JPS6487211A - Processing method for single crystal - Google Patents

Processing method for single crystal

Info

Publication number
JPS6487211A
JPS6487211A JP24540187A JP24540187A JPS6487211A JP S6487211 A JPS6487211 A JP S6487211A JP 24540187 A JP24540187 A JP 24540187A JP 24540187 A JP24540187 A JP 24540187A JP S6487211 A JPS6487211 A JP S6487211A
Authority
JP
Japan
Prior art keywords
single crystal
bonding material
processing
gypsum
processing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24540187A
Other languages
Japanese (ja)
Inventor
Yuji Inoue
Yasuhiro Shirakawa
Tadao Komi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP24540187A priority Critical patent/JPS6487211A/en
Publication of JPS6487211A publication Critical patent/JPS6487211A/en
Pending legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To achieve a slicing process of high yield without generating cleavage crackings by using gypsum as a bonding material in the single crystal processing method of fixing the single crystal with cleavages to a processing jig and carrying out the processing. CONSTITUTION:Gypsum 1 of CaSO4.1/2 H2O is used as bonding material in the single crystal processing method of fixing a single crystal 5 with cleavages to a processing jib 2 by a bonding material. Also, gypsum is reinforced with glass plates 3 and 4. As the gypsum 1 is used as bonding material, heating cycle to the single crystal 5 at the time of bonding is not generated, and distortion of bonding section caused by a solvent when a room temperature cured bonding material is peeled off is not generated, either. Cleavage crackings, therefore, are not generated, and the handling after processing is made simple to increase yield remarkably.
JP24540187A 1987-09-29 1987-09-29 Processing method for single crystal Pending JPS6487211A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24540187A JPS6487211A (en) 1987-09-29 1987-09-29 Processing method for single crystal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24540187A JPS6487211A (en) 1987-09-29 1987-09-29 Processing method for single crystal

Publications (1)

Publication Number Publication Date
JPS6487211A true JPS6487211A (en) 1989-03-31

Family

ID=17133104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24540187A Pending JPS6487211A (en) 1987-09-29 1987-09-29 Processing method for single crystal

Country Status (1)

Country Link
JP (1) JPS6487211A (en)

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