JPS6469958A - Socket for ic - Google Patents

Socket for ic

Info

Publication number
JPS6469958A
JPS6469958A JP22882587A JP22882587A JPS6469958A JP S6469958 A JPS6469958 A JP S6469958A JP 22882587 A JP22882587 A JP 22882587A JP 22882587 A JP22882587 A JP 22882587A JP S6469958 A JPS6469958 A JP S6469958A
Authority
JP
Japan
Prior art keywords
capacitor
bypass capacitor
constitution
disposed
groove part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22882587A
Other languages
Japanese (ja)
Inventor
Masamitsu Shimazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP22882587A priority Critical patent/JPS6469958A/en
Publication of JPS6469958A publication Critical patent/JPS6469958A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve the effect of noise absorption of a bypass capacitor and to enable the attainment of high-density packaging, by providing an indented groove part and a conductive member as well as the bypass capacitor and others. CONSTITUTION:A bypass capacitor 17 for absorbing noise generated in a power supply pin 21a and an earthing pin 21b of an IC 20 to be tested is provided on a socket base 11 with conductive members 14 and 15 disposed as intermediates in an indented groove part 13. Accordingly, the capacitor 17 and the pins 21a and 21b of the IC 20 are disposed at positions being close to each other. By this constitution, the effect of noise absorption by the capacitor 17 in an electric test and burn-in can be improved, and thereby a test result of high accuracy can be obtained.
JP22882587A 1987-09-10 1987-09-10 Socket for ic Pending JPS6469958A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22882587A JPS6469958A (en) 1987-09-10 1987-09-10 Socket for ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22882587A JPS6469958A (en) 1987-09-10 1987-09-10 Socket for ic

Publications (1)

Publication Number Publication Date
JPS6469958A true JPS6469958A (en) 1989-03-15

Family

ID=16882446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22882587A Pending JPS6469958A (en) 1987-09-10 1987-09-10 Socket for ic

Country Status (1)

Country Link
JP (1) JPS6469958A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5307012A (en) * 1991-12-03 1994-04-26 Intel Corporation Test substation for testing semi-conductor packages
US5648683A (en) * 1993-08-13 1997-07-15 Kabushiki Kaisha Toshiba Semiconductor device in which a first resin-encapsulated package is mounted on a second resin-encapsulated package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5307012A (en) * 1991-12-03 1994-04-26 Intel Corporation Test substation for testing semi-conductor packages
US5648683A (en) * 1993-08-13 1997-07-15 Kabushiki Kaisha Toshiba Semiconductor device in which a first resin-encapsulated package is mounted on a second resin-encapsulated package

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