JPS6473736A - Carrier case for semiconductor integrated circuit device - Google Patents

Carrier case for semiconductor integrated circuit device

Info

Publication number
JPS6473736A
JPS6473736A JP62233112A JP23311287A JPS6473736A JP S6473736 A JPS6473736 A JP S6473736A JP 62233112 A JP62233112 A JP 62233112A JP 23311287 A JP23311287 A JP 23311287A JP S6473736 A JPS6473736 A JP S6473736A
Authority
JP
Japan
Prior art keywords
case
cap
main body
wall part
impact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62233112A
Other languages
Japanese (ja)
Inventor
Masaharu Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62233112A priority Critical patent/JPS6473736A/en
Publication of JPS6473736A publication Critical patent/JPS6473736A/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To make it possible to absorb impact even in case the impact is inflicted on the title case by a method wherein the whole case is constituted in a structure, wherein the cap and the case main body of the case are respectively formed in a three-layer structure using an impact absorbent material as its intermediate layer and ICs are supported by protrusions formed on the inner wall part of the cap and metallic plate springs. CONSTITUTION:A carrier case consists of a cap 1 of a three-layer structure, a case main body 2 of a three-layer structure and partition plates 24 for partitioning semiconductor integrated circuits TAB-IC 3, which are manufactured by a tape carrier system and are housed in the case main body. The cap 2 is provided with an impact absorbent material as its intermediate layer and protrusions 1d, which are molded integrally with the inner wall part 1c of the cap 1 and are faced downwards, are formed on the inner wall part 1c. The main body 2 is provided with an impact absorbent material 2b as its intermediate layer and the partition plates 4, which are molded integrally with the inner wall part 2c of the main body and are faced upwards, and metallic plate springs 5 arranged between these plates 4 for suppressing the IC 3 are provided on the inner wall part 2c. Thereby, when the cap 1 is made to cover on the main body 2, the springs 5 are pressed by the protrusions 1d, can support elastically the ICs and eliminates an effect to the IC 3 due to a play in the case.
JP62233112A 1987-09-16 1987-09-16 Carrier case for semiconductor integrated circuit device Pending JPS6473736A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62233112A JPS6473736A (en) 1987-09-16 1987-09-16 Carrier case for semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62233112A JPS6473736A (en) 1987-09-16 1987-09-16 Carrier case for semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS6473736A true JPS6473736A (en) 1989-03-20

Family

ID=16949956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62233112A Pending JPS6473736A (en) 1987-09-16 1987-09-16 Carrier case for semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6473736A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002347061A (en) * 2001-05-23 2002-12-04 Shin Etsu Polymer Co Ltd Holding vessel and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002347061A (en) * 2001-05-23 2002-12-04 Shin Etsu Polymer Co Ltd Holding vessel and manufacturing method thereof

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