JPS6461229A - Molding mold for multi-layer printed board and molding method - Google Patents
Molding mold for multi-layer printed board and molding methodInfo
- Publication number
- JPS6461229A JPS6461229A JP21781887A JP21781887A JPS6461229A JP S6461229 A JPS6461229 A JP S6461229A JP 21781887 A JP21781887 A JP 21781887A JP 21781887 A JP21781887 A JP 21781887A JP S6461229 A JPS6461229 A JP S6461229A
- Authority
- JP
- Japan
- Prior art keywords
- molds
- seal material
- air
- seal
- vent hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To obtain a multi-layer printed board which controls a void and possesses stabilized capacity, by a method wherein when a mold is pressurized in a vertical direction, a seal material is shrunk and an air passage between the open air and an outer frame for the seal is interrupted through elasticity of the seal material. CONSTITUTION:Air within a spatial part 19 is removed through a vent hole 20 prior to setting up of a laminated body 3 among a top and bottom molds 13, 14. Then the laminated body 3 is set up, a top and bottom hot plates 8, 9, which are kept heated at a predetermined temperature, are actuated by a press and the top and bottom molds 13, 14 are pressurized. Although a seal material 16 is compressed when a space between the molds 13, 14 is compressed through this pressurization, the each seal material 16 is repelled through its elasticity and seals a space among the molds 13, 14 and the outer frame 18 of the seal at this time. When the spatial part 19 is inter rupted from the open air, the air is removed through the vent hole 20 and the inside is vacuous. When an adhesive agent 2 is melted, vacuum drawing is suspended, how ever, high pressure gas is applied continuously to the spatial part 19 through the vent hole 20 until the adhesive agent 2 is cured.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21781887A JPS6461229A (en) | 1987-09-02 | 1987-09-02 | Molding mold for multi-layer printed board and molding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21781887A JPS6461229A (en) | 1987-09-02 | 1987-09-02 | Molding mold for multi-layer printed board and molding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6461229A true JPS6461229A (en) | 1989-03-08 |
Family
ID=16710222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21781887A Pending JPS6461229A (en) | 1987-09-02 | 1987-09-02 | Molding mold for multi-layer printed board and molding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6461229A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02292897A (en) * | 1989-05-08 | 1990-12-04 | Hitachi Ltd | Manufacture of multilayer printed board and measuring jig plate |
JP2008162286A (en) * | 2006-12-28 | 2008-07-17 | United Technol Corp <Utc> | Tool for laminating metal foil and polymer film and method for producing laminate structure |
CN108012462A (en) * | 2017-11-07 | 2018-05-08 | 上海御渡半导体科技有限公司 | A kind of application method of the laminating mechanism of the circuit board with clamping device |
-
1987
- 1987-09-02 JP JP21781887A patent/JPS6461229A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02292897A (en) * | 1989-05-08 | 1990-12-04 | Hitachi Ltd | Manufacture of multilayer printed board and measuring jig plate |
JP2008162286A (en) * | 2006-12-28 | 2008-07-17 | United Technol Corp <Utc> | Tool for laminating metal foil and polymer film and method for producing laminate structure |
CN108012462A (en) * | 2017-11-07 | 2018-05-08 | 上海御渡半导体科技有限公司 | A kind of application method of the laminating mechanism of the circuit board with clamping device |
CN108012462B (en) * | 2017-11-07 | 2020-03-31 | 上海御渡半导体科技有限公司 | Application method of pressing mechanism of circuit board with clamping device |
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