JPS6469958A - Socket for ic - Google Patents
Socket for icInfo
- Publication number
- JPS6469958A JPS6469958A JP22882587A JP22882587A JPS6469958A JP S6469958 A JPS6469958 A JP S6469958A JP 22882587 A JP22882587 A JP 22882587A JP 22882587 A JP22882587 A JP 22882587A JP S6469958 A JPS6469958 A JP S6469958A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- bypass capacitor
- constitution
- disposed
- groove part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To improve the effect of noise absorption of a bypass capacitor and to enable the attainment of high-density packaging, by providing an indented groove part and a conductive member as well as the bypass capacitor and others. CONSTITUTION:A bypass capacitor 17 for absorbing noise generated in a power supply pin 21a and an earthing pin 21b of an IC 20 to be tested is provided on a socket base 11 with conductive members 14 and 15 disposed as intermediates in an indented groove part 13. Accordingly, the capacitor 17 and the pins 21a and 21b of the IC 20 are disposed at positions being close to each other. By this constitution, the effect of noise absorption by the capacitor 17 in an electric test and burn-in can be improved, and thereby a test result of high accuracy can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22882587A JPS6469958A (en) | 1987-09-10 | 1987-09-10 | Socket for ic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22882587A JPS6469958A (en) | 1987-09-10 | 1987-09-10 | Socket for ic |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6469958A true JPS6469958A (en) | 1989-03-15 |
Family
ID=16882446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22882587A Pending JPS6469958A (en) | 1987-09-10 | 1987-09-10 | Socket for ic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6469958A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5307012A (en) * | 1991-12-03 | 1994-04-26 | Intel Corporation | Test substation for testing semi-conductor packages |
US5648683A (en) * | 1993-08-13 | 1997-07-15 | Kabushiki Kaisha Toshiba | Semiconductor device in which a first resin-encapsulated package is mounted on a second resin-encapsulated package |
-
1987
- 1987-09-10 JP JP22882587A patent/JPS6469958A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5307012A (en) * | 1991-12-03 | 1994-04-26 | Intel Corporation | Test substation for testing semi-conductor packages |
US5648683A (en) * | 1993-08-13 | 1997-07-15 | Kabushiki Kaisha Toshiba | Semiconductor device in which a first resin-encapsulated package is mounted on a second resin-encapsulated package |
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