JPS6471154A - Method of mounting heat sink - Google Patents

Method of mounting heat sink

Info

Publication number
JPS6471154A
JPS6471154A JP22772687A JP22772687A JPS6471154A JP S6471154 A JPS6471154 A JP S6471154A JP 22772687 A JP22772687 A JP 22772687A JP 22772687 A JP22772687 A JP 22772687A JP S6471154 A JPS6471154 A JP S6471154A
Authority
JP
Japan
Prior art keywords
heat sink
sections
clamp
pawl
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22772687A
Other languages
Japanese (ja)
Inventor
Hisashi Koga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP22772687A priority Critical patent/JPS6471154A/en
Publication of JPS6471154A publication Critical patent/JPS6471154A/en
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Components In General For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To conduct the mounting fixing work of a heat sink onto an IC easily in a short time by holding the heat sink by using a clamp having simple structure and utilizing the elastic force of the clamp and mounting and fixing the heat sink. CONSTITUTION:With a clamp 8 shaped by an elastic material, fulcra B are formed at central sections, and both ends are bent to an acute angle shape in conformity with the length of a heat sink 5 and pawl sections C are shaped at each end section. The pawl sections C and the fulcra B firmly hold an IC 3 and the heat sink 5 by the elastic force of the clamp 8 by catching the pawl sections C to the bottom of the IC 3 while pushing sections A. Force pushing to the inside of the side face of the IC 3 works on bonding, and easy slip-off from the bottom of the IC 3 of the pawl sections C at noses is prevented. Accordingly, the mounting fixing work of the heat sink 5 onto the IC is performed easily in a short time.
JP22772687A 1987-09-11 1987-09-11 Method of mounting heat sink Pending JPS6471154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22772687A JPS6471154A (en) 1987-09-11 1987-09-11 Method of mounting heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22772687A JPS6471154A (en) 1987-09-11 1987-09-11 Method of mounting heat sink

Publications (1)

Publication Number Publication Date
JPS6471154A true JPS6471154A (en) 1989-03-16

Family

ID=16865395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22772687A Pending JPS6471154A (en) 1987-09-11 1987-09-11 Method of mounting heat sink

Country Status (1)

Country Link
JP (1) JPS6471154A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4978638A (en) * 1989-12-21 1990-12-18 International Business Machines Corporation Method for attaching heat sink to plastic packaged electronic component
JPH06112382A (en) * 1992-09-30 1994-04-22 Hitachi Ltd Cooling system of heating element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4978638A (en) * 1989-12-21 1990-12-18 International Business Machines Corporation Method for attaching heat sink to plastic packaged electronic component
JPH06112382A (en) * 1992-09-30 1994-04-22 Hitachi Ltd Cooling system of heating element

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