JPS64371U - - Google Patents
Info
- Publication number
- JPS64371U JPS64371U JP9386387U JP9386387U JPS64371U JP S64371 U JPS64371 U JP S64371U JP 9386387 U JP9386387 U JP 9386387U JP 9386387 U JP9386387 U JP 9386387U JP S64371 U JPS64371 U JP S64371U
- Authority
- JP
- Japan
- Prior art keywords
- multilayer wiring
- wiring board
- board
- laminated
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012790 confirmation Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 238000003475 lamination Methods 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9386387U JPS64371U (is) | 1987-06-18 | 1987-06-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9386387U JPS64371U (is) | 1987-06-18 | 1987-06-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS64371U true JPS64371U (is) | 1989-01-05 |
Family
ID=30956808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9386387U Pending JPS64371U (is) | 1987-06-18 | 1987-06-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS64371U (is) |
-
1987
- 1987-06-18 JP JP9386387U patent/JPS64371U/ja active Pending