JPS646087U - - Google Patents
Info
- Publication number
- JPS646087U JPS646087U JP1987100893U JP10089387U JPS646087U JP S646087 U JPS646087 U JP S646087U JP 1987100893 U JP1987100893 U JP 1987100893U JP 10089387 U JP10089387 U JP 10089387U JP S646087 U JPS646087 U JP S646087U
- Authority
- JP
- Japan
- Prior art keywords
- power element
- case
- resin
- state contactor
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005192 partition Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987100893U JPS646087U (fr) | 1987-06-30 | 1987-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987100893U JPS646087U (fr) | 1987-06-30 | 1987-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS646087U true JPS646087U (fr) | 1989-01-13 |
Family
ID=31329384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987100893U Pending JPS646087U (fr) | 1987-06-30 | 1987-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS646087U (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7161298B2 (en) | 2002-05-17 | 2007-01-09 | Matsushita Electric Industrial Co., Ltd. | Plasma display unit |
| US7871542B2 (en) | 2001-10-30 | 2011-01-18 | Hitachi, Ltd. | Plasma display device, luminescent device and image and information display system using the same |
-
1987
- 1987-06-30 JP JP1987100893U patent/JPS646087U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7871542B2 (en) | 2001-10-30 | 2011-01-18 | Hitachi, Ltd. | Plasma display device, luminescent device and image and information display system using the same |
| US7161298B2 (en) | 2002-05-17 | 2007-01-09 | Matsushita Electric Industrial Co., Ltd. | Plasma display unit |