JPS6450044A - Resin composition having sensibility for radiant rays - Google Patents

Resin composition having sensibility for radiant rays

Info

Publication number
JPS6450044A
JPS6450044A JP20755087A JP20755087A JPS6450044A JP S6450044 A JPS6450044 A JP S6450044A JP 20755087 A JP20755087 A JP 20755087A JP 20755087 A JP20755087 A JP 20755087A JP S6450044 A JPS6450044 A JP S6450044A
Authority
JP
Japan
Prior art keywords
sensibility
radiant rays
novolak resin
resin
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20755087A
Other languages
Japanese (ja)
Other versions
JP2555620B2 (en
Inventor
Satoshi Miyashita
Hitoshi Oka
Takao Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
Japan Synthetic Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Synthetic Rubber Co Ltd filed Critical Japan Synthetic Rubber Co Ltd
Priority to JP20755087A priority Critical patent/JP2555620B2/en
Publication of JPS6450044A publication Critical patent/JPS6450044A/en
Application granted granted Critical
Publication of JP2555620B2 publication Critical patent/JP2555620B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE:To obtain a resin compsn. having sensibility for radiant rays, having also high developability, high resolution, and high resistance to dry etching by using a specified alkali-soluble novolak resin. CONSTITUTION:The alkali-soluble novolak resin is a novolak resin obtd. by the polycondensation of at least one phenolic compd. expressed by formula I with an aldehydic compd., and the weight average mol.wt. of said novolak resin expressed in terms of polystyrene is 2,000-30,000, and the m.p. is 100-180 deg.C. In formula I, R is -CH3, -C2H5, -C3H7, -C4H9, -OCH3, -OCH2CH3, -CO2CH3, or -CO2CH2CH3; n is 2 or 3. Thus, a resin compsn. having sensibility for radiant rays, having also high developability, high resolution, and high resistance to dry etching is obtd.
JP20755087A 1987-08-21 1987-08-21 Radiation-sensitive resin composition Expired - Fee Related JP2555620B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20755087A JP2555620B2 (en) 1987-08-21 1987-08-21 Radiation-sensitive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20755087A JP2555620B2 (en) 1987-08-21 1987-08-21 Radiation-sensitive resin composition

Publications (2)

Publication Number Publication Date
JPS6450044A true JPS6450044A (en) 1989-02-27
JP2555620B2 JP2555620B2 (en) 1996-11-20

Family

ID=16541590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20755087A Expired - Fee Related JP2555620B2 (en) 1987-08-21 1987-08-21 Radiation-sensitive resin composition

Country Status (1)

Country Link
JP (1) JP2555620B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0293651A (en) * 1988-09-30 1990-04-04 Fuji Photo Film Co Ltd Positive type photoresist composition
JPH02108054A (en) * 1988-10-18 1990-04-19 Japan Synthetic Rubber Co Ltd Radiation sensitive resin composition
US5346799A (en) * 1991-12-23 1994-09-13 Ocg Microelectronic Materials, Inc. Novolak resins and their use in radiation-sensitive compositions wherein the novolak resins are made by condensing 2,6-dimethylphenol, 2,3-dimethylphenol, a para-substituted phenol and an aldehyde
US5407780A (en) * 1989-12-27 1995-04-18 Sumitomo Chemical Company, Limited Radiation-sensitive positive resist composition comprising an alkali-soluble resin made from m-cresol, 2-tert-butl-5-methyl phenol and formaldehyde
EP0786699A1 (en) 1996-01-22 1997-07-30 Fuji Photo Film Co., Ltd. Positive photoresist composition
JP2023098763A (en) * 2021-12-29 2023-07-11 互応化学工業株式会社 Resin composition for resist, method for manufacturing resist film, and patterned resist film

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0293651A (en) * 1988-09-30 1990-04-04 Fuji Photo Film Co Ltd Positive type photoresist composition
JPH02108054A (en) * 1988-10-18 1990-04-19 Japan Synthetic Rubber Co Ltd Radiation sensitive resin composition
US5407780A (en) * 1989-12-27 1995-04-18 Sumitomo Chemical Company, Limited Radiation-sensitive positive resist composition comprising an alkali-soluble resin made from m-cresol, 2-tert-butl-5-methyl phenol and formaldehyde
US5346799A (en) * 1991-12-23 1994-09-13 Ocg Microelectronic Materials, Inc. Novolak resins and their use in radiation-sensitive compositions wherein the novolak resins are made by condensing 2,6-dimethylphenol, 2,3-dimethylphenol, a para-substituted phenol and an aldehyde
EP0786699A1 (en) 1996-01-22 1997-07-30 Fuji Photo Film Co., Ltd. Positive photoresist composition
JP2023098763A (en) * 2021-12-29 2023-07-11 互応化学工業株式会社 Resin composition for resist, method for manufacturing resist film, and patterned resist film

Also Published As

Publication number Publication date
JP2555620B2 (en) 1996-11-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees