes at least two sets of sealed containers formed by the first hollow member, the first connector portion, the second hollow member, and the second connector, respectively. The first hollow members of the at least two sets of sealed containers are integrally connected and connected, the second connectors are fixed at predetermined positions, and the first connectors correspond to the corresponding second. This is a flow path movable heat transfer device that rotates with a predetermined sliding resistance around the axis of the connector.
That is, as shown in FIG. 7, two sets of sealed containers of the mode shown in FIG. 6 are integrally connected and connected by a heat pipe which is a common first hollow member. In the flow path movable heat transfer device of this aspect, one end of the round heat pipe 46 as the first hollow member thermally connected to the heat radiating means 59 is airtightly connected to the first connector 44. The other end is airtightly connected to the first connector 54. As shown in FIG. 7, the round heat pipe as the first hollow member is refracted into a predetermined shape and thermally connected to the heat radiating means so that the heat radiating means can efficiently radiate heat. .
Each of the first connectors 44 and 54 having the hollow communication portion therein, to which the above-described round heat pipe is connected in an airtight manner, has a corresponding hollow communication portion in the airtight and rotatable manner. Are connected to the second connectors 43 and 53 provided in the above. The respective end portions of the second connectors 43 and 53 are hermetically connected to round heat pipes 45 and 55 as second hollow members that are sealed at one end portion and thermally connected to the object to be cooled. The
Two sets of connectors, that is, the first connector 44, the second connector 43, the first connector 54, and the second connector 53 are rotatable about the same rotation axis. Similar to the one shown in FIG. 5 by fixing either the first connector 44 or 54 or the second connector 43 or 53, for example, the first connector 44 or 54 to the display side where the heat dissipating means is arranged, for example. In addition, it is possible to open and close the keyboard side and the display side, and maintain it at a predetermined position. The first connector and the second connector are hermetically connected and can be rotated with a predetermined sliding resistance.
In the flow path movable heat transfer device shown in FIG. 7, the working fluid is thermally transferred while changing phase in the closed container including the rotatable connector. That is, the working fluid in the two heat pipes 45 and 55 evaporates due to the heat of the object 60 to be cooled, passes through the hollow communication portions of the second connectors 43 and 53 and the first connectors 44 and 54, It moves to the heat pipe 46, dissipates heat by the heat dissipating means 59, returns to the liquid phase again, passes through the hollow communication portions of the first connectors 44 and 54, and the second connectors 43 and 53, and the heat pipes 45 and 55 To reflux. As described above, since the first connectors 44 and 54 and the second connectors 43 and 53 are formed of hollow communication portions, it is easy to move the working fluid in the gas phase and the liquid phase, and the thermal resistance is extremely high. small.
FIG. 8 is a diagram illustrating another embodiment of the flow path movable heat transfer device of the present invention.
The flow path movable heat transfer device of this aspect includes two sets of sealed containers formed by the first hollow member, the first connector portion, the second hollow member, and the second connector, respectively. The hollow members are integrally connected and connected, the respective second hollow members are integrally connected and connected to form a closed loop, and the respective second connectors are fixed in place, The first connector is a flow path movable heat transfer device that rotates with a predetermined sliding resistance around the axis of the corresponding second connector.
That is, as shown in FIG. 8, the two sets of closed containers of the embodiment shown in FIG. 6 are integrally connected by a heat pipe which is a common first hollow member, and the common second hollow member is connected. Are integrally connected by a heat pipe. In the flow path movable heat transfer device of this aspect, one end of the round heat pipe 66 as the first hollow member that is thermally connected to the heat radiating means 69 is hermetically connected to the first connector 64. The other end is hermetically connected to the first connector 74. As shown in FIG. 8, the round heat pipe as the first hollow member is refracted into a predetermined shape and thermally connected to the heat radiating means so that the heat radiating means can efficiently radiate heat. .
The first connectors 64 and 74 each having the hollow communication portion to which the above-described round heat pipe is connected in an airtight manner are airtight and turnable, respectively. Are connected to the second connectors 63 and 73 provided in the above. One end of a round heat pipe 65 as a second hollow member is connected to the second connector 63 in an airtight manner, and the second connector 73 has a round heat pipe 65 as a second hollow member. The other end is airtightly connected. A bent portion of a round heat pipe as the second hollow member is thermally connected to the object 70 to be cooled.
Also in the flow path movable heat transfer device of this aspect, the two sets of connectors, that is, the first connector 64, the second connector 63, the first connector 74, and the second connector 73 rotate around the same rotation axis. It is possible to move. Similar to the one shown in FIG. 5 by fixing either the first connector 64, 74 or the second connector 63, 73, for example, the first connector 64, 74 to the display side where the heat dissipating means is arranged, for example. In addition, it is possible to open and close the keyboard side and the display side, and maintain it at a predetermined position. The first connector and the second connector are hermetically connected and can be rotated with a predetermined sliding resistance.
In the flow path movable heat transfer device of the aspect shown in FIG. 8, the working fluid is thermally transferred while changing the phase inside the sealed container including the rotatable connector. That is, the working fluid in the round heat pipe 65 evaporates due to the heat of the object to be cooled 70, passes through the hollow communication portions of the second connectors 63 and 73 and the first connectors 64 and 74, and passes through the heat pipe 66. , The heat is dissipated by the heat dissipating means 69, returns to the liquid phase again, passes through the hollow communication portions of the first connectors 64 and 74 and the second connectors 63 and 73, and returns to the heat pipe 65. As described above, since the first connectors 64 and 74 and the second connectors 63 and 73 are formed of hollow communication portions, it is easy to move the working fluid in the gas phase and the liquid phase, and the thermal resistance is extremely high. small.
FIG. 9 is a diagram for explaining another embodiment of the flow path movable heat transfer device of the present invention. The flow path movable heat transfer device of this aspect includes two sets of sealed containers formed by the first hollow member, the first connector portion, the second hollow member, and the second connector described above, The first hollow members of the two sets of sealed containers are integrally connected to each other, and a fluid circulation device is further connected to each of the second hollow members to form a closed loop. Is a flow path movable heat transfer device that is fixed at a predetermined position and each first connector rotates with a predetermined sliding resistance around the axis of the corresponding second connector.
That is, as shown in FIG. 9, two sets of sealed containers of the embodiment shown in FIG. 6 are integrally connected by a heat pipe which is a common first hollow member, and a heat which is a second hollow member. A fluid circulation device is connected to one end of the pipe to form a closed loop as a whole. In the flow path movable heat transfer device of this aspect, one end of the round heat pipe 96 as the first hollow member thermally connected to the heat radiating means 99 is airtightly connected to the first connector 84. The other end is airtightly connected to the first connector 94.
As shown in FIG. 9, the round heat pipe as the first hollow member is refracted into a predetermined shape and thermally connected to the heat radiating means so that the heat radiating means can efficiently radiate heat. . Each of the first connectors 84 and 94 having the hollow communication portions to which the round heat pipes described above are connected in an airtight manner is airtight and rotatable, respectively. Are connected to the second connectors 83 and 93 provided in the above. A round heat pipe 85 as a second hollow member in which each end portion of the second connectors 83 and 93 is hermetically connected to the fluid circulation device and one end portion is thermally connected to the object to be cooled. 95 is connected in an airtight manner.
The two sets of connectors, that is, the first connector 84, the second connector 83, the first connector 94, and the second connector 93 are rotatable about the same rotation axis. Similar to the one shown in FIG. 5 by fixing either the first connector 84 or 94 or the second connector 83 or 93, for example, the first connector 84 or 94 to the display side where the heat dissipating means is arranged, for example. In addition, it is possible to open and close the keyboard side and the display side, and maintain it at a predetermined position. The first connector and the second connector are hermetically connected and can be rotated with a predetermined sliding resistance.
The fluid circulation device is composed of, for example, a fluid drive device, and communicates with an object to be cooled that circulates in the closed loop by discharging the working fluid entering from one side and the hollow member to which the heat radiation means is thermally connected. Then, a closed loop is formed, and the enclosed working fluid is driven to circulate in the closed loop. The fluid drive device is composed of, for example, a piston type pump provided with a working fluid suction port and a working fluid discharge port. The fluid drive device may include a fan unit that includes an internal fan and drives the working fluid by the internal fan.
Furthermore, the fluid drive device may include an internal fan of a type that drives the fan by a magnetic force from the outside. That is, a magnetic body is attached to the internal fan, and provided outside the plurality of electromagnets with a predetermined interval, and the electromagnet is energized to guide the internal fan in a predetermined order. A working fluid made of a magnetic fluid may be used, and the external driving device may use a magnetic field. Alternatively, the working fluid is made of a dielectric fluid, and the external driving device uses an electric field. That is, a plurality of electromagnets are arranged on the outer surface, the electromagnets are energized in a predetermined order, the energization is stopped, and the working fluid is forcibly circulated.
In the flow path movable heat transfer device of the aspect shown in FIG. 9, the working fluid is thermally transferred while undergoing a phase change inside a closed container including a rotatable connector. That is, the working fluid in the fluid circulation device evaporates due to the heat of the object to be cooled 60, and the gas-phase working fluid passes through the hollow communication portions of the second connector 83 and the first connector 84, and the heat pipe It moves to 96, dissipates heat by the heat dissipating means 99, returns to the liquid phase again, passes through the hollow communication portions of the first connector 94 and the second connector 93, and returns to the fluid circulation device. As described above, since the first connectors 84 and 94 and the second connectors 83 and 93 are formed of hollow communication portions, the movement of the gas-phase and liquid-phase working fluid is easy and the thermal resistance is extremely high. small.
Water may be circulated and circulated in the closed loop described above. The material of the pipe and the working fluid are not particularly limited. For example, a combination of copper-water, aluminum-cyclopentane, or the like is conceivable. The working fluid may be carbon dioxide having a filling density equal to or higher than the critical density (= filling weight / volume in the closed container). Further, the working fluid may be carbon dioxide having a filling density equal to or higher than the critical density (= filled weight / volume in the closed container) and a temperature equal to or higher than the critical temperature when the heat transfer device is operated.
An electronic component as a cooled object and a heat radiating means such as a heat radiating plate and a heat radiating fin are thermally connected by appropriate means such as grease, a heat receiving block, a heat receiving plate, a brazing material, and a solder material.
Furthermore, one aspect of the flow path movable heat pipe of the present invention includes a first hollow member that is thermally connected to the heat dissipation means,
A second hollow member thermally connected to the object to be cooled;
A first connector portion having a hollow communication portion therein, which is airtightly connected to the other end portion of the first hollow member, and an airtight connection to the other end portion of the second hollow member. A connector that can be connected airtightly to the first connector portion, and a second connector portion having a corresponding hollow communication portion therein, and a connector that is rotatable about an axis,
A working fluid sealed in an airtight container formed by the first hollow member, the first connector portion, the second connector portion, and the second hollow member;
Flow path movable heat provided with a single wick member that passes through the communicating portion of the first connector portion and the second connector portion of the sealed container and connects the first hollow member and the second hollow member. It is a pipe.
It is preferable that the edge part located in the said 1st hollow member side of the wick member mentioned above is located at least more than the same height as the said 1st connector part. Furthermore, the wick member mentioned above consists of a strip-shaped mesh. Furthermore, the wick member mentioned above may consist of one or more wires.
FIG. 10 is a view for explaining one aspect of the flow path movable heat pipe of the present invention. As shown in FIG. 10, the flow path movable heat pipe of the present invention includes a first hollow member 16 that is thermally connected to the heat radiating means 19 and a second hollow that is thermally connected to the object to be cooled 20. Member 15, the first connector part 14 having a hollow communication part therein, which is hermetically connected to the other end part of the first hollow member 16, and the other end of the second hollow member 15 A connector that is airtightly connected to the first portion and that can be airtightly connected to the first connector portion 14 and includes a second connector portion 13 provided therein with a corresponding hollow communication portion; , The first hollow member 16, the first connector part 14, the second connector part 13, the working fluid sealed in the sealed container formed by the second hollow member 15, and the first connector part of the sealed container 14 and the communication part of the second connector part 13, the first hollow part 16 and has a single wick member 11 to contact the second hollow member 15.
A wick material capable of absorbing the working fluid is inserted in the entire internal flow path in the above-described sealed container. For example, copper pipes are used as the first and second hollow members, copper pipes are similarly used as the first connector part 14 and the second connector part 13, and water is used as the working fluid. As the wick material, for example, an oxidized copper mesh is used.
FIG. 18 shows an aspect of the wick material. As shown in FIG. 18A, a wick material is formed by overlapping a plurality of belt-like meshes. Alternatively, as shown in FIG. 18B, the wick material may be formed by folding a single belt-like mesh and laminating it upward.
Furthermore, in order to further increase the wicking effect using such a wick material, grooves are formed on the inner wall of the hollow member, or the inner peripheral surface of the hollow member is oxidized to improve wettability. Also good.
As described above, in the present invention, a single wick material independent of the first hollow member, the second hollow member, the first connector portion, and the second connector portion is used. The single wick material may be one or more. In any case, the first hollow member 16 and the second hollow member 15 are connected to each other through the communication portion of the first connector portion 14 and the second connector portion 13 by an independent single wick material. By using the independent wick material in this way, when the groove is formed on the inner wall surface of the two pipes and rotated, the working fluid stagnates at the joint surface of the two pipes in the worst case. In this case, the conventional problem (see Japanese Patent Application No. 62-160179) that the circulation of the working fluid is completely stopped and the heat pipe function is stopped can be solved.
Since the wettability in the connector is often not high, it is more important to improve the wettability of the wick material than a normal heat pipe that is not a flow path movable type.
As shown in FIG. 11, when the cooling means 19 is always located above the connector parts 14 and 13, the working fluid can move without stagnation due to gravity until halfway. Preferably, as shown in FIG. 10, it is better to insert a wick material in the entire area, but in the situation as shown in FIG. 11, as shown in FIG. 12, the movement of the working fluid due to gravity cannot be expected, that is, at least It is necessary to insert a wick material into the same height as the first connector portion.
FIG. 13 is a view showing one aspect of the flow path movable heat pipe of the present invention attached to a personal computer. FIG. 14 is a view showing only the flow path movable heat pipe in FIG. As shown in FIG. 13, the connectors 14 and 13 are installed coaxially with a hinge part 141 that connects the display 140 and the keyboard 130 of the notebook computer. The second hollow member 115 is thermally connected to the CPU 120. The second hollow member 115 may be flattened at a portion that is thermally connected to the CPU. Further, as shown in the drawing, the second hollow member 115 may be bent according to the difference in height between the hinge portion 141 of the notebook computer and the CPU. A heat radiating plate 119 such as an aluminum plate is installed on the back of the display 140, and the first hollow member 116 is brought into contact with the aluminum heat radiating plate so as to be disposed on a diagonal line of the aluminum heat radiating plate.
By arranging as described above, it is possible to dissipate heat only at the center of the display without increasing the temperature of the display end that is relatively likely to be touched by hand. A part of the first hollow member 116 may be flattened to improve the thermal contact with the heat sink. As shown in FIG. 14, the wick material is disposed in the entire area in the sealed container.
As described above, the heat generated from the CPU can be efficiently radiated to the display side.
FIG. 15 is a view showing another aspect of the flow path movable heat pipe of the present invention attached to a personal computer. FIG. 16 is a view showing only the flow path movable heat pipe in FIG. As shown in FIG. 15, the connectors 14 and 13 are installed coaxially with the hinge portion 141 that connects the display 140 and the keyboard 130 of the notebook computer. The second hollow member 115 is thermally connected to the CPU 120. The second hollow member 115 may be flattened at a portion that is thermally connected to the CPU. Further, as shown in the drawing, the second hollow member 115 may be bent according to the difference in height between the hinge portion 141 of the notebook computer and the CPU. A heat radiating plate 119 such as an aluminum plate is installed on the back surface of the display 140, and the first hollow member 116 is bent so as to meander and is brought into contact with the aluminum heat radiating plate.
By arranging as described above, more efficient heat dissipation is possible in an environment where the end of the display can also be used as a heat dissipation portion. A part of the first hollow member 116 may be flattened to improve the thermal contact with the heat sink. As shown in FIG. 16, the wick material is disposed in the entire area in the sealed container.
The flow path movable heat pipe as shown in FIG. 17A, the first hollow member 16 standing upright as shown in FIG. 17B, the connectors 14, 13 and the second hollow member 15 arranged horizontally, the experiment was conducted. went. As the hollow members 16 and 15, copper pipes having an outer diameter of φ6 mm and grooves formed therein were used, and water was used as a working fluid. The wick material used was a structure as shown in FIG. 18B in which the mesh was folded and layered, and the oxide was removed to improve the wettability and reduce the oxide. The first hollow member was naturally air-cooled (= heat dissipation means). As a result, when a wick was not used, when it was heated for 30 mm with a heat amount of 8 W, it did not function as a heat pipe (that is, the temperature difference in the heat pipe became 40 ° C. or more). On the other hand, when the wick material was inserted, the heat amount of 20 W was heated for 30 mm, but it was confirmed that the heat could be normally transported at a temperature difference of 1 ° C. in the heat pipe.
As the connector, for example, a coupler (trade name) known as a connector for connecting an air pipe and a hydraulic pump pipe can be used. However, the present invention is not limited to this, and any connector that can rotate while maintaining hermeticity may be used.
The air is discharged from the heat pipe and the working fluid is injected from the end of the heat pipe, injected, and sealed after the injection. However, when a heat transfer device other than a heat pipe that requires a vacuum state is used, the air does not necessarily have to be discharged.
When the hollow member is brought into thermal contact with the heat dissipating means or the object to be cooled, the hollow member may be meandered to increase the contact area. Further, a plurality of flow paths may be arranged in parallel to increase the contact area. In order to reduce the contact resistance, the hollow member and the heat radiating means or the object to be cooled may be in contact with each other through a thermally conductive member such as metal.
The hollow member is not limited to a pipe, and any hollow member may be used as long as it has a flow path through which a working fluid passes. For example, it may be an extruded multi-hole tube, or at least one member including a flow path forming member joined by welding or brazing by cutting or pressing.
Although the object to be cooled and the heat radiating means are each one, a plurality of objects may be installed as necessary. As the heat dissipation means, a Peltier element, a heat dissipation fin, or the like can be used.
Note that the connection of the connector into the apparatus may use a fixed component or may be joined by an adhesive.
The connector portion is not limited to a member different from the heat pipe as shown in the figure, and may be an integrated type in which one end of the heat pipe is processed into a predetermined shape, for example. That is, an integrated mode in which one end of the heat pipe has a connector function may be used.

この発明によると、ヒートパイプと回動可能な中空のコネクタを気密に接続し、コネクタの一部を固定し、他の部分を所定の摺動抵抗を備えて回転させることによって、熱抵抗の小さいヒンジ機構を提供することができる。更に、上述したヒンジ機構を用いることによって、熱抵抗の小さい流路可動型伝熱装置を提供することができる。更に、第１および第２コネクタ部の連通部を貫通して、第１中空部材と第２中空部材を連絡する単体のウイック部材を使用することによって、コネクタ部に作動液が雫状のまま滞留することが防止でき、熱抵抗の小さい流路可動型ヒートパイプを提供することができる。 According to the present invention, the heat pipe and the rotatable hollow connector are connected in an airtight manner, a part of the connector is fixed, and the other part is rotated with a predetermined sliding resistance, thereby reducing the thermal resistance. A hinge mechanism can be provided. Furthermore, by using the above-described hinge mechanism, it is possible to provide a flow path movable heat transfer device with low thermal resistance. Furthermore, by using a single wick member that passes through the communication portion of the first and second connector portions and connects the first hollow member and the second hollow member, the working fluid stays in a bowl shape in the connector portion. It is possible to provide a flow path movable heat pipe having a low thermal resistance.

Claims

Each of the connector parts has a hollow communication part corresponding to the inside, one of which is fixed at a predetermined position and the other of which is pivotable about an axis, and an airtightly connectable connector part. A hinge mechanism comprising a hollow member that is connected and communicates with the communication portion.

The hollow member is formed of a heat pipe, the one of the connector portions is fixed to the first housing portion or the second housing portion, and controls opening and closing of the first housing portion and the second housing portion; The hinge mechanism according to claim 1.

The hinge mechanism according to claim 2, wherein the connector portion has a predetermined sliding resistance and rotates about an axis.

A first hollow member thermally connected to the heat dissipation means;
A second hollow member thermally connected to the object to be cooled;
A first connector portion having a hollow communication portion therein, which is airtightly connected to the other end portion of the first hollow member, and an airtight connection to the other end portion of the second hollow member. A second connector part having a corresponding hollow communication part that can be hermetically connected to the first connector part, and a connector part that is rotatable about an axis,
A flow path movable heat transfer device comprising: the first hollow member, the first connector portion, the second hollow member, and a working fluid sealed in a sealed container formed by the second connector portion.

The flow path movable according to claim 4, wherein the closed container formed by the first hollow member, the first connector portion, the second hollow member, and the second connector forms a closed loop. Mold heat transfer device.

Each of the first hollow member, the first connector part, the second hollow member, and a sealed container formed by the second connector part, each of the second connector parts of the sealed container, The flow according to claim 4, wherein each of the first connector portions is fixed at a predetermined position, and each of the first connector portions rotates with a predetermined sliding resistance around an axis of the corresponding second connector portion. Road movable heat transfer device.

At least two sets of sealed containers formed by the first hollow member, the first connector part, the second hollow member, and the second connector part, and each of the at least two sets of sealed containers The first hollow members are integrally connected and connected, and each of the first connector portions rotates with a predetermined sliding resistance around an axis of the corresponding second connector portion. The flow path movable heat transfer device according to the fourth item in the range.

At least two sets of sealed containers formed by the first hollow member, the first connector portion, the second hollow member, and the second connector, and each of the at least two sets of sealed containers. One hollow member is integrally connected and connected, and each second hollow member is integrally connected and connected to form a closed loop, and each second connector portion is fixed at a predetermined position. The flow path movable heat transfer according to claim 4, wherein each of the first connector portions rotates with a predetermined sliding resistance around an axis of the corresponding second connector portion. apparatus.

The flow path movable heat transfer device according to claim 8, wherein a fluid circulation device is further connected to each of the second hollow members forming the closed loop.

The flow path movable heat transfer according to any one of claims 4 to 9, wherein the working fluid is carbon dioxide having a filling density equal to or higher than a critical density (= filling weight / closed vessel internal volume). apparatus.

6. The working fluid according to claim 5, wherein the working fluid is carbon dioxide having a filling density equal to or higher than the critical density (= filling weight / volume in the closed container) and a temperature equal to or higher than the critical temperature when the heat transfer device is operated. The flow path movable heat transfer device according to any one of Items 8 and 9.

The flow path movable heat transfer device according to any one of claims 4 to 9, wherein the working fluid is water.

A first hollow member thermally connected to the heat dissipation means;
A second hollow member thermally connected to the object to be cooled;
A first connector portion having a hollow communication portion therein, which is airtightly connected to the other end portion of the first hollow member, and an airtight connection to the other end portion of the second hollow member. A connector that can be connected airtightly to the first connector portion, and a second connector portion having a corresponding hollow communication portion therein, and a connector that is rotatable about an axis,
A flow path movable heat pipe comprising: the first hollow member, the first connector portion, the second connector portion, and a working fluid sealed in a sealed container formed by the second hollow member. .

The wick member further comprising a single wick member that passes through the communication portion of the first connector portion and the second connector portion of the sealed container and connects the first hollow member and the second hollow member. 14. The flow path movable heat pipe according to item 13.

14. The flow path movable heat pipe according to claim 13, wherein an end portion of the wick member positioned on the first hollow member side is positioned at least at the same height as the first connector portion. .

The flow path movable heat pipe according to claim 14, wherein the wick member is made of a band-shaped mesh.

The flow path movable heat pipe according to claim 14, wherein the wick member is made of one or more wires.

The flow path movable heat pipe according to any one of claims 14 to 17, wherein the liquefied working fluid wets the wick member in a film shape.

An electronic device comprising the flow path movable heat pipe according to any one of claims 1 to 18.

A notebook computer comprising the flow path movable heat pipe according to any one of claims 1 to 18.

A mobile phone comprising the flow path movable heat pipe according to any one of claims 1 to 18.