JPS64627A - Sealed relay - Google Patents

Sealed relay

Info

Publication number
JPS64627A
JPS64627A JP15502187A JP15502187A JPS64627A JP S64627 A JPS64627 A JP S64627A JP 15502187 A JP15502187 A JP 15502187A JP 15502187 A JP15502187 A JP 15502187A JP S64627 A JPS64627 A JP S64627A
Authority
JP
Japan
Prior art keywords
hole
case
projected part
relay
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15502187A
Other languages
Japanese (ja)
Other versions
JPH01627A (en
Inventor
Mitsuki Nagamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP15502187A priority Critical patent/JPS64627A/en
Publication of JPH01627A publication Critical patent/JPH01627A/en
Publication of JPS64627A publication Critical patent/JPS64627A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/12—Ventilating; Cooling; Heating

Abstract

PURPOSE:To obtain a sealed relay which is compact and performs stabilized action by passing a projected part made of a thermoplastic material through a through a hole bored in a part of a case, fixing the projected part to a coil frame, sealing a surface where a terminal passes through, and then heat-bonding the projected part to close the through hole. CONSTITUTION:A relay body 1 installed on a base 11 is covered with a case 12 to constitute a relay. A projected part 5a having a hole 5b and projecting from a coil frame 5 of the relay body 1 is passed through a through hole 12a of a cylindrical part 12b arranged on the case 12. At first the fitting portion between the base 11 and the case 12 fitted with a seal agent 9 is heated and sealed. At this time, heated air is released through the hole 5b and others. Then, the tip of the projected part 5a made of a thermoplastic material is heat-bonded to crush the hole 5b as well as the gap between the hole 12a and the projected part 5a to seal the casing 10. This makes it possible to make both the case and the base thin-walled and compact and to obtain a sealed relay which performs stabilized action.
JP15502187A 1987-06-22 1987-06-22 Sealed relay Pending JPS64627A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15502187A JPS64627A (en) 1987-06-22 1987-06-22 Sealed relay

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15502187A JPS64627A (en) 1987-06-22 1987-06-22 Sealed relay

Publications (2)

Publication Number Publication Date
JPH01627A JPH01627A (en) 1989-01-05
JPS64627A true JPS64627A (en) 1989-01-05

Family

ID=15596937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15502187A Pending JPS64627A (en) 1987-06-22 1987-06-22 Sealed relay

Country Status (1)

Country Link
JP (1) JPS64627A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7275860B2 (en) 2004-01-27 2007-10-02 Seiko Instruments Inc. Display correcting mechanism and timepiece having display correcting mechanism
EP2341520A1 (en) * 2009-12-31 2011-07-06 LS Industrial Systems Co., Ltd High voltage relay
WO2024024246A1 (en) * 2022-07-28 2024-02-01 パナソニックＩｐマネジメント株式会社 Contact device and method for manufacturing contact device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7275860B2 (en) 2004-01-27 2007-10-02 Seiko Instruments Inc. Display correcting mechanism and timepiece having display correcting mechanism
EP2341520A1 (en) * 2009-12-31 2011-07-06 LS Industrial Systems Co., Ltd High voltage relay
US8350645B2 (en) 2009-12-31 2013-01-08 Ls Industrial Systems Co., Ltd. High voltage relay
WO2024024246A1 (en) * 2022-07-28 2024-02-01 パナソニックＩｐマネジメント株式会社 Contact device and method for manufacturing contact device

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