JPS6461229A - Molding mold for multi-layer printed board and molding method - Google Patents

Molding mold for multi-layer printed board and molding method

Info

Publication number
JPS6461229A
JPS6461229A JP21781887A JP21781887A JPS6461229A JP S6461229 A JPS6461229 A JP S6461229A JP 21781887 A JP21781887 A JP 21781887A JP 21781887 A JP21781887 A JP 21781887A JP S6461229 A JPS6461229 A JP S6461229A
Authority
JP
Japan
Prior art keywords
molds
seal material
air
seal
vent hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21781887A
Other languages
Japanese (ja)
Inventor
Masayuki Kyoi
Hideyasu Murooka
Noriaki Ujiie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP21781887A priority Critical patent/JPS6461229A/en
Publication of JPS6461229A publication Critical patent/JPS6461229A/en
Pending legal-status Critical Current

Links

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To obtain a multi-layer printed board which controls a void and possesses stabilized capacity, by a method wherein when a mold is pressurized in a vertical direction, a seal material is shrunk and an air passage between the open air and an outer frame for the seal is interrupted through elasticity of the seal material. CONSTITUTION:Air within a spatial part 19 is removed through a vent hole 20 prior to setting up of a laminated body 3 among a top and bottom molds 13, 14. Then the laminated body 3 is set up, a top and bottom hot plates 8, 9, which are kept heated at a predetermined temperature, are actuated by a press and the top and bottom molds 13, 14 are pressurized. Although a seal material 16 is compressed when a space between the molds 13, 14 is compressed through this pressurization, the each seal material 16 is repelled through its elasticity and seals a space among the molds 13, 14 and the outer frame 18 of the seal at this time. When the spatial part 19 is inter rupted from the open air, the air is removed through the vent hole 20 and the inside is vacuous. When an adhesive agent 2 is melted, vacuum drawing is suspended, how ever, high pressure gas is applied continuously to the spatial part 19 through the vent hole 20 until the adhesive agent 2 is cured.
JP21781887A 1987-09-02 1987-09-02 Molding mold for multi-layer printed board and molding method Pending JPS6461229A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21781887A JPS6461229A (en) 1987-09-02 1987-09-02 Molding mold for multi-layer printed board and molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21781887A JPS6461229A (en) 1987-09-02 1987-09-02 Molding mold for multi-layer printed board and molding method

Publications (1)

Publication Number Publication Date
JPS6461229A true JPS6461229A (en) 1989-03-08

Family

ID=16710222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21781887A Pending JPS6461229A (en) 1987-09-02 1987-09-02 Molding mold for multi-layer printed board and molding method

Country Status (1)

Country Link
JP (1) JPS6461229A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02292897A (en) * 1989-05-08 1990-12-04 Hitachi Ltd Manufacture of multilayer printed board and measuring jig plate
JP2008162286A (en) * 2006-12-28 2008-07-17 United Technol Corp <Utc> Tool for laminating metal foil and polymer film and method for producing laminate structure
CN108012462A (en) * 2017-11-07 2018-05-08 上海御渡半导体科技有限公司 A kind of application method of the laminating mechanism of the circuit board with clamping device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02292897A (en) * 1989-05-08 1990-12-04 Hitachi Ltd Manufacture of multilayer printed board and measuring jig plate
JP2008162286A (en) * 2006-12-28 2008-07-17 United Technol Corp <Utc> Tool for laminating metal foil and polymer film and method for producing laminate structure
CN108012462A (en) * 2017-11-07 2018-05-08 上海御渡半导体科技有限公司 A kind of application method of the laminating mechanism of the circuit board with clamping device
CN108012462B (en) * 2017-11-07 2020-03-31 上海御渡半导体科技有限公司 Application method of pressing mechanism of circuit board with clamping device

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