JPS6471088A - Manufacture of wiring board provided with lead pin - Google Patents
Manufacture of wiring board provided with lead pinInfo
- Publication number
- JPS6471088A JPS6471088A JP22548287A JP22548287A JPS6471088A JP S6471088 A JPS6471088 A JP S6471088A JP 22548287 A JP22548287 A JP 22548287A JP 22548287 A JP22548287 A JP 22548287A JP S6471088 A JPS6471088 A JP S6471088A
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- wiring board
- board
- punch
- shearing area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Abstract
PURPOSE:To facilitate lead pin erection on a wiring board and form a wiring board provided with a lead pin in good productivity by adding vibration load op the upper and lower faces of a wiring board through a couple of lead pin and punch which and opposed to each other so as to bore a through hole on the board, and fixing the lead pin left, and then performing circuit processing such as soldering with a copper foil, etc. CONSTITUTION:Required load is added, through dies 2 and 3 by a press, to a wiring board being a board where a laminate and a required circuit pattern are formed so as to cramp the upper and lower faces of the wiring board. Next, vibrations are added to upper and lower punches 4, 5 at the same stroke and energy is supplied to the board shearing area under the boundary between a die hole and the punch. The shearing area is heated partially by the supplied energy. Next, this heat-softened area is sheared and separated and a pulled residuum in the board is pulled down. Next, the upper punch 4 is displaced and then the punch vibration is stopped. The upper punch 4 doubles as a lead pin, and when partial heating of the shearing area stops and the board is cooled, the lead pin and the wiring board are fixed and the copper foil and the lead pin are soldered and electroplated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22548287A JPS6471088A (en) | 1987-09-09 | 1987-09-09 | Manufacture of wiring board provided with lead pin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22548287A JPS6471088A (en) | 1987-09-09 | 1987-09-09 | Manufacture of wiring board provided with lead pin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6471088A true JPS6471088A (en) | 1989-03-16 |
Family
ID=16830017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22548287A Pending JPS6471088A (en) | 1987-09-09 | 1987-09-09 | Manufacture of wiring board provided with lead pin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6471088A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03102791A (en) * | 1989-09-18 | 1991-04-30 | Yazaki Corp | Manufacture of printed circuit board |
CN103920806A (en) * | 2014-03-20 | 2014-07-16 | 成都市龙泉驿区齐盛机械厂 | High-precision burr-free stamping die |
-
1987
- 1987-09-09 JP JP22548287A patent/JPS6471088A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03102791A (en) * | 1989-09-18 | 1991-04-30 | Yazaki Corp | Manufacture of printed circuit board |
CN103920806A (en) * | 2014-03-20 | 2014-07-16 | 成都市龙泉驿区齐盛机械厂 | High-precision burr-free stamping die |
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