JPS6448050U - - Google Patents

Info

Publication number
JPS6448050U
JPS6448050U JP14370087U JP14370087U JPS6448050U JP S6448050 U JPS6448050 U JP S6448050U JP 14370087 U JP14370087 U JP 14370087U JP 14370087 U JP14370087 U JP 14370087U JP S6448050 U JPS6448050 U JP S6448050U
Authority
JP
Japan
Prior art keywords
semiconductor element
lead terminal
view
transmits
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14370087U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14370087U priority Critical patent/JPS6448050U/ja
Publication of JPS6448050U publication Critical patent/JPS6448050U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第１の実施例を示す平面図、
第２図は同上の側面図、第３図は同上の使用状態
の側面図、第４図は本考案の第２の実施例を示す
平面図、第５図は本考案の第３の実施例を示す平
面図、第６図は本考案の第４の実施例を示す平面
図、第７図は本考案の第５の実施例を示す平面図
、第８図は本考案の応用例を示す側面図、第９図
は従来例の平面図、第１０図は同上の側面図、第
１１図は従来例の使用状態を示す側面図である。 １，１１Ａ乃至１１Ｃ，１５Ａ乃至１５Ｃ，１
８Ａ乃至１８Ｃ，２１Ａ乃至２１Ｃ……リード端
子、１ｃ，１２ｃ，１３ｃ，１６ｃ１，１６ｃ２
，１６ｃ３，１９ｃ，２２ｃ，２２ｃ１……折曲
部、２……半導体素子としての磁気センサ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子に接続され、折曲状態でこの半導体
    素子に対する信号の伝送を行う半導体素子用リー
    ド端子において、このリード端子の半導体素子と
    の接続領域近傍に設けられる折曲部を他の部分よ
    りも細く形成したことを特徴とする半導体素子用
    リード端子。
JP14370087U 1987-09-19 1987-09-19 Pending JPS6448050U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14370087U JPS6448050U (ja) 1987-09-19 1987-09-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14370087U JPS6448050U (ja) 1987-09-19 1987-09-19

Publications (1)

Publication Number Publication Date
JPS6448050U true JPS6448050U (ja) 1989-03-24

Family

ID=31410754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14370087U Pending JPS6448050U (ja) 1987-09-19 1987-09-19

Country Status (1)

Country Link
JP (1) JPS6448050U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7889984B2 (en) 2007-11-20 2011-02-15 Olympus Imaging Corp. Focal point detection device of camera and method of detecting focal point thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7889984B2 (en) 2007-11-20 2011-02-15 Olympus Imaging Corp. Focal point detection device of camera and method of detecting focal point thereof

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