JPS6446159U - - Google Patents
Info
- Publication number
- JPS6446159U JPS6446159U JP1987140773U JP14077387U JPS6446159U JP S6446159 U JPS6446159 U JP S6446159U JP 1987140773 U JP1987140773 U JP 1987140773U JP 14077387 U JP14077387 U JP 14077387U JP S6446159 U JPS6446159 U JP S6446159U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- polishing apparatus
- chuck tables
- self
- wafer polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000013078 crystal Substances 0.000 description 1
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987140773U JPS6446159U (pl) | 1987-09-14 | 1987-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987140773U JPS6446159U (pl) | 1987-09-14 | 1987-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6446159U true JPS6446159U (pl) | 1989-03-22 |
Family
ID=31405252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987140773U Pending JPS6446159U (pl) | 1987-09-14 | 1987-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6446159U (pl) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03149179A (ja) * | 1989-10-30 | 1991-06-25 | Syst Seiko Kk | ハードディスク基板の研削装置 |
| JP2019214109A (ja) * | 2018-06-14 | 2019-12-19 | 東京エレクトロン株式会社 | 加工装置の調整方法及び加工装置 |
-
1987
- 1987-09-14 JP JP1987140773U patent/JPS6446159U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03149179A (ja) * | 1989-10-30 | 1991-06-25 | Syst Seiko Kk | ハードディスク基板の研削装置 |
| JP2019214109A (ja) * | 2018-06-14 | 2019-12-19 | 東京エレクトロン株式会社 | 加工装置の調整方法及び加工装置 |