JPS6467927A - Needle for discharging resin - Google Patents
Needle for discharging resinInfo
- Publication number
- JPS6467927A JPS6467927A JP22501887A JP22501887A JPS6467927A JP S6467927 A JPS6467927 A JP S6467927A JP 22501887 A JP22501887 A JP 22501887A JP 22501887 A JP22501887 A JP 22501887A JP S6467927 A JPS6467927 A JP S6467927A
- Authority
- JP
- Japan
- Prior art keywords
- face
- discharging
- resin
- needle
- semispherical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To prevent resin from adhering to the outer periphery of a needle by providing a recess cutout having a desired film thickness on an end, and providing a semispherical protrusion having a suitable clearance on a resin discharging section. CONSTITUTION:A recess cutout 3a is formed at the end of a discharging needle body 3 attached to the end of a cylindrical vessel, its deep face is formed in a protruding semispherical face 3b, resin discharged from its central discharging hole 3c is pressed and diffused in an outer peripheral direction. In this case, a suitable clearance is provided between the end face 3d of the discharging needle body 3 and the semispherical face 3b.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22501887A JPS6467927A (en) | 1987-09-08 | 1987-09-08 | Needle for discharging resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22501887A JPS6467927A (en) | 1987-09-08 | 1987-09-08 | Needle for discharging resin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6467927A true JPS6467927A (en) | 1989-03-14 |
Family
ID=16822782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22501887A Pending JPS6467927A (en) | 1987-09-08 | 1987-09-08 | Needle for discharging resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6467927A (en) |
-
1987
- 1987-09-08 JP JP22501887A patent/JPS6467927A/en active Pending
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