JPS6481813A - Composition for sealing electronic part - Google Patents

Composition for sealing electronic part

Info

Publication number
JPS6481813A
JPS6481813A JP23816187A JP23816187A JPS6481813A JP S6481813 A JPS6481813 A JP S6481813A JP 23816187 A JP23816187 A JP 23816187A JP 23816187 A JP23816187 A JP 23816187A JP S6481813 A JPS6481813 A JP S6481813A
Authority
JP
Japan
Prior art keywords
60pts
oligomer
polymerization initiator
radically polymerizable
flame retardant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23816187A
Other languages
Japanese (ja)
Other versions
JP2525207B2 (en
Inventor
Fumito Aozai
Hiroshi Fukushima
Hisako Hado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Rayon Co Ltd
Original Assignee
Mitsubishi Rayon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Rayon Co Ltd filed Critical Mitsubishi Rayon Co Ltd
Priority to JP62238161A priority Critical patent/JP2525207B2/en
Publication of JPS6481813A publication Critical patent/JPS6481813A/en
Application granted granted Critical
Publication of JP2525207B2 publication Critical patent/JP2525207B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Macromonomer-Based Addition Polymer (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain the titled composition, consisting of an oligomer of an acryloyl- or methacryloyl-containing polybutadiene backbone chain skeleton, radically polymerizable diluting monomer, specific flame retardant and polymerization initiator and capable of readily providing a sealing compound having excellent hermetically sealing properties, flame retardancy, etc., in a short time. CONSTITUTION:The aimed composition obtained by blending (A) 20-50pts.wt. oligomer of a polybutadiene backbone chain skeleton having >=2 (meth)acryloyl groups with (B) 5-60pts.wt. radically polymerizable diluting monomer having >=100 deg.C boiling point, (C) 20-60pts.wt. reactive flame retardant expressed by the formula (R1 and R2 are H or methyl; m and n are 0 or an integer of >=1) and (D) a polymerization initiator in an amount of 0.01-5pts.wt. based on 100pts.wt. total amount of the components (A)-(C). Furthermore, e.g. 2,2-bis(4- acryloxyethoxy-3,5-dibromophenyl)propane, is used as the component (C) and, e.g. benzyl acrylate, is used as the component (B).
JP62238161A 1987-09-22 1987-09-22 Electronic component sealing composition Expired - Lifetime JP2525207B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62238161A JP2525207B2 (en) 1987-09-22 1987-09-22 Electronic component sealing composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62238161A JP2525207B2 (en) 1987-09-22 1987-09-22 Electronic component sealing composition

Publications (2)

Publication Number Publication Date
JPS6481813A true JPS6481813A (en) 1989-03-28
JP2525207B2 JP2525207B2 (en) 1996-08-14

Family

ID=17026094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62238161A Expired - Lifetime JP2525207B2 (en) 1987-09-22 1987-09-22 Electronic component sealing composition

Country Status (1)

Country Link
JP (1) JP2525207B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015129416A1 (en) * 2014-02-28 2015-09-03 古河電気工業株式会社 Resin composition for sealing electronic device, and electronic device
WO2015129417A1 (en) * 2014-02-28 2015-09-03 古河電気工業株式会社 Resin composition for sealing electronic device, and electronic device
US11835858B2 (en) 2020-06-19 2023-12-05 Canon Kabushiki Kaisha Photo-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015129416A1 (en) * 2014-02-28 2015-09-03 古河電気工業株式会社 Resin composition for sealing electronic device, and electronic device
WO2015129417A1 (en) * 2014-02-28 2015-09-03 古河電気工業株式会社 Resin composition for sealing electronic device, and electronic device
CN106029817A (en) * 2014-02-28 2016-10-12 古河电气工业株式会社 Resin composition for sealing electronic device, and electronic device
CN106062022A (en) * 2014-02-28 2016-10-26 古河电气工业株式会社 Resin composition for sealing electronic device, and electronic device
CN106029817B (en) * 2014-02-28 2018-06-08 古河电气工业株式会社 Electronic equipment resin composition for encapsulating and electronic equipment
CN106062022B (en) * 2014-02-28 2019-01-22 古河电气工业株式会社 Electronic equipment resin composition for encapsulating and electronic equipment
US10196547B2 (en) 2014-02-28 2019-02-05 Furukawa Electrics Co., Ltd. Resin composition for sealing electronic device, and electronic device
US10196534B2 (en) 2014-02-28 2019-02-05 Furukawa Electric Co., Ltd. Resin composition for sealing electronic device, and electronic device
US11835858B2 (en) 2020-06-19 2023-12-05 Canon Kabushiki Kaisha Photo-curable composition and methods for preparing cured film, optical component, circuit substrate, electrical component and replica mold using the same

Also Published As

Publication number Publication date
JP2525207B2 (en) 1996-08-14

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