JPS6453763U - - Google Patents
Info
- Publication number
- JPS6453763U JPS6453763U JP14989887U JP14989887U JPS6453763U JP S6453763 U JPS6453763 U JP S6453763U JP 14989887 U JP14989887 U JP 14989887U JP 14989887 U JP14989887 U JP 14989887U JP S6453763 U JPS6453763 U JP S6453763U
- Authority
- JP
- Japan
- Prior art keywords
- tank
- plating
- supply port
- opened
- plating tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000012530 fluid Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
図面は本考案の一実施例を示し、第１図はメツ
キ装置の側面図でメツキ槽及び回収槽を縦断面し
て示し、第２図は第１図の平面図で一部切欠して
示し、第３図は第１図の３―３断面図、第４図は
メツキ装置の斜視図、第５図は従来のメツキ装置
における一部切欠正面図、第６図はストライプメ
ツキを施こされた帯状被メツキ材の縦断正面図で
ある。
尚、図中、メツキ槽……１、帯状被メツキ材…
…Ｂ、回収槽……３、切溝……１２、供給口……
１１、整流体……２、小孔……２ａとする。
The drawings show one embodiment of the present invention, and FIG. 1 is a side view of the plating device, showing the plating tank and the recovery tank in longitudinal section, and FIG. 2 is a plan view of FIG. 1, partially cut away. , Fig. 3 is a sectional view taken along line 3-3 in Fig. 1, Fig. 4 is a perspective view of the plating device, Fig. 5 is a partially cutaway front view of the conventional plating device, and Fig. 6 is a stripe plating applied. FIG. In addition, in the figure, plating tank...1, band-shaped material to be plated...
...B, Collection tank...3, Cut groove...12, Supply port...
11. Fluid regulator...2. Small hole...2a.
Claims (1)
設置し、メツキ槽の四周壁上縁を同一高さに形成
するとともに短辺側の二側壁に帯状被メツキ材を
立状に走行せしめる切溝を形成し、メツキ槽の底
部には該槽の上縁より溢出する供給量のメツキ液
を供給する供給口を開口し、かつこの供給口に連
通する多数の小孔を開口せる整流体を敷設したメ
ツキ装置。 A long box-shaped plating tank with an open top is installed in the collection tank, and the upper edges of the four peripheral walls of the plating tank are formed at the same height, and strips of the material to be plated are run vertically on the two short side walls. A flow regulator is formed in which a cut groove is formed, a supply port is opened at the bottom of the plating tank for supplying the plating solution in an amount that overflows from the upper edge of the tank, and a number of small holes are opened that communicate with this supply port. Metsuki equipment installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987149898U JPH0647012Y2 (en) | 1987-09-29 | 1987-09-29 | Plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987149898U JPH0647012Y2 (en) | 1987-09-29 | 1987-09-29 | Plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6453763U true JPS6453763U (en) | 1989-04-03 |
| JPH0647012Y2 JPH0647012Y2 (en) | 1994-11-30 |
Family
ID=31422549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987149898U Expired - Lifetime JPH0647012Y2 (en) | 1987-09-29 | 1987-09-29 | Plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0647012Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000160388A (en) * | 1998-11-27 | 2000-06-13 | Nec Yamaguchi Ltd | Lead frame treating device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60131995A (en) * | 1983-12-20 | 1985-07-13 | Toyo Giken Kogyo Kk | Continuous plating method of terminal part of printed wiring board |
| JPS61295395A (en) * | 1985-06-21 | 1986-12-26 | Electroplating Eng Of Japan Co | Brush plating method for connector terminal |
-
1987
- 1987-09-29 JP JP1987149898U patent/JPH0647012Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60131995A (en) * | 1983-12-20 | 1985-07-13 | Toyo Giken Kogyo Kk | Continuous plating method of terminal part of printed wiring board |
| JPS61295395A (en) * | 1985-06-21 | 1986-12-26 | Electroplating Eng Of Japan Co | Brush plating method for connector terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000160388A (en) * | 1998-11-27 | 2000-06-13 | Nec Yamaguchi Ltd | Lead frame treating device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0647012Y2 (en) | 1994-11-30 |
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