JPS6438774U - - Google Patents
Info
- Publication number
- JPS6438774U JPS6438774U JP13376987U JP13376987U JPS6438774U JP S6438774 U JPS6438774 U JP S6438774U JP 13376987 U JP13376987 U JP 13376987U JP 13376987 U JP13376987 U JP 13376987U JP S6438774 U JPS6438774 U JP S6438774U
- Authority
- JP
- Japan
- Prior art keywords
- tube
- solder
- heat
- flat
- solder piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000010586 diagram Methods 0.000 description 4
Description
第１図は本考案の半田入り熱収縮チユーブの説
明図、第２図、第３図は、第１図の半田入り熱収
縮チユーブに外力が加わつても半田が変形しない
説明図、第４図は半田が変形する唯一の外力の方
向を示す図、第５図は実施例１の説明図、第６図
は実施例２の説明図、第７図〜第１０図は従来例
に関するもので、第７図は半田リングの接触長さ
がチユーブ内周の大部分を占める場合を示し、イ
は縦断面図、ロは横断面図、第８図は第７図の半
田入り熱収縮チユーブが外力により変形する説明
図、第９図はチユーブ内周に占める半田板接触長
の比率は小さいが、チユーブの軸に対し、傾斜し
ているため、接触長さのチユーブ内周に占める比
率が大きい場合と同じように外力により半田板の
変形が起きやすい説明図で、イは縦断面図、ロは
横断面図、第１０図は第９図の半田入り熱収縮チ
ユーブが外力により変形された説明図である。
１……平板状半田片、２……熱収縮チユーブ、
３……凹部、４……半田リング、５……半田板。
Figure 1 is an explanatory diagram of the solder-filled heat-shrinkable tube of the present invention, Figures 2 and 3 are explanatory diagrams of the solder-filled heat-shrinkable tube of Figure 1 in which the solder does not deform even when an external force is applied, and Figure 4 5 is an explanatory diagram of the first embodiment, FIG. 6 is an explanatory diagram of the second embodiment, and FIGS. 7 to 10 are related to the conventional example. Figure 7 shows the case where the contact length of the solder ring occupies most of the inner circumference of the tube. In Figure 9, the ratio of the contact length of the solder plate to the inner circumference of the tube is small, but since it is inclined to the axis of the tube, the ratio of the contact length to the inner circumference of the tube is large. Similarly to , the solder plate is easily deformed by external force. A is a longitudinal cross-sectional view, B is a cross-sectional view, and Fig. 10 is an explanatory view of the solder-filled heat shrink tube of Fig. 9 being deformed by external force. It is. 1...Flat solder piece, 2...Heat shrink tube,
3... recess, 4... solder ring, 5... solder plate.
Claims (1)
板状半田片からなり、前記平板状半田片の平板面
が前記熱収縮チユーブの軸に平行で、かつ前記平
板状半田片が、前記熱収縮チユーブの不完全収縮
により該チユーブの内部面に前記半田片の両端面
と当接して形成された凹部により保持されている
ことを特徴とする半田入り熱収縮チユーブ。 It consists of a heat-shrink tube and a flat solder piece provided inside the tube, and the flat surface of the flat solder piece is parallel to the axis of the heat-shrink tube, and the flat solder piece is parallel to the axis of the heat-shrink tube. 1. A solder-filled heat-shrinkable tube, characterized in that the solder-filled heat-shrinkable tube is held by recesses formed on the inner surface of the tube in contact with both end surfaces of the solder piece due to incomplete shrinkage.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13376987U JPS6438774U (en) | 1987-08-31 | 1987-08-31 | |
| US07/230,232 US4865244A (en) | 1987-08-31 | 1988-08-09 | Solder-containing heat-shrinkable tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13376987U JPS6438774U (en) | 1987-08-31 | 1987-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6438774U true JPS6438774U (en) | 1989-03-08 |
Family
ID=31391936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13376987U Pending JPS6438774U (en) | 1987-08-31 | 1987-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6438774U (en) |
-
1987
- 1987-08-31 JP JP13376987U patent/JPS6438774U/ja active Pending
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