JPS6479233A - Preparation of wholly aromatic polyazomethine - Google Patents
Preparation of wholly aromatic polyazomethineInfo
- Publication number
- JPS6479233A JPS6479233A JP23500887A JP23500887A JPS6479233A JP S6479233 A JPS6479233 A JP S6479233A JP 23500887 A JP23500887 A JP 23500887A JP 23500887 A JP23500887 A JP 23500887A JP S6479233 A JPS6479233 A JP S6479233A
- Authority
- JP
- Japan
- Prior art keywords
- arom
- compd
- diamine
- polyazomethine
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23500887A JPS6479233A (en) | 1987-09-21 | 1987-09-21 | Preparation of wholly aromatic polyazomethine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23500887A JPS6479233A (en) | 1987-09-21 | 1987-09-21 | Preparation of wholly aromatic polyazomethine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6479233A true JPS6479233A (en) | 1989-03-24 |
Family
ID=16979698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23500887A Pending JPS6479233A (en) | 1987-09-21 | 1987-09-21 | Preparation of wholly aromatic polyazomethine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6479233A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7521167B2 (en) | 2005-05-24 | 2009-04-21 | Sony Corporation | Ester group-containing poly (imide-azomethine) copolymer, ester group-containing poly (amide acid-azomethine) copolymer, and positive photosensitive resin composition |
US7635551B2 (en) | 2005-07-27 | 2009-12-22 | Sony Corporation | Poly (imide-azomethine) copolymer, poly (amic acid-azomethine) copolymer, and positive photosensitive resin composition |
KR20150089017A (ko) | 2012-11-28 | 2015-08-04 | 히타치가세이가부시끼가이샤 | 실록산 화합물, 변성 이미드 수지, 열경화성 수지 조성물, 프리프레그, 수지 부착 필름, 적층판, 다층 프린트 배선판 및 반도체 패키지 |
US10323126B2 (en) | 2012-11-28 | 2019-06-18 | Hitachi Chemical Company, Ltd. | Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package |
-
1987
- 1987-09-21 JP JP23500887A patent/JPS6479233A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7521167B2 (en) | 2005-05-24 | 2009-04-21 | Sony Corporation | Ester group-containing poly (imide-azomethine) copolymer, ester group-containing poly (amide acid-azomethine) copolymer, and positive photosensitive resin composition |
US7635551B2 (en) | 2005-07-27 | 2009-12-22 | Sony Corporation | Poly (imide-azomethine) copolymer, poly (amic acid-azomethine) copolymer, and positive photosensitive resin composition |
KR20150089017A (ko) | 2012-11-28 | 2015-08-04 | 히타치가세이가부시끼가이샤 | 실록산 화합물, 변성 이미드 수지, 열경화성 수지 조성물, 프리프레그, 수지 부착 필름, 적층판, 다층 프린트 배선판 및 반도체 패키지 |
US10323126B2 (en) | 2012-11-28 | 2019-06-18 | Hitachi Chemical Company, Ltd. | Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package |
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