JPS6471154A - Method of mounting heat sink - Google Patents
Method of mounting heat sinkInfo
- Publication number
- JPS6471154A JPS6471154A JP22772687A JP22772687A JPS6471154A JP S6471154 A JPS6471154 A JP S6471154A JP 22772687 A JP22772687 A JP 22772687A JP 22772687 A JP22772687 A JP 22772687A JP S6471154 A JPS6471154 A JP S6471154A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- sections
- clamp
- pawl
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To conduct the mounting fixing work of a heat sink onto an IC easily in a short time by holding the heat sink by using a clamp having simple structure and utilizing the elastic force of the clamp and mounting and fixing the heat sink. CONSTITUTION:With a clamp 8 shaped by an elastic material, fulcra B are formed at central sections, and both ends are bent to an acute angle shape in conformity with the length of a heat sink 5 and pawl sections C are shaped at each end section. The pawl sections C and the fulcra B firmly hold an IC 3 and the heat sink 5 by the elastic force of the clamp 8 by catching the pawl sections C to the bottom of the IC 3 while pushing sections A. Force pushing to the inside of the side face of the IC 3 works on bonding, and easy slip-off from the bottom of the IC 3 of the pawl sections C at noses is prevented. Accordingly, the mounting fixing work of the heat sink 5 onto the IC is performed easily in a short time.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22772687A JPS6471154A (en) | 1987-09-11 | 1987-09-11 | Method of mounting heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22772687A JPS6471154A (en) | 1987-09-11 | 1987-09-11 | Method of mounting heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6471154A true JPS6471154A (en) | 1989-03-16 |
Family
ID=16865395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22772687A Pending JPS6471154A (en) | 1987-09-11 | 1987-09-11 | Method of mounting heat sink |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6471154A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4978638A (en) * | 1989-12-21 | 1990-12-18 | International Business Machines Corporation | Method for attaching heat sink to plastic packaged electronic component |
JPH06112382A (en) * | 1992-09-30 | 1994-04-22 | Hitachi Ltd | Cooling system of heating element |
-
1987
- 1987-09-11 JP JP22772687A patent/JPS6471154A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4978638A (en) * | 1989-12-21 | 1990-12-18 | International Business Machines Corporation | Method for attaching heat sink to plastic packaged electronic component |
JPH06112382A (en) * | 1992-09-30 | 1994-04-22 | Hitachi Ltd | Cooling system of heating element |
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