JPS649711B2 - - Google Patents
Info
- Publication number
- JPS649711B2 JPS649711B2 JP58047354A JP4735483A JPS649711B2 JP S649711 B2 JPS649711 B2 JP S649711B2 JP 58047354 A JP58047354 A JP 58047354A JP 4735483 A JP4735483 A JP 4735483A JP S649711 B2 JPS649711 B2 JP S649711B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- anode
- terminal
- terminals
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 97
- 239000011248 coating agent Substances 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 239000007788 liquid Substances 0.000 claims description 12
- 239000010953 base metal Substances 0.000 claims description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 239000003792 electrolyte Substances 0.000 description 36
- 239000000523 sample Substances 0.000 description 13
- 150000002500 ions Chemical class 0.000 description 9
- 229910000510 noble metal Inorganic materials 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000000873 masking effect Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- SFOSJWNBROHOFJ-UHFFFAOYSA-N cobalt gold Chemical compound [Co].[Au] SFOSJWNBROHOFJ-UHFFFAOYSA-N 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 239000010970 precious metal Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229910000923 precious metal alloy Inorganic materials 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/361,956 US4384926A (en) | 1982-03-25 | 1982-03-25 | Plating interior surfaces of electrical terminals |
| US361956 | 1982-03-25 | ||
| US458005 | 1983-01-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58175277A JPS58175277A (ja) | 1983-10-14 |
| JPS649711B2 true JPS649711B2 (enExample) | 1989-02-20 |
Family
ID=23424094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58047354A Granted JPS58175277A (ja) | 1982-03-25 | 1983-03-23 | 内面をめつきした電気端子とその選択めつき装置および方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4384926A (enExample) |
| JP (1) | JPS58175277A (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4427498A (en) | 1982-03-25 | 1984-01-24 | Amp Incorporated | Selective plating interior surfaces of electrical terminals |
| US4473445A (en) * | 1983-12-22 | 1984-09-25 | Amp Incorporated | Selectively plating interior surfaces of loose piece electrical terminals |
| US4555321A (en) * | 1984-06-08 | 1985-11-26 | Amp Incorporated | Selective plating apparatus |
| JPS6369996A (ja) * | 1986-09-10 | 1988-03-30 | Yazaki Corp | 雌端子電気接触部のめつき方法 |
| US4687555A (en) * | 1986-11-10 | 1987-08-18 | Amp Incorporated | Apparatus for selectively plating electrical terminals |
| US4687562A (en) * | 1986-12-23 | 1987-08-18 | Amp Incorporated | Anode assembly for selectively plating electrical terminals |
| US4690747A (en) * | 1986-12-23 | 1987-09-01 | Amp Incorporated | Selective plating apparatus |
| GB8719816D0 (en) * | 1987-08-21 | 1987-09-30 | Sb Plating Ltd | Electro-plating techniques |
| US4931150A (en) * | 1988-03-28 | 1990-06-05 | Sifco Industries, Inc. | Selective electroplating apparatus and method of using same |
| US4853099A (en) * | 1988-03-28 | 1989-08-01 | Sifco Industries, Inc. | Selective electroplating apparatus |
| US5002649A (en) * | 1988-03-28 | 1991-03-26 | Sifco Industries, Inc. | Selective stripping apparatus |
| US4904364A (en) * | 1988-11-23 | 1990-02-27 | Amp Incorporated | Anode assembly for selectively plating interior surfaces of electrical terminals |
| US4911813A (en) * | 1988-11-23 | 1990-03-27 | Amp Incorporated | Apparatus for selectively plating interior surfaces of electrical terminals |
| US20070092591A1 (en) * | 2005-10-24 | 2007-04-26 | Cyberonics, Inc. | Vacuum mandrel for use in fabricating an implantable electrode |
| US8509914B2 (en) * | 2005-10-28 | 2013-08-13 | Cyberonics, Inc. | Insert for implantable electrode |
| US7467016B2 (en) * | 2006-01-27 | 2008-12-16 | Cyberonics, Inc. | Multipolar stimulation electrode with mating structures for gripping targeted tissue |
| US8180462B2 (en) * | 2006-04-18 | 2012-05-15 | Cyberonics, Inc. | Heat dissipation for a lead assembly |
| US8478420B2 (en) * | 2006-07-12 | 2013-07-02 | Cyberonics, Inc. | Implantable medical device charge balance assessment |
| US20080027524A1 (en) * | 2006-07-26 | 2008-01-31 | Maschino Steven E | Multi-electrode assembly for an implantable medical device |
| US7974707B2 (en) * | 2007-01-26 | 2011-07-05 | Cyberonics, Inc. | Electrode assembly with fibers for a medical device |
| US7794254B2 (en) | 2007-04-30 | 2010-09-14 | Tronic Limited | Submersible electrical connector |
| US7818069B2 (en) * | 2007-07-27 | 2010-10-19 | Cyberonics, Inc. | Ribbon electrode |
| US8868203B2 (en) * | 2007-10-26 | 2014-10-21 | Cyberonics, Inc. | Dynamic lead condition detection for an implantable medical device |
| US8942798B2 (en) * | 2007-10-26 | 2015-01-27 | Cyberonics, Inc. | Alternative operation mode for an implantable medical device based upon lead condition |
| JP5260971B2 (ja) * | 2008-01-18 | 2013-08-14 | 古河電気工業株式会社 | 部分めっき装置及び部分めっき方法 |
| US8551301B2 (en) * | 2008-10-08 | 2013-10-08 | Tyco Electronics Corporation | Electroplating system with electroplating wheel |
| US8478428B2 (en) | 2010-04-23 | 2013-07-02 | Cyberonics, Inc. | Helical electrode for nerve stimulation |
| JP6215681B2 (ja) * | 2013-12-12 | 2017-10-18 | 矢崎総業株式会社 | 端子の製造方法及び端子 |
| US10704156B2 (en) * | 2015-12-17 | 2020-07-07 | Texas Instruments Incorporated | Method and system for electroplating a MEMS device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2448117A (en) * | 1942-08-05 | 1948-08-31 | Continental Can Co | Electrolytic can treating machine |
| US2503863A (en) * | 1943-11-18 | 1950-04-11 | Siegfried G Bart | Apparatus for electroplating the inside of pipes |
| US2477808A (en) * | 1946-05-08 | 1949-08-02 | Carl G Jones | Electrolytic apparatus for treatment of moving strip |
| US3410781A (en) * | 1964-11-27 | 1968-11-12 | Ex Cell O Corp | Electrochemical machining apparatus for internal surface deburring |
| US3951761A (en) * | 1975-01-31 | 1976-04-20 | Bunker Ramo Corporation | Method and apparatus for electro-plating strip contacts |
| US4340449A (en) * | 1977-10-11 | 1982-07-20 | Texas Instruments Incorporated | Method for selectively electroplating portions of articles |
-
1982
- 1982-03-25 US US06/361,956 patent/US4384926A/en not_active Expired - Lifetime
-
1983
- 1983-03-23 JP JP58047354A patent/JPS58175277A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58175277A (ja) | 1983-10-14 |
| US4384926A (en) | 1983-05-24 |
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| JPS649711B2 (enExample) | ||
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