JPS6438209U - - Google Patents
Info
- Publication number
- JPS6438209U JPS6438209U JP13183187U JP13183187U JPS6438209U JP S6438209 U JPS6438209 U JP S6438209U JP 13183187 U JP13183187 U JP 13183187U JP 13183187 U JP13183187 U JP 13183187U JP S6438209 U JPS6438209 U JP S6438209U
- Authority
- JP
- Japan
- Prior art keywords
- chuck device
- collect
- sleeve
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 description 1
Description
第1図は、スリーブの正面と側面の図で外径と
内径がE′だけ偏心している。第2図は、スリー
ブ1をつけたコレツトチヤツク装置3をスクロー
ルチヤツク爪2に喰えたときの正面と側面の図で
ある。スクロールチヤツク爪で喰えた場合の中心
をP、旋盤の回転中心をP′としその偏心量をE
としたものである。
内径がE′だけ偏心している。第2図は、スリー
ブ1をつけたコレツトチヤツク装置3をスクロー
ルチヤツク爪2に喰えたときの正面と側面の図で
ある。スクロールチヤツク爪で喰えた場合の中心
をP、旋盤の回転中心をP′としその偏心量をE
としたものである。
Claims (1)
- コレツトチヤツク装置のスクロールチヤツクに
喰えられる外周部に、内径と外径の偏心したスリ
ーブをつけたコレツトチヤツク装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13183187U JPS6438209U (ja) | 1987-08-29 | 1987-08-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13183187U JPS6438209U (ja) | 1987-08-29 | 1987-08-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6438209U true JPS6438209U (ja) | 1989-03-07 |
Family
ID=31388256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13183187U Pending JPS6438209U (ja) | 1987-08-29 | 1987-08-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6438209U (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7396742B2 (en) | 2000-09-13 | 2008-07-08 | Hamamatsu Photonics K.K. | Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object |
US8889525B2 (en) | 2002-03-12 | 2014-11-18 | Hamamatsu Photonics K.K. | Substrate dividing method |
US8969752B2 (en) | 2003-03-12 | 2015-03-03 | Hamamatsu Photonics K.K. | Laser processing method |
-
1987
- 1987-08-29 JP JP13183187U patent/JPS6438209U/ja active Pending
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8969761B2 (en) | 2000-09-13 | 2015-03-03 | Hamamatsu Photonics K.K. | Method of cutting a wafer-like object and semiconductor chip |
US7547613B2 (en) | 2000-09-13 | 2009-06-16 | Hamamatsu Photonics K.K. | Laser processing method and laser processing apparatus |
US7592238B2 (en) | 2000-09-13 | 2009-09-22 | Hamamatsu Photonics K.K. | Laser processing method and laser processing apparatus |
US7615721B2 (en) | 2000-09-13 | 2009-11-10 | Hamamatsu Photonics K.K. | Laser processing method and laser processing apparatus |
US7626137B2 (en) | 2000-09-13 | 2009-12-01 | Hamamatsu Photonics K.K. | Laser cutting by forming a modified region within an object and generating fractures |
US7396742B2 (en) | 2000-09-13 | 2008-07-08 | Hamamatsu Photonics K.K. | Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object |
US8927900B2 (en) | 2000-09-13 | 2015-01-06 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device |
US8933369B2 (en) | 2000-09-13 | 2015-01-13 | Hamamatsu Photonics K.K. | Method of cutting a substrate and method of manufacturing a semiconductor device |
US8937264B2 (en) | 2000-09-13 | 2015-01-20 | Hamamatsu Photonics K.K. | Laser processing method and laser processing apparatus |
US8946589B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device |
US8946592B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Laser processing method and laser processing apparatus |
US8946591B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of manufacturing a semiconductor device formed using a substrate cutting method |
US8889525B2 (en) | 2002-03-12 | 2014-11-18 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9142458B2 (en) | 2002-03-12 | 2015-09-22 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9287177B2 (en) | 2002-03-12 | 2016-03-15 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9543256B2 (en) | 2002-03-12 | 2017-01-10 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9543207B2 (en) | 2002-03-12 | 2017-01-10 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9548246B2 (en) | 2002-03-12 | 2017-01-17 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9553023B2 (en) | 2002-03-12 | 2017-01-24 | Hamamatsu Photonics K.K. | Substrate dividing method |
US8969752B2 (en) | 2003-03-12 | 2015-03-03 | Hamamatsu Photonics K.K. | Laser processing method |