JPS6479233A - Preparation of wholly aromatic polyazomethine - Google Patents

Preparation of wholly aromatic polyazomethine

Info

Publication number
JPS6479233A
JPS6479233A JP23500887A JP23500887A JPS6479233A JP S6479233 A JPS6479233 A JP S6479233A JP 23500887 A JP23500887 A JP 23500887A JP 23500887 A JP23500887 A JP 23500887A JP S6479233 A JPS6479233 A JP S6479233A
Authority
JP
Japan
Prior art keywords
arom
compd
diamine
polyazomethine
preparation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23500887A
Other languages
English (en)
Inventor
Shigeyoshi Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teijin Ltd
Original Assignee
Teijin Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Ltd filed Critical Teijin Ltd
Priority to JP23500887A priority Critical patent/JPS6479233A/ja
Publication of JPS6479233A publication Critical patent/JPS6479233A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
JP23500887A 1987-09-21 1987-09-21 Preparation of wholly aromatic polyazomethine Pending JPS6479233A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23500887A JPS6479233A (en) 1987-09-21 1987-09-21 Preparation of wholly aromatic polyazomethine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23500887A JPS6479233A (en) 1987-09-21 1987-09-21 Preparation of wholly aromatic polyazomethine

Publications (1)

Publication Number Publication Date
JPS6479233A true JPS6479233A (en) 1989-03-24

Family

ID=16979698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23500887A Pending JPS6479233A (en) 1987-09-21 1987-09-21 Preparation of wholly aromatic polyazomethine

Country Status (1)

Country Link
JP (1) JPS6479233A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7521167B2 (en) 2005-05-24 2009-04-21 Sony Corporation Ester group-containing poly (imide-azomethine) copolymer, ester group-containing poly (amide acid-azomethine) copolymer, and positive photosensitive resin composition
US7635551B2 (en) 2005-07-27 2009-12-22 Sony Corporation Poly (imide-azomethine) copolymer, poly (amic acid-azomethine) copolymer, and positive photosensitive resin composition
KR20150089017A (ko) 2012-11-28 2015-08-04 히타치가세이가부시끼가이샤 실록산 화합물, 변성 이미드 수지, 열경화성 수지 조성물, 프리프레그, 수지 부착 필름, 적층판, 다층 프린트 배선판 및 반도체 패키지
US10323126B2 (en) 2012-11-28 2019-06-18 Hitachi Chemical Company, Ltd. Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7521167B2 (en) 2005-05-24 2009-04-21 Sony Corporation Ester group-containing poly (imide-azomethine) copolymer, ester group-containing poly (amide acid-azomethine) copolymer, and positive photosensitive resin composition
US7635551B2 (en) 2005-07-27 2009-12-22 Sony Corporation Poly (imide-azomethine) copolymer, poly (amic acid-azomethine) copolymer, and positive photosensitive resin composition
KR20150089017A (ko) 2012-11-28 2015-08-04 히타치가세이가부시끼가이샤 실록산 화합물, 변성 이미드 수지, 열경화성 수지 조성물, 프리프레그, 수지 부착 필름, 적층판, 다층 프린트 배선판 및 반도체 패키지
US10323126B2 (en) 2012-11-28 2019-06-18 Hitachi Chemical Company, Ltd. Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package

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