JPS6435755U - - Google Patents
Info
- Publication number
- JPS6435755U JPS6435755U JP13061387U JP13061387U JPS6435755U JP S6435755 U JPS6435755 U JP S6435755U JP 13061387 U JP13061387 U JP 13061387U JP 13061387 U JP13061387 U JP 13061387U JP S6435755 U JPS6435755 U JP S6435755U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- semiconductor device
- mounting portion
- semiconductor
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 2
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13061387U JPS6435755U (fi) | 1987-08-26 | 1987-08-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13061387U JPS6435755U (fi) | 1987-08-26 | 1987-08-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6435755U true JPS6435755U (fi) | 1989-03-03 |
Family
ID=31385941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13061387U Pending JPS6435755U (fi) | 1987-08-26 | 1987-08-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6435755U (fi) |
-
1987
- 1987-08-26 JP JP13061387U patent/JPS6435755U/ja active Pending