JPS6457649U - - Google Patents

Info

Publication number

JPS6457649U

JPS6457649U JP15147287U JP15147287U JPS6457649U JP S6457649 U JPS6457649 U JP S6457649U JP 15147287 U JP15147287 U JP 15147287U JP 15147287 U JP15147287 U JP 15147287U JP S6457649 U JPS6457649 U JP S6457649U

Authority

JP

Japan

Prior art keywords

frame

sealing resin

printed wiring

pattern

substrate

Prior art date

1987-10-02

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011347 resin Substances 0.000 claims description 5
• 229920005989 resin Polymers 0.000 claims description 5
• 238000007789 sealing Methods 0.000 claims description 5
• 239000000758 substrate Substances 0.000 claims description 3
• 238000000034 method Methods 0.000 claims description 2
• 239000004065 semiconductor Substances 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 4
• 239000000853 adhesive Substances 0.000 description 1
• 230000001070 adhesive effect Effects 0.000 description 1
• 239000004020 conductor Substances 0.000 description 1