JPS6457015U - - Google Patents
Info
- Publication number
- JPS6457015U JPS6457015U JP15383787U JP15383787U JPS6457015U JP S6457015 U JPS6457015 U JP S6457015U JP 15383787 U JP15383787 U JP 15383787U JP 15383787 U JP15383787 U JP 15383787U JP S6457015 U JPS6457015 U JP S6457015U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- adhesive tape
- rollers
- pair
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 claims description 5
- 239000008188 pellet Substances 0.000 description 2
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図は本考案の第１の実施例を示す斜視図、
第２図は第１図の部分断面図、第３図は本考案の
第２の実施例を示す斜視図、第４図は第３図の部
分断面図、第５図は従来のブレーキング装置を示
す斜視図、第６図は第５図の断面図である。
１……ウエーハ、１ａ，１ｂ……ペレツト、２
……粘着テープ、２ａ，２ｂ……粘着テープ先端
部、２ｃ……ペレツト境界部のテープ、３……カ
バーテープ、４……カバーテープリール、５……
プーリ、６……ベルト、７ａ，７ｂ……テンシヨ
ンドラム、８……加圧調整機構、９……従軸ロー
ラ、１０……主軸ローラ、１１……主軸、１２…
…ハンドル、１３……スタンド、１４……テンシ
ヨンバー。
FIG. 1 is a perspective view showing a first embodiment of the present invention;
FIG. 2 is a partial sectional view of FIG. 1, FIG. 3 is a perspective view showing a second embodiment of the present invention, FIG. 4 is a partial sectional view of FIG. 3, and FIG. 5 is a conventional braking device. FIG. 6 is a sectional view of FIG. 5. 1...Wafer, 1a, 1b...Pellet, 2
...Adhesive tape, 2a, 2b...Adhesive tape tip, 2c...Pellet boundary tape, 3...Cover tape, 4...Cover tape reel, 5...
Pulley, 6...Belt, 7a, 7b...Tension drum, 8...Pressure adjustment mechanism, 9...Slave shaft roller, 10...Main shaft roller, 11...Main shaft, 12...
...Handle, 13...Stand, 14...Tension bar.
Claims (1)
イシング済のウエーハを各々個片に分割するブレ
ーキング装置において、粘着テープ上のウエーハ
に上下から圧接して該ウエーハのブレーキングを
行うローラ対と、該ローラ対間に支えられた状態
の前記粘着テープに対し、テープ送り方向にテン
シヨンを加えるテンシヨン機構とを有することを
特徴とするウエーハブレーキング装置。 A braking device that divides a scribed or diced wafer pasted on an adhesive tape into individual pieces includes: a pair of rollers that press the wafer on the adhesive tape from above and below to brake the wafer; and a pair of rollers. A wafer breaking device comprising: a tension mechanism that applies tension in a tape feeding direction to the adhesive tape supported therebetween.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15383787U JPS6457015U (en) | 1987-10-07 | 1987-10-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15383787U JPS6457015U (en) | 1987-10-07 | 1987-10-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6457015U true JPS6457015U (en) | 1989-04-10 |
Family
ID=31430027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15383787U Pending JPS6457015U (en) | 1987-10-07 | 1987-10-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6457015U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014031002A (en) * | 2012-08-02 | 2014-02-20 | Mitsuboshi Diamond Industrial Co Ltd | Rolling break device for brittle material substrate |
-
1987
- 1987-10-07 JP JP15383787U patent/JPS6457015U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014031002A (en) * | 2012-08-02 | 2014-02-20 | Mitsuboshi Diamond Industrial Co Ltd | Rolling break device for brittle material substrate |
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