JPS645475U - - Google Patents

Info

Publication number

JPS645475U

JPS645475U JP9922587U JP9922587U JPS645475U JP S645475 U JPS645475 U JP S645475U JP 9922587 U JP9922587 U JP 9922587U JP 9922587 U JP9922587 U JP 9922587U JP S645475 U JPS645475 U JP S645475U

Authority

JP

Japan

Prior art keywords

wiring board

printed wiring

electronic component

harden

withstand

Prior art date

1987-06-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000853 adhesive Substances 0.000 claims 1
• 230000001070 adhesive effect Effects 0.000 claims 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
• 229910000679 solder Inorganic materials 0.000 claims 1
• 230000037431 insertion Effects 0.000 description 1
• 238000003780 insertion Methods 0.000 description 1

Cited By (1)