JPS6444061A - Method of fixing molecular chain - Google Patents

Method of fixing molecular chain

Info

Publication number
JPS6444061A
JPS6444061A JP62201456A JP20145687A JPS6444061A JP S6444061 A JPS6444061 A JP S6444061A JP 62201456 A JP62201456 A JP 62201456A JP 20145687 A JP20145687 A JP 20145687A JP S6444061 A JPS6444061 A JP S6444061A
Authority
JP
Japan
Prior art keywords
substrate
polymer
molecule
point
molecular chain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62201456A
Other languages
Japanese (ja)
Inventor
Seiichi Iwamatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP62201456A priority Critical patent/JPS6444061A/en
Publication of JPS6444061A publication Critical patent/JPS6444061A/en
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To enable disposing and wiring a polymer element on a substrate in a bioelectronics by fixing one end of a polymer chain to one point on the substrate, and fixing the other one end to other one point on the substrate. CONSTITUTION:One end of a polymer chain is secured to one point on a substrate, and other one end is fixed to other one point on the substrate. For example, a lead 2 made of a metal or polymer is formed, for example, insulated substrate 1, a resist film 3 formed with holes is formed on one or both of the leads A, B, and a stationary molecule 4 is formed of specific enzyme or the like in the hole. One end of a molecular chain of polyacetylene is fixed to the molecule 4, other one end of the molecular chain 5 is fixed by a specific enzyme of the molecule 4 or other molecule or an electrostatic method to the hole opened in the film 3 on the other lead 2. Thus, a polymer functional element and wirings in a bio-chip can be disposed and wired in a molecular level.
JP62201456A 1987-08-12 1987-08-12 Method of fixing molecular chain Pending JPS6444061A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62201456A JPS6444061A (en) 1987-08-12 1987-08-12 Method of fixing molecular chain

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62201456A JPS6444061A (en) 1987-08-12 1987-08-12 Method of fixing molecular chain

Publications (1)

Publication Number Publication Date
JPS6444061A true JPS6444061A (en) 1989-02-16

Family

ID=16441393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62201456A Pending JPS6444061A (en) 1987-08-12 1987-08-12 Method of fixing molecular chain

Country Status (1)

Country Link
JP (1) JPS6444061A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5061657A (en) * 1990-07-18 1991-10-29 The United States Of America As Represented By The Secretary Of The Navy Method of making integrated circuit to package electrical connections after encapsulation with an organic polymer
US5119173A (en) * 1990-07-18 1992-06-02 The United States Of America As Represented By The Secretary Of Navy Method of making integrated circuit to package connections
WO1993025003A1 (en) * 1992-06-01 1993-12-09 Yale University Sub-nanoscale electronic systems, devices and processes
US5306593A (en) * 1993-04-02 1994-04-26 Xerox Corporation Suspension polymerized toner treated by starved feed monomer addition process
US5589692A (en) * 1992-06-01 1996-12-31 Yale University Sub-nanoscale electronic systems and devices

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5061657A (en) * 1990-07-18 1991-10-29 The United States Of America As Represented By The Secretary Of The Navy Method of making integrated circuit to package electrical connections after encapsulation with an organic polymer
US5119173A (en) * 1990-07-18 1992-06-02 The United States Of America As Represented By The Secretary Of Navy Method of making integrated circuit to package connections
WO1993025003A1 (en) * 1992-06-01 1993-12-09 Yale University Sub-nanoscale electronic systems, devices and processes
US5589692A (en) * 1992-06-01 1996-12-31 Yale University Sub-nanoscale electronic systems and devices
US5306593A (en) * 1993-04-02 1994-04-26 Xerox Corporation Suspension polymerized toner treated by starved feed monomer addition process

Similar Documents

Publication Publication Date Title
FI863174A0 (en) FASTFAS-IMMUNBESTAEMNING UNDER ANVAENDANDE AV IMMUNREAGENSER IMMOBILISERADE PAO INERTA SYNTETISKA HARTSERS YTOR.
NL179741C (en) A HEAT-CURABLE SILOXAN PRODUCT, AND A SOLID SUBSTRATE COATED WITH THIS SILOXAN PRODUCT.
DE68924363D1 (en) Dielectrically insulated devices at high speed with buried silicide areas and process for their production.
IT8720510A0 (en) COMPOUNDS BASED ON VINYL-AROMATIC POLYMERS WITH HIGH TOUGHNESS AND CHEMICAL RESISTANCE.
NO976057L (en) Electrochemical detection of nucleic acid hybridization
DE3772845D1 (en) RESISTANT, ELECTRICAL COMPOSITION, SUBSTRATES COATED WITH IT AND METHOD FOR THE PRODUCTION THEREOF.
EP0178327A4 (en) Method of manufacturing transparent electrode substrate.
ATE72909T1 (en) CLEAR CONDUCTIVE COATING AND METHOD FOR PRODUCTION.
EP0149317A3 (en) Circuit packaging
NO174245C (en) Liquid composition suitable for forming a printed circuit board substrate, process for making such a composition, and use thereof.
JPS6444061A (en) Method of fixing molecular chain
DK1062104T3 (en) Process for manufacturing a security element
DE68915296D1 (en) Electronic device assembly.
EP0350961A3 (en) Semiconductor device having thin film resistor and method of producing same
ATE251361T1 (en) ELECTRONIC CIRCUIT IN THE NANO SCALE AND METHOD FOR THE PRODUCTION THEREOF
DE59607955D1 (en) AMORPHE COLORED PLATE FROM A CRYSTALLIZABLE THERMOPLAST
ES2009358A6 (en) Coating of pesticide with sulfonated polymers.
DE3574557D1 (en) ELECTRONIC DEVICE OR COMPONENT AND THEIR PRODUCTION.
KR870003234A (en) Plating method of electronic parts
DE3879518D1 (en) ELECTRONIC COMPONENT WITH ROLL FILM AND ITS PRODUCTION PROCESS.
DE3672916D1 (en) THICK LAYER ELECTROLUMINESCENT DEVICES AND METHOD FOR THE PRODUCTION THEREOF.
ATE77301T1 (en) STRETCH-WRAP FILM.
KR840008344A (en) Insecticidal Nitromethylene Derivatives
DE3871049D1 (en) Force transducer.
KR880002778A (en) Manufacturing method of coated sustainable granular fertilizer