JPS6465270A - Production of sintered zinc oxide film - Google Patents
Production of sintered zinc oxide filmInfo
- Publication number
- JPS6465270A JPS6465270A JP62222314A JP22231487A JPS6465270A JP S6465270 A JPS6465270 A JP S6465270A JP 62222314 A JP62222314 A JP 62222314A JP 22231487 A JP22231487 A JP 22231487A JP S6465270 A JPS6465270 A JP S6465270A
- Authority
- JP
- Japan
- Prior art keywords
- zinc oxide
- paste
- oxide powder
- zinc
- heat resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 title abstract 10
- 239000011787 zinc oxide Substances 0.000 title abstract 3
- 238000005245 sintering Methods 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- 239000011701 zinc Substances 0.000 abstract 2
- 229910052725 zinc Inorganic materials 0.000 abstract 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 abstract 1
- 239000002612 dispersion medium Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 239000002609 medium Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000007639 printing Methods 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000008096 xylene Substances 0.000 abstract 1
- IFNXAMCERSVZCV-UHFFFAOYSA-L zinc;2-ethylhexanoate Chemical compound [Zn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O IFNXAMCERSVZCV-UHFFFAOYSA-L 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1245—Inorganic substrates other than metallic
Abstract
PURPOSE:To produce an electrically conductive transparent sintered zinc oxide film having low resistance and a large area at a low cost by applying paste prepd. by adding an org. zinc soln. to zinc oxide powder to a heat resistant substrate and by sintering the formed paste film. CONSTITUTION:Zinc oxide powder ground to <=about 500mum particle size is pulverized in a dispersion medium such as water by means of a medium mill to obtain fine zinc oxide powder of <=1mum average particle diameter. An org. zinc compd. such as zinc 2-ethylhexanoate is added to the fine zinc oxide powder and a solvent such as xylene is further added to prepare paste having proper viscosity. This paste is applied to a heat resistant substrate such as heat resistant glass by screen printing, computer controlled drawing and printing or other method. The substrate is put in a sintering vessel having plural holes and the vessel is continuously moved in a sintering furnace to sinter the formed paste film at about 600-700 deg.C. Thus, a sintered zinc oxide film is efficiently obtd.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62222314A JPS6465270A (en) | 1987-09-04 | 1987-09-04 | Production of sintered zinc oxide film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62222314A JPS6465270A (en) | 1987-09-04 | 1987-09-04 | Production of sintered zinc oxide film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6465270A true JPS6465270A (en) | 1989-03-10 |
Family
ID=16780417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62222314A Pending JPS6465270A (en) | 1987-09-04 | 1987-09-04 | Production of sintered zinc oxide film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6465270A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03227576A (en) * | 1990-02-01 | 1991-10-08 | Canon Inc | Manufacture of thin film solar cell |
| US5642163A (en) * | 1994-08-31 | 1997-06-24 | Matsushita Electric Industrial Co., Ltd. | Imaging apparatus for switching the accumulative electric charge of an image pickup device |
| FR2813602A1 (en) * | 2000-09-07 | 2002-03-08 | Armines Ass Pour La Rech Et Le | COATING COMPOSITION AND METHOD FOR COATING A SURFACE OF A SUBSTRATE |
| GB2357281B (en) * | 1999-12-16 | 2004-02-04 | Univ Cranfield | Fabrication of ceramic films |
-
1987
- 1987-09-04 JP JP62222314A patent/JPS6465270A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03227576A (en) * | 1990-02-01 | 1991-10-08 | Canon Inc | Manufacture of thin film solar cell |
| US5642163A (en) * | 1994-08-31 | 1997-06-24 | Matsushita Electric Industrial Co., Ltd. | Imaging apparatus for switching the accumulative electric charge of an image pickup device |
| GB2357281B (en) * | 1999-12-16 | 2004-02-04 | Univ Cranfield | Fabrication of ceramic films |
| FR2813602A1 (en) * | 2000-09-07 | 2002-03-08 | Armines Ass Pour La Rech Et Le | COATING COMPOSITION AND METHOD FOR COATING A SURFACE OF A SUBSTRATE |
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