JPS6442858U - - Google Patents
Info
- Publication number
- JPS6442858U JPS6442858U JP13581187U JP13581187U JPS6442858U JP S6442858 U JPS6442858 U JP S6442858U JP 13581187 U JP13581187 U JP 13581187U JP 13581187 U JP13581187 U JP 13581187U JP S6442858 U JPS6442858 U JP S6442858U
- Authority
- JP
- Japan
- Prior art keywords
- grindstone
- electrodeposited
- rotary cutting
- base metal
- outer periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010953 base metal Substances 0.000 claims description 4
- 239000006061 abrasive grain Substances 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
第１図は本考案に係る電着回転切断砥石の実施
例を示す砥石刃の縦断面図、第２図は同実施例に
おける台金の砥石台面を示す縦断面図、第３図は
同実施例の砥石と従来品における切断長さと、そ
の時のチツピング巾の関係を示すグラフ、第４図
は従来の回転切断砥石を示す砥石刃の縦断面図で
ある。
１……台金、３……砥粒、４……砥石刃、ｌ…
…被切断物へ与える衝撃巾。
Fig. 1 is a longitudinal sectional view of a grindstone blade showing an embodiment of the electrodeposited rotary cutting grindstone according to the present invention, Fig. 2 is a longitudinal sectional view showing the grindstone base surface of the base metal in the same embodiment, and Fig. 3 is a longitudinal sectional view of the grindstone blade showing an embodiment of the electrodeposited rotary cutting grindstone according to the present invention. A graph showing the relationship between the cutting length and the chipping width in the example grindstone and the conventional product, and FIG. 4 is a longitudinal cross-sectional view of the grindstone blade showing the conventional rotary cutting grindstone. 1...Base metal, 3...Abrasive grain, 4...Whetstone blade, l...
...The width of the impact applied to the object to be cut.
Claims (1)
ド等の砥粒を電着し、連続、又は不連続の砥石刃
を設けてなる電着回転切断砥石において、上記台
金外周の砥石刃の断面形状を台形に形成し、被切
断物へ与える衝撃巾を小さく設けたことを特徴と
する電着回転切断砥石。 In an electrodeposited rotary cutting grindstone in which abrasive grains such as diamond are electrodeposited on the outer periphery of a disk-shaped base metal and its vicinity, and continuous or discontinuous grindstone blades are provided, a cross section of the grindstone blade on the outer periphery of the base metal. An electrodeposited rotary cutting grindstone characterized by having a trapezoidal shape and providing a small impact width to the object to be cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13581187U JPS6442858U (en) | 1987-09-04 | 1987-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13581187U JPS6442858U (en) | 1987-09-04 | 1987-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6442858U true JPS6442858U (en) | 1989-03-14 |
Family
ID=31395743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13581187U Pending JPS6442858U (en) | 1987-09-04 | 1987-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6442858U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996023630A1 (en) * | 1995-02-01 | 1996-08-08 | Hiroshi Ishizuka | Superabrasive electroplated cutting edge and method of manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60197372A (en) * | 1984-03-16 | 1985-10-05 | Toshiba Corp | Dicing blade for semiconductor substrate |
| JPS61111886A (en) * | 1984-11-07 | 1986-05-29 | Matsushita Electric Ind Co Ltd | Electro grinding stone |
-
1987
- 1987-09-04 JP JP13581187U patent/JPS6442858U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60197372A (en) * | 1984-03-16 | 1985-10-05 | Toshiba Corp | Dicing blade for semiconductor substrate |
| JPS61111886A (en) * | 1984-11-07 | 1986-05-29 | Matsushita Electric Ind Co Ltd | Electro grinding stone |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996023630A1 (en) * | 1995-02-01 | 1996-08-08 | Hiroshi Ishizuka | Superabrasive electroplated cutting edge and method of manufacturing the same |