JPS6471160A - Semiconductor case - Google Patents

Semiconductor case

Info

Publication number
JPS6471160A
JPS6471160A JP22791687A JP22791687A JPS6471160A JP S6471160 A JPS6471160 A JP S6471160A JP 22791687 A JP22791687 A JP 22791687A JP 22791687 A JP22791687 A JP 22791687A JP S6471160 A JPS6471160 A JP S6471160A
Authority
JP
Japan
Prior art keywords
terminals
printed board
pads
outer lead
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22791687A
Other languages
Japanese (ja)
Inventor
Mamoru Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP22791687A priority Critical patent/JPS6471160A/en
Publication of JPS6471160A publication Critical patent/JPS6471160A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To connect an outer lead terminal and a printed board positively, and to improve the reliability of connection by bending and forming the outer lead terminal in an expansible manner in response to the shape of the connecting surface of the printed board when the printed board is connected. CONSTITUTION:Outer lead terminals 2 are shaped respectively by conductive materials, central sections of which are bent to a conical shape. Terminal 2 themselves have elasticity, and are bent as shown in a broken line by push force. A fixed number of the terminals 2 are arranged at regular intervals on the horizontal base of a case body 1. When a semiconductor case is pushed to the printed board 3 side, the soldered 5 terminals 2 on both sides are curved, and the terminals 2 at the center collide with pads 4. The terminals 2 at the center are soldered 5 to the pads 4 under the state. Consequently, the terminals 2 are connected completely to all pads 4 in the board 3. Accordingly, thc reliability of connection is improved.
JP22791687A 1987-09-11 1987-09-11 Semiconductor case Pending JPS6471160A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22791687A JPS6471160A (en) 1987-09-11 1987-09-11 Semiconductor case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22791687A JPS6471160A (en) 1987-09-11 1987-09-11 Semiconductor case

Publications (1)

Publication Number Publication Date
JPS6471160A true JPS6471160A (en) 1989-03-16

Family

ID=16868305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22791687A Pending JPS6471160A (en) 1987-09-11 1987-09-11 Semiconductor case

Country Status (1)

Country Link
JP (1) JPS6471160A (en)

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