JPS6435794U - - Google Patents
Info
- Publication number
- JPS6435794U JPS6435794U JP1987129483U JP12948387U JPS6435794U JP S6435794 U JPS6435794 U JP S6435794U JP 1987129483 U JP1987129483 U JP 1987129483U JP 12948387 U JP12948387 U JP 12948387U JP S6435794 U JPS6435794 U JP S6435794U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- cooling plate
- flange portion
- ring
- refrigerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 12
- 239000003507 refrigerant Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987129483U JPH0530394Y2 (US06811534-20041102-M00003.png) | 1987-08-26 | 1987-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987129483U JPH0530394Y2 (US06811534-20041102-M00003.png) | 1987-08-26 | 1987-08-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6435794U true JPS6435794U (US06811534-20041102-M00003.png) | 1989-03-03 |
| JPH0530394Y2 JPH0530394Y2 (US06811534-20041102-M00003.png) | 1993-08-03 |
Family
ID=31383799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987129483U Expired - Lifetime JPH0530394Y2 (US06811534-20041102-M00003.png) | 1987-08-26 | 1987-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0530394Y2 (US06811534-20041102-M00003.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737258U (US06811534-20041102-M00003.png) * | 1980-08-11 | 1982-02-27 | ||
| JPS6267844A (ja) * | 1985-09-20 | 1987-03-27 | Fujitsu Ltd | 冷却構造 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7606193A (nl) * | 1976-06-09 | 1977-12-13 | Philips Nv | Geintegreerde schakeling. |
-
1987
- 1987-08-26 JP JP1987129483U patent/JPH0530394Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737258U (US06811534-20041102-M00003.png) * | 1980-08-11 | 1982-02-27 | ||
| JPS6267844A (ja) * | 1985-09-20 | 1987-03-27 | Fujitsu Ltd | 冷却構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0530394Y2 (US06811534-20041102-M00003.png) | 1993-08-03 |
