JPS64635A - Sample setting device - Google Patents

Sample setting device

Info

Publication number
JPS64635A
JPS64635A JP62155043A JP15504387A JPS64635A JP S64635 A JPS64635 A JP S64635A JP 62155043 A JP62155043 A JP 62155043A JP 15504387 A JP15504387 A JP 15504387A JP S64635 A JPS64635 A JP S64635A
Authority
JP
Japan
Prior art keywords
sample
thickness
height
pin
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62155043A
Other languages
Japanese (ja)
Other versions
JPH01635A (en
JP2627065B2 (en
Inventor
Takuoki Numaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Machine Co Ltd
Original Assignee
Toshiba Machine Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Machine Co Ltd filed Critical Toshiba Machine Co Ltd
Priority to JP62155043A priority Critical patent/JP2627065B2/en
Publication of JPH01635A publication Critical patent/JPH01635A/en
Publication of JPS64635A publication Critical patent/JPS64635A/en
Application granted granted Critical
Publication of JP2627065B2 publication Critical patent/JP2627065B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Electron Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: To obtain an electron beam drawing device on which a large-sized sample can be easily set by providing a mechanism for measuring the thickness of a sample and a mechanism for adjusting the height of a reference pin.
CONSTITUTION: A thickness measuring mechanism 81, in which a sensor 84 such as a noncontact sensor or the like is attached to respective one-side ends of a pair of arms 83, arranged with its free rotation around the center of a rotary axis 87. Firstly, the thickness of a sample 33 is measured by a measuring mechanism 81. Next, the piston rod 46A of a cylinder 46 is made to advance to relieve the clamp of a reference pin 36 followed by making a rotary knob 39 to advance in the right direction against a spring 38 to rotate an eccentric pin 37 for putting its large diameter part in the lowest position. A micrometer head 60 is rotated in this state, and the height of three pins 36 is made to accord with the thickness, that is, with the height of the sample 33 followed by rotating the pin 37 to make its large diameter part contact with the undersurface of a holder body 34. With this constitution, an electron drawing device on which a large-sized sample can be easily set can be obtained.
COPYRIGHT: (C)1989,JPO&Japio
JP62155043A 1987-06-22 1987-06-22 Sample setting device Expired - Fee Related JP2627065B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62155043A JP2627065B2 (en) 1987-06-22 1987-06-22 Sample setting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62155043A JP2627065B2 (en) 1987-06-22 1987-06-22 Sample setting device

Publications (3)

Publication Number Publication Date
JPH01635A JPH01635A (en) 1989-01-05
JPS64635A true JPS64635A (en) 1989-01-05
JP2627065B2 JP2627065B2 (en) 1997-07-02

Family

ID=15597421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62155043A Expired - Fee Related JP2627065B2 (en) 1987-06-22 1987-06-22 Sample setting device

Country Status (1)

Country Link
JP (1) JP2627065B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4945156A (en) * 1988-12-29 1990-07-31 Honeywell Inc. Solution processing of rigid chain and ladder polymers
KR100583641B1 (en) * 1999-04-27 2006-05-26 삼성전자주식회사 Apparatus for moving semiconductor wafer

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54146161U (en) * 1978-03-31 1979-10-11
JPS59196549A (en) * 1983-04-22 1984-11-07 Jeol Ltd Sample device for electron ray device or the like
JPS60207239A (en) * 1984-03-30 1985-10-18 Shimadzu Corp Driving device for reciprocating fine movement
JPS6170930U (en) * 1984-10-15 1986-05-15

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54146161U (en) * 1978-03-31 1979-10-11
JPS59196549A (en) * 1983-04-22 1984-11-07 Jeol Ltd Sample device for electron ray device or the like
JPS60207239A (en) * 1984-03-30 1985-10-18 Shimadzu Corp Driving device for reciprocating fine movement
JPS6170930U (en) * 1984-10-15 1986-05-15

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4945156A (en) * 1988-12-29 1990-07-31 Honeywell Inc. Solution processing of rigid chain and ladder polymers
KR100583641B1 (en) * 1999-04-27 2006-05-26 삼성전자주식회사 Apparatus for moving semiconductor wafer

Also Published As

Publication number Publication date
JP2627065B2 (en) 1997-07-02

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Legal Events

Date Code Title Description
S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

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LAPS Cancellation because of no payment of annual fees