JPS6439728U - - Google Patents

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Publication number
JPS6439728U
JPS6439728U JP13534987U JP13534987U JPS6439728U JP S6439728 U JPS6439728 U JP S6439728U JP 13534987 U JP13534987 U JP 13534987U JP 13534987 U JP13534987 U JP 13534987U JP S6439728 U JPS6439728 U JP S6439728U
Authority
JP
Japan
Prior art keywords
tips
extends
tubes
water
pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13534987U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0423551Y2 (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987135349U priority Critical patent/JPH0423551Y2/ja
Publication of JPS6439728U publication Critical patent/JPS6439728U/ja
Application granted granted Critical
Publication of JPH0423551Y2 publication Critical patent/JPH0423551Y2/ja
Expired legal-status Critical Current

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  • Massaging Devices (AREA)
JP1987135349U 1987-09-04 1987-09-04 Expired JPH0423551Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987135349U JPH0423551Y2 (cs) 1987-09-04 1987-09-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987135349U JPH0423551Y2 (cs) 1987-09-04 1987-09-04

Publications (2)

Publication Number Publication Date
JPS6439728U true JPS6439728U (cs) 1989-03-09
JPH0423551Y2 JPH0423551Y2 (cs) 1992-06-02

Family

ID=31394893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987135349U Expired JPH0423551Y2 (cs) 1987-09-04 1987-09-04

Country Status (1)

Country Link
JP (1) JPH0423551Y2 (cs)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0578229U (ja) * 1992-03-30 1993-10-26 株式会社イナックス 浴 槽
US7137353B2 (en) 2002-09-30 2006-11-21 Tokyo Electron Limited Method and apparatus for an improved deposition shield in a plasma processing system
US7147749B2 (en) 2002-09-30 2006-12-12 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
US7163585B2 (en) 2002-09-30 2007-01-16 Tokyo Electron Limited Method and apparatus for an improved optical window deposition shield in a plasma processing system
US7166200B2 (en) 2002-09-30 2007-01-23 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate in a plasma processing system
US7166166B2 (en) 2002-09-30 2007-01-23 Tokyo Electron Limited Method and apparatus for an improved baffle plate in a plasma processing system
US7204912B2 (en) 2002-09-30 2007-04-17 Tokyo Electron Limited Method and apparatus for an improved bellows shield in a plasma processing system
US7282112B2 (en) 2002-09-30 2007-10-16 Tokyo Electron Limited Method and apparatus for an improved baffle plate in a plasma processing system
US7291566B2 (en) 2003-03-31 2007-11-06 Tokyo Electron Limited Barrier layer for a processing element and a method of forming the same
US7364798B2 (en) 1999-12-10 2008-04-29 Tocalo Co., Ltd. Internal member for plasma-treating vessel and method of producing the same
US7494723B2 (en) 2005-07-29 2009-02-24 Tocalo Co., Ltd. Y2O3 spray-coated member and production method thereof
US7552521B2 (en) 2004-12-08 2009-06-30 Tokyo Electron Limited Method and apparatus for improved baffle plate
US7560376B2 (en) 2003-03-31 2009-07-14 Tokyo Electron Limited Method for adjoining adjacent coatings on a processing element
US7601242B2 (en) 2005-01-11 2009-10-13 Tokyo Electron Limited Plasma processing system and baffle assembly for use in plasma processing system
US7648782B2 (en) 2006-03-20 2010-01-19 Tokyo Electron Limited Ceramic coating member for semiconductor processing apparatus
US7767268B2 (en) 2005-09-08 2010-08-03 Tocalo Co., Ltd. Spray-coated member having an excellent resistance to plasma erosion and method of producing the same
US7850864B2 (en) 2006-03-20 2010-12-14 Tokyo Electron Limited Plasma treating apparatus and plasma treating method
US8877002B2 (en) 2002-11-28 2014-11-04 Tokyo Electron Limited Internal member of a plasma processing vessel

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6180026U (cs) * 1984-10-30 1986-05-28
JPS624329U (cs) * 1985-06-25 1987-01-12

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6180026U (cs) * 1984-10-30 1986-05-28
JPS624329U (cs) * 1985-06-25 1987-01-12

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0578229U (ja) * 1992-03-30 1993-10-26 株式会社イナックス 浴 槽
US7364798B2 (en) 1999-12-10 2008-04-29 Tocalo Co., Ltd. Internal member for plasma-treating vessel and method of producing the same
US7163585B2 (en) 2002-09-30 2007-01-16 Tokyo Electron Limited Method and apparatus for an improved optical window deposition shield in a plasma processing system
US7147749B2 (en) 2002-09-30 2006-12-12 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
US7166200B2 (en) 2002-09-30 2007-01-23 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate in a plasma processing system
US7166166B2 (en) 2002-09-30 2007-01-23 Tokyo Electron Limited Method and apparatus for an improved baffle plate in a plasma processing system
US7204912B2 (en) 2002-09-30 2007-04-17 Tokyo Electron Limited Method and apparatus for an improved bellows shield in a plasma processing system
US7282112B2 (en) 2002-09-30 2007-10-16 Tokyo Electron Limited Method and apparatus for an improved baffle plate in a plasma processing system
US7137353B2 (en) 2002-09-30 2006-11-21 Tokyo Electron Limited Method and apparatus for an improved deposition shield in a plasma processing system
US7566379B2 (en) 2002-09-30 2009-07-28 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
US7566368B2 (en) 2002-09-30 2009-07-28 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate in a plasma processing system
US8877002B2 (en) 2002-11-28 2014-11-04 Tokyo Electron Limited Internal member of a plasma processing vessel
US7291566B2 (en) 2003-03-31 2007-11-06 Tokyo Electron Limited Barrier layer for a processing element and a method of forming the same
US7560376B2 (en) 2003-03-31 2009-07-14 Tokyo Electron Limited Method for adjoining adjacent coatings on a processing element
US7552521B2 (en) 2004-12-08 2009-06-30 Tokyo Electron Limited Method and apparatus for improved baffle plate
US7601242B2 (en) 2005-01-11 2009-10-13 Tokyo Electron Limited Plasma processing system and baffle assembly for use in plasma processing system
US7494723B2 (en) 2005-07-29 2009-02-24 Tocalo Co., Ltd. Y2O3 spray-coated member and production method thereof
US7767268B2 (en) 2005-09-08 2010-08-03 Tocalo Co., Ltd. Spray-coated member having an excellent resistance to plasma erosion and method of producing the same
US7648782B2 (en) 2006-03-20 2010-01-19 Tokyo Electron Limited Ceramic coating member for semiconductor processing apparatus
US7850864B2 (en) 2006-03-20 2010-12-14 Tokyo Electron Limited Plasma treating apparatus and plasma treating method

Also Published As

Publication number Publication date
JPH0423551Y2 (cs) 1992-06-02

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