JPS64661A - Wire connection structure of crimp-style terminal - Google Patents
Wire connection structure of crimp-style terminalInfo
- Publication number
- JPS64661A JPS64661A JP23259487A JP23259487A JPS64661A JP S64661 A JPS64661 A JP S64661A JP 23259487 A JP23259487 A JP 23259487A JP 23259487 A JP23259487 A JP 23259487A JP S64661 A JPS64661 A JP S64661A
- Authority
- JP
- Japan
- Prior art keywords
- cores
- wire conductor
- conductive paste
- crimped part
- crimped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
PURPOSE: To make strict dimensional tolerance of a wire conductor crimped part needless and to much decrease a resistance by using conductive paste to fill a gap between an inner peripheral surface of the wire conductor crimped part and cores of the wire conductor, and to fill gaps formed among the cores themselves.
CONSTITUTION: After an inner part of a wire conductor crimped part 2 or wire cores 4 are coated with conductive paste 7 and/or conductive oil, the wire is inserted into the crimped part 2 and it is crimped. The conductive paste is thus used to fill a gap between the cores 4 and the crimped part and to fill gaps formed among the cores 4 themselves. At the wire conductor connection part filled with the conductive paste, an area where the crimped part 2 contacts with the cores 4 is increased and so a resistance thereof is much decreased, and besides production of an oxidative film is suppressed to prevent an electrically slow increase because the conductive paste is used for enclosure. Even if a dimension of the wire conductor crimped part is a little out of its tolerance, no effect is exerted on the resistance.
COPYRIGHT: (C)1989,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23259487A JPS64661A (en) | 1987-03-24 | 1987-09-18 | Wire connection structure of crimp-style terminal |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6803787 | 1987-03-24 | ||
| JP62-68037 | 1987-03-24 | ||
| JP23259487A JPS64661A (en) | 1987-03-24 | 1987-09-18 | Wire connection structure of crimp-style terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01661A JPH01661A (en) | 1989-01-05 |
| JPS64661A true JPS64661A (en) | 1989-01-05 |
Family
ID=26409271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23259487A Pending JPS64661A (en) | 1987-03-24 | 1987-09-18 | Wire connection structure of crimp-style terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS64661A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01255182A (en) * | 1988-04-05 | 1989-10-12 | Mitsui Toatsu Chem Inc | Seal connection method for connector |
| JP2011065994A (en) * | 2009-09-18 | 2011-03-31 | Delphi Technologies Inc | Manufacturing method of improved electric connection part including sealed cable core and terminal |
| WO2011071188A1 (en) | 2009-12-09 | 2011-06-16 | Yazaki Corporation | Wire-Equipped Crimp Terminal and Method of Curing Coating Agent |
| WO2011071184A1 (en) | 2009-12-09 | 2011-06-16 | Yazaki Corporation | Method of curing coating agent |
| JP2013196841A (en) * | 2012-03-16 | 2013-09-30 | Yazaki Corp | Method for crimping crimp terminal on wire |
-
1987
- 1987-09-18 JP JP23259487A patent/JPS64661A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01255182A (en) * | 1988-04-05 | 1989-10-12 | Mitsui Toatsu Chem Inc | Seal connection method for connector |
| JP2011065994A (en) * | 2009-09-18 | 2011-03-31 | Delphi Technologies Inc | Manufacturing method of improved electric connection part including sealed cable core and terminal |
| WO2011071188A1 (en) | 2009-12-09 | 2011-06-16 | Yazaki Corporation | Wire-Equipped Crimp Terminal and Method of Curing Coating Agent |
| WO2011071184A1 (en) | 2009-12-09 | 2011-06-16 | Yazaki Corporation | Method of curing coating agent |
| US9401549B2 (en) | 2009-12-09 | 2016-07-26 | Yazaki Corporation | Method of curing a coating agent on a crimp terminal |
| DE112010004750B4 (en) | 2009-12-09 | 2023-01-19 | Yazaki Corporation | Leaded compression connector and method of curing a coating composition |
| JP2013196841A (en) * | 2012-03-16 | 2013-09-30 | Yazaki Corp | Method for crimping crimp terminal on wire |
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