JPS6447866A - Sputtering device - Google Patents

Sputtering device

Info

Publication number
JPS6447866A
JPS6447866A JP20453087A JP20453087A JPS6447866A JP S6447866 A JPS6447866 A JP S6447866A JP 20453087 A JP20453087 A JP 20453087A JP 20453087 A JP20453087 A JP 20453087A JP S6447866 A JPS6447866 A JP S6447866A
Authority
JP
Japan
Prior art keywords
target
camera
illuminated
sputtering
sputtering device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20453087A
Other languages
Japanese (ja)
Inventor
Yoshitake Ishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP20453087A priority Critical patent/JPS6447866A/en
Publication of JPS6447866A publication Critical patent/JPS6447866A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

PURPOSE:To easily detect the abnormal state on the surface of a target while keeping a high vacuum by using a camera to photograph the target surface illuminated by an illuminating jig in a sputtering chamber. CONSTITUTION:The light source 6 as the illuminating jig and a mini-camera 3 as the camera device fixed to a variable stage 4 are provided in the sputtering chamber 1. In the sputtering device, the surface of the target 2 is illuminated by the light source 6 while keeping the inside of the chamber 1 at a high vacuum. The illuminated surface of the target 2 is photographed by the mini-camera 3. The photographed image is enlarged and observed, and the abnormal state on the surface is detected. Any trouble in the sputtering device can be easily found at an early stage by this method.
JP20453087A 1987-08-18 1987-08-18 Sputtering device Pending JPS6447866A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20453087A JPS6447866A (en) 1987-08-18 1987-08-18 Sputtering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20453087A JPS6447866A (en) 1987-08-18 1987-08-18 Sputtering device

Publications (1)

Publication Number Publication Date
JPS6447866A true JPS6447866A (en) 1989-02-22

Family

ID=16492065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20453087A Pending JPS6447866A (en) 1987-08-18 1987-08-18 Sputtering device

Country Status (1)

Country Link
JP (1) JPS6447866A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6535628B2 (en) * 1998-10-15 2003-03-18 Applied Materials, Inc. Detection of wafer fragments in a wafer processing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6535628B2 (en) * 1998-10-15 2003-03-18 Applied Materials, Inc. Detection of wafer fragments in a wafer processing apparatus

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