JPS6466991A - Flexible printed wiring board - Google Patents
Flexible printed wiring boardInfo
- Publication number
- JPS6466991A JPS6466991A JP22425787A JP22425787A JPS6466991A JP S6466991 A JPS6466991 A JP S6466991A JP 22425787 A JP22425787 A JP 22425787A JP 22425787 A JP22425787 A JP 22425787A JP S6466991 A JPS6466991 A JP S6466991A
- Authority
- JP
- Japan
- Prior art keywords
- lands
- fpc board
- soldering
- cylindrical body
- dimensional configuration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
PURPOSE:To automatize a molding process and improve the efficiency for increasing the freedom of circuit design by forming lands being mechanical coupling means to keep the three-dimensional configuration of an FPC board through soldering and employing it also as connector means for the circuit. CONSTITUTION:An FPC board 1 is molded into the three-dimensional configuration as a cylindrical body. The cylindrical body is a perfect one including no discontinuous portion (opening) on the peripheral surface. The peripheral surface has an interconnection part 2. The interconnection part 2 in cludes lands 3-6 for soldering. The FPC board can be kept in the three-dimensional configuration by soldering those lands 3-6 upon completely fixing (molding) the FPC board 1 as the cylindrical body. Here, designated at 7 is a positioning pin insertion hole for positioning two marginal edges constituting the interconnector part 2. Although the lands 3-6 may be simply mechanical coupling means, the use of the lands 3-6 also as electrical connector means assures a remarkable effect on circuit design.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22425787A JPS6466991A (en) | 1987-09-08 | 1987-09-08 | Flexible printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22425787A JPS6466991A (en) | 1987-09-08 | 1987-09-08 | Flexible printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6466991A true JPS6466991A (en) | 1989-03-13 |
Family
ID=16810945
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22425787A Pending JPS6466991A (en) | 1987-09-08 | 1987-09-08 | Flexible printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6466991A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0903969A2 (en) * | 1997-09-18 | 1999-03-24 | TEMIC TELEFUNKEN microelectronic GmbH | Electronic printed circuit board |
-
1987
- 1987-09-08 JP JP22425787A patent/JPS6466991A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0903969A2 (en) * | 1997-09-18 | 1999-03-24 | TEMIC TELEFUNKEN microelectronic GmbH | Electronic printed circuit board |
EP0903969A3 (en) * | 1997-09-18 | 1999-10-27 | TEMIC TELEFUNKEN microelectronic GmbH | Electronic printed circuit board |
US6016253A (en) * | 1997-09-18 | 2000-01-18 | Temic Telefunken Microeletronics Gmbh | Electronic module |
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