JPS6440210A - Dividing device for printed board - Google Patents
Dividing device for printed boardInfo
- Publication number
- JPS6440210A JPS6440210A JP19668687A JP19668687A JPS6440210A JP S6440210 A JPS6440210 A JP S6440210A JP 19668687 A JP19668687 A JP 19668687A JP 19668687 A JP19668687 A JP 19668687A JP S6440210 A JPS6440210 A JP S6440210A
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- stage
- shaped
- cut
- disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Nonmetal Cutting Devices (AREA)
- Shearing Machines (AREA)
Abstract
PURPOSE:To improve dimensional accuracy and to dissolve the strain of a printed board by providing a guide fitting in a V-shaped groove of the printed board and a pair of disc-shaped rotary cutting edges which follows the guide and is opposite to it, and making the printed board pass between the rotary cutting edges to divide it along its V-shaped part. CONSTITUTION:A V-cut groove 11 of a printed board 1 is fittedly inserted between a guide roller of a guide roller part 7 and a guide member 8, and the printed board 1 is moved in a direction indicated by an arrow to be intermittently cut in the form of a perforation with a cutting edge (a) between a disc- shaped rotary cutting edge 9 and a perforation cutting rotary edge 10 in the first stage, and then to be cut with a cutting edge (b) in the second stage at a noncut part in the first stage, and further to be completely cut with disc- shaped rotary cutting edges 9, 12 in the third stage. Thus the dividing of the board 1 through the three separated stages can almost prevent stress from occurring in the board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19668687A JPS6440210A (en) | 1987-08-05 | 1987-08-05 | Dividing device for printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19668687A JPS6440210A (en) | 1987-08-05 | 1987-08-05 | Dividing device for printed board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6440210A true JPS6440210A (en) | 1989-02-10 |
JPH0455833B2 JPH0455833B2 (en) | 1992-09-04 |
Family
ID=16361908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19668687A Granted JPS6440210A (en) | 1987-08-05 | 1987-08-05 | Dividing device for printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6440210A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04115896A (en) * | 1990-09-05 | 1992-04-16 | C T M:Kk | Cutting method for printed resin board |
JPH04130471U (en) * | 1991-05-22 | 1992-11-30 | 勝一 原 | printed circuit board cutting equipment |
JPH0580699U (en) * | 1992-04-14 | 1993-11-02 | 富士通テン株式会社 | Substrate dividing device |
JPH0582069U (en) * | 1992-04-07 | 1993-11-05 | 富士通テン株式会社 | Substrate dividing device |
KR100347794B1 (en) * | 2000-11-02 | 2002-08-07 | 김태성 | Cutting device for print circuit board |
US8356536B2 (en) * | 2003-01-12 | 2013-01-22 | Madern Jean Henry Robert | Installation for making a cut, crease and the like having a plate-shaped frame |
WO2014002147A1 (en) * | 2012-06-29 | 2014-01-03 | 三菱電機株式会社 | Method for manufacturing heat exchanger, heat exchanger, and air conditioner |
CN112235960A (en) * | 2020-10-28 | 2021-01-15 | 惠州市特创电子科技有限公司 | Gold immersion circuit board and preparation method thereof |
-
1987
- 1987-08-05 JP JP19668687A patent/JPS6440210A/en active Granted
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04115896A (en) * | 1990-09-05 | 1992-04-16 | C T M:Kk | Cutting method for printed resin board |
JPH04130471U (en) * | 1991-05-22 | 1992-11-30 | 勝一 原 | printed circuit board cutting equipment |
JPH0582069U (en) * | 1992-04-07 | 1993-11-05 | 富士通テン株式会社 | Substrate dividing device |
JPH0580699U (en) * | 1992-04-14 | 1993-11-02 | 富士通テン株式会社 | Substrate dividing device |
KR100347794B1 (en) * | 2000-11-02 | 2002-08-07 | 김태성 | Cutting device for print circuit board |
US8356536B2 (en) * | 2003-01-12 | 2013-01-22 | Madern Jean Henry Robert | Installation for making a cut, crease and the like having a plate-shaped frame |
WO2014002147A1 (en) * | 2012-06-29 | 2014-01-03 | 三菱電機株式会社 | Method for manufacturing heat exchanger, heat exchanger, and air conditioner |
CN104334996A (en) * | 2012-06-29 | 2015-02-04 | 三菱电机株式会社 | Method for manufacturing heat exchanger, and air conditioner |
JPWO2014002147A1 (en) * | 2012-06-29 | 2016-05-26 | 三菱電機株式会社 | Manufacturing method of heat exchanger |
CN104334996B (en) * | 2012-06-29 | 2016-08-24 | 三菱电机株式会社 | Method for manufacturing heat exchanger, and air conditioner |
US9816761B2 (en) | 2012-06-29 | 2017-11-14 | Mitsubishi Electric Corporation | Method for manufacturing heat exchanger |
CN112235960A (en) * | 2020-10-28 | 2021-01-15 | 惠州市特创电子科技有限公司 | Gold immersion circuit board and preparation method thereof |
CN112235960B (en) * | 2020-10-28 | 2022-05-17 | 惠州市特创电子科技股份有限公司 | Gold immersion circuit board and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPH0455833B2 (en) | 1992-09-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |