JPS6455075U - - Google Patents
Info
- Publication number
- JPS6455075U JPS6455075U JP15156687U JP15156687U JPS6455075U JP S6455075 U JPS6455075 U JP S6455075U JP 15156687 U JP15156687 U JP 15156687U JP 15156687 U JP15156687 U JP 15156687U JP S6455075 U JPS6455075 U JP S6455075U
- Authority
- JP
- Japan
- Prior art keywords
- card
- frame
- card body
- panels
- press molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010408 film Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 6
- 239000013039 cover film Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
第１図は本考案の実施例を示すＩＣカードの断
面図、第２図は従来のＩＣカードの斜視図、第３
図は第２図のＩＣカードの分解斜視図、第４図は
第２図のＩＣカードの問題点を解決するためのＩ
Ｃカードの断面図、第５図は本考案のＩＣカード
に係わるプレス成型前のフレームフイルムの斜視
図、第６図ａ，ｂは第５図のフレームフイルムの
プレス成型方法を示す断面図で、同図ａはプレス
成型前の状態図及び同図ｂはプレス成型後の状態
図、第７図は第５図のフレームフイルムのプレス
成型後の部分斜視図である。
３１……基板、３４……フロントパネル、３５
……バツクパネル、３６……カード本体、３８…
…フレーム、３８―１……薄膜部、３８―２……
厚膜部、３９……カバーフイルム、４０……フレ
ームフイルム。
Figure 1 is a sectional view of an IC card showing an embodiment of the present invention, Figure 2 is a perspective view of a conventional IC card, and Figure 3 is a perspective view of a conventional IC card.
The figure is an exploded perspective view of the IC card shown in Figure 2, and Figure 4 is an exploded perspective view of the IC card shown in Figure 2.
A sectional view of a C card, FIG. 5 is a perspective view of a frame film before press molding related to the IC card of the present invention, and FIGS. 6 a and b are sectional views showing a method of press molding the frame film of FIG. FIG. 7A is a state diagram before press molding, FIG. 7B is a state diagram after press molding, and FIG. 7 is a partial perspective view of the frame film of FIG. 5 after press molding. 31... Board, 34... Front panel, 35
...Back panel, 36...Card body, 38...
...Frame, 38-1...Thin film part, 38-2...
Thick film portion, 39...Cover film, 40...Frame film.
Claims (1)
れたパネルから成るカード本体と、前記カード本
体の外周端部に設けられたフレームと、前記カー
ド本体の表裏各面に貼着されたカバーフイルムと
を備えたＩＣカードにおいて、 前記フレームを樹脂フイルムのプレス成型によ
り一体に形成し、その一体のフレームを前記パネ
ルの間に装着される薄膜部と前記カバーフイルム
が熱融着される厚膜部とで構成したことを特徴と
するＩＣカード。[Claims for Utility Model Registration] A card body consisting of a board and panels provided on each of its front and back surfaces, a frame provided at the outer peripheral edge of the card body, and each front and back surface of the card body. In the IC card, the frame is integrally formed by press molding of a resin film, and the integrated frame is heated between the thin film part attached between the panels and the cover film. An IC card characterized by comprising a thick film part that is fused.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15156687U JPS6455075U (en) | 1987-10-02 | 1987-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15156687U JPS6455075U (en) | 1987-10-02 | 1987-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6455075U true JPS6455075U (en) | 1989-04-05 |
Family
ID=31425723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15156687U Pending JPS6455075U (en) | 1987-10-02 | 1987-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6455075U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0414497A (en) * | 1990-05-07 | 1992-01-20 | Mitsubishi Electric Corp | Thin semiconductor device |
| JPH04161393A (en) * | 1990-10-25 | 1992-06-04 | Ryoden Kasei Co Ltd | Ic card |
-
1987
- 1987-10-02 JP JP15156687U patent/JPS6455075U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0414497A (en) * | 1990-05-07 | 1992-01-20 | Mitsubishi Electric Corp | Thin semiconductor device |
| JPH04161393A (en) * | 1990-10-25 | 1992-06-04 | Ryoden Kasei Co Ltd | Ic card |
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