JPS645454U - - Google Patents
Info
- Publication number
- JPS645454U JPS645454U JP9743287U JP9743287U JPS645454U JP S645454 U JPS645454 U JP S645454U JP 9743287 U JP9743287 U JP 9743287U JP 9743287 U JP9743287 U JP 9743287U JP S645454 U JPS645454 U JP S645454U
- Authority
- JP
- Japan
- Prior art keywords
- external leads
- lead frame
- planned boundary
- tie bars
- planned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9743287U JPS645454U (xx) | 1987-06-26 | 1987-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9743287U JPS645454U (xx) | 1987-06-26 | 1987-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS645454U true JPS645454U (xx) | 1989-01-12 |
Family
ID=31322899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9743287U Pending JPS645454U (xx) | 1987-06-26 | 1987-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS645454U (xx) |
-
1987
- 1987-06-26 JP JP9743287U patent/JPS645454U/ja active Pending