JPS6457677U - - Google Patents
Info
- Publication number
- JPS6457677U JPS6457677U JP15095687U JP15095687U JPS6457677U JP S6457677 U JPS6457677 U JP S6457677U JP 15095687 U JP15095687 U JP 15095687U JP 15095687 U JP15095687 U JP 15095687U JP S6457677 U JPS6457677 U JP S6457677U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- printed board
- land
- lands
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 5
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15095687U JPS6457677U (US08063081-20111122-C00044.png) | 1987-09-30 | 1987-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15095687U JPS6457677U (US08063081-20111122-C00044.png) | 1987-09-30 | 1987-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6457677U true JPS6457677U (US08063081-20111122-C00044.png) | 1989-04-10 |
Family
ID=31424565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15095687U Pending JPS6457677U (US08063081-20111122-C00044.png) | 1987-09-30 | 1987-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6457677U (US08063081-20111122-C00044.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06223890A (ja) * | 1992-12-10 | 1994-08-12 | Internatl Business Mach Corp <Ibm> | 積層バイアに電気的相互接続点を形成する方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5312078A (en) * | 1976-07-20 | 1978-02-03 | Fujitsu Ltd | Method of producing multilayer printed board |
| JPS5550698A (en) * | 1978-10-11 | 1980-04-12 | Fujitsu Ltd | Method of manufacturing multilayer printed board |
| JPS61263198A (ja) * | 1985-05-16 | 1986-11-21 | 熊谷 彰治郎 | 多層プリント配線板における層間の導通部 |
-
1987
- 1987-09-30 JP JP15095687U patent/JPS6457677U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5312078A (en) * | 1976-07-20 | 1978-02-03 | Fujitsu Ltd | Method of producing multilayer printed board |
| JPS5550698A (en) * | 1978-10-11 | 1980-04-12 | Fujitsu Ltd | Method of manufacturing multilayer printed board |
| JPS61263198A (ja) * | 1985-05-16 | 1986-11-21 | 熊谷 彰治郎 | 多層プリント配線板における層間の導通部 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06223890A (ja) * | 1992-12-10 | 1994-08-12 | Internatl Business Mach Corp <Ibm> | 積層バイアに電気的相互接続点を形成する方法 |
