JPS6473736A - Carrier case for semiconductor integrated circuit device - Google Patents
Carrier case for semiconductor integrated circuit deviceInfo
- Publication number
- JPS6473736A JPS6473736A JP62233112A JP23311287A JPS6473736A JP S6473736 A JPS6473736 A JP S6473736A JP 62233112 A JP62233112 A JP 62233112A JP 23311287 A JP23311287 A JP 23311287A JP S6473736 A JPS6473736 A JP S6473736A
- Authority
- JP
- Japan
- Prior art keywords
- case
- cap
- main body
- wall part
- impact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To make it possible to absorb impact even in case the impact is inflicted on the title case by a method wherein the whole case is constituted in a structure, wherein the cap and the case main body of the case are respectively formed in a three-layer structure using an impact absorbent material as its intermediate layer and ICs are supported by protrusions formed on the inner wall part of the cap and metallic plate springs. CONSTITUTION:A carrier case consists of a cap 1 of a three-layer structure, a case main body 2 of a three-layer structure and partition plates 24 for partitioning semiconductor integrated circuits TAB-IC 3, which are manufactured by a tape carrier system and are housed in the case main body. The cap 2 is provided with an impact absorbent material as its intermediate layer and protrusions 1d, which are molded integrally with the inner wall part 1c of the cap 1 and are faced downwards, are formed on the inner wall part 1c. The main body 2 is provided with an impact absorbent material 2b as its intermediate layer and the partition plates 4, which are molded integrally with the inner wall part 2c of the main body and are faced upwards, and metallic plate springs 5 arranged between these plates 4 for suppressing the IC 3 are provided on the inner wall part 2c. Thereby, when the cap 1 is made to cover on the main body 2, the springs 5 are pressed by the protrusions 1d, can support elastically the ICs and eliminates an effect to the IC 3 due to a play in the case.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62233112A JPS6473736A (en) | 1987-09-16 | 1987-09-16 | Carrier case for semiconductor integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62233112A JPS6473736A (en) | 1987-09-16 | 1987-09-16 | Carrier case for semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6473736A true JPS6473736A (en) | 1989-03-20 |
Family
ID=16949956
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62233112A Pending JPS6473736A (en) | 1987-09-16 | 1987-09-16 | Carrier case for semiconductor integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6473736A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002347061A (en) * | 2001-05-23 | 2002-12-04 | Shin Etsu Polymer Co Ltd | Holding vessel and manufacturing method thereof |
-
1987
- 1987-09-16 JP JP62233112A patent/JPS6473736A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002347061A (en) * | 2001-05-23 | 2002-12-04 | Shin Etsu Polymer Co Ltd | Holding vessel and manufacturing method thereof |
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