JPS648731U - - Google Patents

Info

Publication number
JPS648731U
JPS648731U JP10281587U JP10281587U JPS648731U JP S648731 U JPS648731 U JP S648731U JP 10281587 U JP10281587 U JP 10281587U JP 10281587 U JP10281587 U JP 10281587U JP S648731 U JPS648731 U JP S648731U
Authority
JP
Japan
Prior art keywords
collet
storage section
resin
resin storage
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10281587U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10281587U priority Critical patent/JPS648731U/ja
Publication of JPS648731U publication Critical patent/JPS648731U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors
JP10281587U 1987-07-02 1987-07-02 Pending JPS648731U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10281587U JPS648731U (zh) 1987-07-02 1987-07-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10281587U JPS648731U (zh) 1987-07-02 1987-07-02

Publications (1)

Publication Number Publication Date
JPS648731U true JPS648731U (zh) 1989-01-18

Family

ID=31333070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10281587U Pending JPS648731U (zh) 1987-07-02 1987-07-02

Country Status (1)

Country Link
JP (1) JPS648731U (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8692838B2 (en) 2004-11-24 2014-04-08 Qualcomm Incorporated Methods and systems for updating a buffer
US8692839B2 (en) 2005-11-23 2014-04-08 Qualcomm Incorporated Methods and systems for updating a buffer
US8694663B2 (en) 2001-09-06 2014-04-08 Qualcomm Incorporated System for transferring digital data at a high rate between a host and a client over a communication path for presentation to a user
US8694652B2 (en) 2003-10-15 2014-04-08 Qualcomm Incorporated Method, system and computer program for adding a field to a client capability packet sent from a client to a host
US8873584B2 (en) 2004-11-24 2014-10-28 Qualcomm Incorporated Digital data interface device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8694663B2 (en) 2001-09-06 2014-04-08 Qualcomm Incorporated System for transferring digital data at a high rate between a host and a client over a communication path for presentation to a user
US8694652B2 (en) 2003-10-15 2014-04-08 Qualcomm Incorporated Method, system and computer program for adding a field to a client capability packet sent from a client to a host
US8692838B2 (en) 2004-11-24 2014-04-08 Qualcomm Incorporated Methods and systems for updating a buffer
US8873584B2 (en) 2004-11-24 2014-10-28 Qualcomm Incorporated Digital data interface device
US8692839B2 (en) 2005-11-23 2014-04-08 Qualcomm Incorporated Methods and systems for updating a buffer

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