JPS6441183U - - Google Patents

Info

Publication number
JPS6441183U
JPS6441183U JP13553987U JP13553987U JPS6441183U JP S6441183 U JPS6441183 U JP S6441183U JP 13553987 U JP13553987 U JP 13553987U JP 13553987 U JP13553987 U JP 13553987U JP S6441183 U JPS6441183 U JP S6441183U
Authority
JP
Japan
Prior art keywords
bottom plate
plug
unit
plate
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13553987U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13553987U priority Critical patent/JPS6441183U/ja
Publication of JPS6441183U publication Critical patent/JPS6441183U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP13553987U 1987-09-07 1987-09-07 Pending JPS6441183U (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13553987U JPS6441183U (OSRAM) 1987-09-07 1987-09-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13553987U JPS6441183U (OSRAM) 1987-09-07 1987-09-07

Publications (1)

Publication Number Publication Date
JPS6441183U true JPS6441183U (OSRAM) 1989-03-13

Family

ID=31395258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13553987U Pending JPS6441183U (OSRAM) 1987-09-07 1987-09-07

Country Status (1)

Country Link
JP (1) JPS6441183U (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7640647B2 (en) 2005-01-29 2010-01-05 Astrium Limited Method of assembling a packaged high frequency circuit module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7640647B2 (en) 2005-01-29 2010-01-05 Astrium Limited Method of assembling a packaged high frequency circuit module

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