JPS6440210A - Dividing device for printed board - Google Patents

Dividing device for printed board

Info

Publication number
JPS6440210A
JPS6440210A JP19668687A JP19668687A JPS6440210A JP S6440210 A JPS6440210 A JP S6440210A JP 19668687 A JP19668687 A JP 19668687A JP 19668687 A JP19668687 A JP 19668687A JP S6440210 A JPS6440210 A JP S6440210A
Authority
JP
Japan
Prior art keywords
printed board
stage
shaped
cut
disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19668687A
Other languages
Japanese (ja)
Other versions
JPH0455833B2 (en
Inventor
Tokuji Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP19668687A priority Critical patent/JPS6440210A/en
Publication of JPS6440210A publication Critical patent/JPS6440210A/en
Publication of JPH0455833B2 publication Critical patent/JPH0455833B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Nonmetal Cutting Devices (AREA)
  • Shearing Machines (AREA)

Abstract

PURPOSE:To improve dimensional accuracy and to dissolve the strain of a printed board by providing a guide fitting in a V-shaped groove of the printed board and a pair of disc-shaped rotary cutting edges which follows the guide and is opposite to it, and making the printed board pass between the rotary cutting edges to divide it along its V-shaped part. CONSTITUTION:A V-cut groove 11 of a printed board 1 is fittedly inserted between a guide roller of a guide roller part 7 and a guide member 8, and the printed board 1 is moved in a direction indicated by an arrow to be intermittently cut in the form of a perforation with a cutting edge (a) between a disc- shaped rotary cutting edge 9 and a perforation cutting rotary edge 10 in the first stage, and then to be cut with a cutting edge (b) in the second stage at a noncut part in the first stage, and further to be completely cut with disc- shaped rotary cutting edges 9, 12 in the third stage. Thus the dividing of the board 1 through the three separated stages can almost prevent stress from occurring in the board.
JP19668687A 1987-08-05 1987-08-05 Dividing device for printed board Granted JPS6440210A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19668687A JPS6440210A (en) 1987-08-05 1987-08-05 Dividing device for printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19668687A JPS6440210A (en) 1987-08-05 1987-08-05 Dividing device for printed board

Publications (2)

Publication Number Publication Date
JPS6440210A true JPS6440210A (en) 1989-02-10
JPH0455833B2 JPH0455833B2 (en) 1992-09-04

Family

ID=16361908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19668687A Granted JPS6440210A (en) 1987-08-05 1987-08-05 Dividing device for printed board

Country Status (1)

Country Link
JP (1) JPS6440210A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04115896A (en) * 1990-09-05 1992-04-16 C T M:Kk Cutting method for printed resin board
JPH04130471U (en) * 1991-05-22 1992-11-30 勝一 原 printed circuit board cutting equipment
JPH0580699U (en) * 1992-04-14 1993-11-02 富士通テン株式会社 Substrate dividing device
JPH0582069U (en) * 1992-04-07 1993-11-05 富士通テン株式会社 Substrate dividing device
KR100347794B1 (en) * 2000-11-02 2002-08-07 김태성 Cutting device for print circuit board
US8356536B2 (en) * 2003-01-12 2013-01-22 Madern Jean Henry Robert Installation for making a cut, crease and the like having a plate-shaped frame
WO2014002147A1 (en) * 2012-06-29 2014-01-03 三菱電機株式会社 Method for manufacturing heat exchanger, heat exchanger, and air conditioner
CN112235960A (en) * 2020-10-28 2021-01-15 惠州市特创电子科技有限公司 Gold immersion circuit board and preparation method thereof

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04115896A (en) * 1990-09-05 1992-04-16 C T M:Kk Cutting method for printed resin board
JPH04130471U (en) * 1991-05-22 1992-11-30 勝一 原 printed circuit board cutting equipment
JPH0582069U (en) * 1992-04-07 1993-11-05 富士通テン株式会社 Substrate dividing device
JPH0580699U (en) * 1992-04-14 1993-11-02 富士通テン株式会社 Substrate dividing device
KR100347794B1 (en) * 2000-11-02 2002-08-07 김태성 Cutting device for print circuit board
US8356536B2 (en) * 2003-01-12 2013-01-22 Madern Jean Henry Robert Installation for making a cut, crease and the like having a plate-shaped frame
WO2014002147A1 (en) * 2012-06-29 2014-01-03 三菱電機株式会社 Method for manufacturing heat exchanger, heat exchanger, and air conditioner
CN104334996A (en) * 2012-06-29 2015-02-04 三菱电机株式会社 Method for manufacturing heat exchanger, and air conditioner
JPWO2014002147A1 (en) * 2012-06-29 2016-05-26 三菱電機株式会社 Manufacturing method of heat exchanger
CN104334996B (en) * 2012-06-29 2016-08-24 三菱电机株式会社 Method for manufacturing heat exchanger, and air conditioner
US9816761B2 (en) 2012-06-29 2017-11-14 Mitsubishi Electric Corporation Method for manufacturing heat exchanger
CN112235960A (en) * 2020-10-28 2021-01-15 惠州市特创电子科技有限公司 Gold immersion circuit board and preparation method thereof
CN112235960B (en) * 2020-10-28 2022-05-17 惠州市特创电子科技股份有限公司 Gold immersion circuit board and preparation method thereof

Also Published As

Publication number Publication date
JPH0455833B2 (en) 1992-09-04

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term