JPS6456776U - - Google Patents
Info
- Publication number
- JPS6456776U JPS6456776U JP15358887U JP15358887U JPS6456776U JP S6456776 U JPS6456776 U JP S6456776U JP 15358887 U JP15358887 U JP 15358887U JP 15358887 U JP15358887 U JP 15358887U JP S6456776 U JPS6456776 U JP S6456776U
- Authority
- JP
- Japan
- Prior art keywords
- key
- item storage
- storage case
- detached
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supports Or Holders For Household Use (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15358887U JPS6456776U (ko) | 1987-10-07 | 1987-10-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15358887U JPS6456776U (ko) | 1987-10-07 | 1987-10-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6456776U true JPS6456776U (ko) | 1989-04-10 |
Family
ID=31429565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15358887U Pending JPS6456776U (ko) | 1987-10-07 | 1987-10-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6456776U (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7803221B2 (en) | 2003-08-25 | 2010-09-28 | DIP Tech LTd.. | Ink for ceramic surfaces |
| US7847406B2 (en) | 2002-11-06 | 2010-12-07 | Ricoh Company, Ltd. | Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device |
-
1987
- 1987-10-07 JP JP15358887U patent/JPS6456776U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7847406B2 (en) | 2002-11-06 | 2010-12-07 | Ricoh Company, Ltd. | Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device |
| US7803221B2 (en) | 2003-08-25 | 2010-09-28 | DIP Tech LTd.. | Ink for ceramic surfaces |